Chemical mechanical polishing pad, polishing layer analyzer and method

US9737971B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9737971-B2
Application numberUS-201614993882-A
CountryUS
Kind codeB2
Filing dateJan 12, 2016
Priority dateJan 12, 2016
Publication dateAug 22, 2017
Grant dateAug 22, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

First claim

Opening claim text (preview).

We claim: 1. A chemical mechanical polishing pad, polishing layer analyzer, comprising: a magazine for holding a plurality of polymeric sheets, wherein each polymeric sheet (i) comprises: a polymer microelement composite, comprising: a polymer and a plurality of microelements, wherein the plurality of microelements are dispersed in the polymer; and, (ii) has a thickness, T S , between a transmission surface and an impinging surface; wherein the transmission surface and the impinging surface are substantially parallel; a sequencer; a light source, wherein the light source emits a beam having a luminescence spectrum exhibiting an emission peak wavelength of 460 to 490 nm and a full width at half max, FWHM, of ≦50 nm; a light detector; a digital image data acquisition device coupled to the light detector; and, an image data processing unit coupled to the digital image data acquisition device; wherein the sequencer is configured to extract from the magazine and convey the plurality of polymeric sheets, one polymeric sheet at a time, to a position interposed between the light source and the light detector; wherein the beam emitted from the light source is oriented to impinge on the impinging surface; and, wherein the light detector is oriented to detect a transmitted light from the beam that is transmitted through the thickness, T S , and out the transmission surface; wherein the light detector is configured to convert an intensity of the transmitted light into an electrical signal; wherein the digital image data acquisition device coupled to the light detector is configured to covert the electrical signal from the light detector into a digital signal; wherein the image data processing unit coupled to the digital image data acquisition device is configured to process the digital signal from the digital image data acquisition device to detect macro inhomogeneities and to classify polymeric sheets as either acceptable for use as a polishing layer in a chemical mechanical polishing pad, or as suspect; wherein the plurality of polymeric sheets is divided into a population of acceptable sheets and a population of suspect sheets. 2. The chemical mechanical polishing pad, polishing layer analyzer of claim 1 , wherein the sequencer is further configured to return the plurality of polymeric sheets to the magazine. 3. The chemical mechanical polishing pad, polishing layer analyzer of claim 2 , wherein the magazine has a design capacity for holding at least 10 polymeric sheets. 4. The chemical mechanical polishing pad, polishing layer analyzer of claim 1 , further comprising: a display to facilitate visual inspection of the plurality of polymeric sheets. 5. A method for analyzing polymeric sheets for suitability as a polishing layer in a chemical mechanical polishing pad, comprising: providing a plurality of polymeric sheets, wherein each polymeric sheet (i) comprises: a polymer microelement composite, comprising: a polymer and a plurality of microelements, wherein the plurality of microelements are dispersed in the polymer; and, (ii) has a thickness, T S , between a transmission surface and an impinging surface; wherein the transmission surface and the impinging surface are substantially parallel; providing an automated inspection system, comprising: a light source, wherein the light source emits a beam having a luminescence spectrum exhibiting an emission peak wavelength of 460 to 490 nm and a full width at half max, FWHM, of ≦50 nm; a light detector; a digital image data acquisition device; and, an image data processing unit; conveying the plurality of polymeric sheets, one at a time, between the light source and the light detector; wherein the beam emitted from the light source is oriented to impinge on the impinging surface; and, wherein the light detector is oriented to detect a transmitted light from the beam that is transmitted through the thickness, T S , and out the transmission surface; wherein the transmitted light has at least one detectable property; wherein the at least one detectable property includes an intensity of the transmitted light; wherein the intensity of the transmitted light is converted into an electrical signal by the light detector; wherein the electrical signal from the light detector is converted into a digital signal by the digital image data acquisition device; and, wherein the digital signal from the digital image data acquisition device is processed by the image data processing unit, wherein the image data processing unit is configured to detect macro inhomogeneities and to classify polymeric sheets as either acceptable or suspect; and, wherein the plurality of polymeric sheets is divided into a population of acceptable sheets and a population of suspect sheets. 6. The method of claim 5 , further comprising: choosing a select sheet from the population of suspect sheets. 7. The method of claim 6 , wherein the automated inspection system, further comprises: a display; wherein an image of the select sheet is displayed on the display. 8. The method of claim 7 , further comprising: performing a visual inspection of the select sheet, wherein the visual inspection is facilitated by the image of the select sheet displayed on the display; and, either (i) reclassifying the select sheet, based on the visual inspection, as acceptable, wherein the select sheet is then added to the population of acceptable sheets; or, (ii) classifying the select sheet, based on the visual inspection, as a defective, wherein the select sheet is then added to a population of defective sheets. 9. The method of claim 5 , further comprising: forming a polishing surface by machining at least one groove into an acceptable sheet to form a groove pattern; wherein the groove pattern is adapted for polishing a substrate; and, incorporating the acceptable sheet into the chemical mechanical polishing pad as the polishing layer.

Assignees

Inventors

Classifications

  • characterised by a multi-layered structure · CPC title

  • B24B37/013Primary

    Devices or means for detecting lapping completion · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9737971B2 cover?
A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
Who is the assignee on this patent?
Rohm & Haas Elect Materials Cmp Holdings Inc, Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification B24B37/013. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 22 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).