Electromagnetic resonant coupler and high-frequency transmission device

Patent metadata

Field	Value
Publication number	US-9735456-B2
Application number	US-201414783617-A
Country	US
Kind code	B2
Filing date	Apr 14, 2014
Priority date	Apr 15, 2013
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A high-frequency transmission device includes first and second resonators as ring-shaped wires each having an opening part at a part thereof, first and second input/output terminals each electrically connected to both resonators, a first ground shield formed on a plane different from planes on which both resonators are arranged, a second ground shield formed on a plane different from the planes on which both resonators and the first ground shield are arranged, and first and second ground wires each formed to surround peripheries of both resonators. The ground shields and the ground wires are respectively connected to each other. A dielectric wire is present between both ground wires, and the ground wires are not electrically connected to each other.

First claim

The invention claimed is:

1. A high-frequency transmission device comprising a substrate, an electromagnetic resonant coupler, a transmission circuit, and a receiver circuit, wherein
the electromagnetic resonant coupler includes a first resonant wire arranged on the substrate and electrically connected to the transmission circuit, and a second resonant wire electrically connected to the receiver circuit and arranged on the substrate to oppose the first resonant wire,
the transmission circuit includes a high-frequency signal generation unit that is arranged on the substrate and that generates a high-frequency signal,
the transmission circuit is arranged on the substrate, generates a high-frequency transmission signal by modulating an input signal by the high-frequency signal generated by the high-frequency signal generating unit, and sends the generated high-frequency transmission signal to the first resonant wire,
the first resonant wire transmits the high-frequency transmission signal sent from the transmission circuit, to the second resonant wire,
the receiver circuit rectifies the high-frequency transmission signal transmitted to the second resonant wire, generates an output signal corresponding to the input signal,
the receiver circuit is arranged on a main surface of the substrate, and
the receiver circuit is arranged in a region on the main surface of the substrate immediately above a region where the electromagnetic resonant coupler is arranged.

2. The high-frequency transmission device according to claim 1 , wherein the transmission circuit is arranged in a region on the main surface of the substrate at a position other than a region immediately above a region where the electromagnetic resonant coupler is arranged.

3. The high-frequency transmission device according to claim 2 , wherein
the transmission circuit is arranged on the main surface of the substrate, and
a heat dissipation structure is arranged below the transmission circuit.

4. The high-frequency transmission device according to claim 2 , wherein the transmission circuit and the receiver circuit are integrated in one semiconductor chip, and is arranged on the main surface of the substrate.

5. The high-frequency transmission device according to claim 1 , wherein an electric field shielding unit is arranged between the electromagnetic resonant coupler and the receiver circuit.

6. The high-frequency transmission device according to claim 1 , wherein a metal wall is arranged around the electromagnetic resonant coupler.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Kawai Yasufumi
• Nagai Shuichi
• Ueda Daisuke

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title