Chip resistor and electronic equipment having resistance circuit network

Patent metadata

Field	Value
Publication number	US-9735225-B2
Application number	US-201514956939-A
Country	US
Kind code	B2
Filing date	Dec 2, 2015
Priority date	Sep 29, 2011
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

First claim

What is claimed is:

1. A chip part, comprising:
a substrate of substantially rectangular parallelepiped shape having an element forming surface and a plurality of side surfaces orthogonal thereto, corner portions at which the plurality of side surfaces intersect having round shapes;
an element formed on the element forming surface of the substrate, and including a resistance formed as a thin film resistor body formed on the substrate;
a plurality of wiring films connected to the element, the wiring films forming wiring connected to the resistance, portions of the thin film resistor body and the wiring films being used as a fuse element;
a plurality of external connection electrodes formed on the element forming surface of the substrate; and
a protective film formed on the substrate so as to cover the element and the wiring films, the corner portions of the protective film having round shapes.

2. The chip part according to claim 1 , wherein the protective film also covers the side surface of the substrate.

3. The chip part according to claim 1 , further comprising a resin film covering an upper surface of the protective film.

4. The chip part according to claim 3 , wherein
the external connection electrodes are connected to the wiring films via penetrating holes penetrating through the resin film and the protective film.

5. The chip part according to claim 3 , wherein
the resin film is made of a sheet and protrudes beyond the protective film at the side surfaces.

6. The chip part according to claim 1 , wherein
a recess or a projection is formed on at least one of the side surfaces.

7. A method for manufacturing a chip part comprising:
forming an element including a resistance as a thin film resistor body on an element forming surface of a substrate;
forming a plurality of wiring films so as to be connected to the resistance;
forming a plurality of external connection electrodes on the element forming surface of the substrate;
using plasma etching to form, on the substrate, a plurality of side surfaces that are orthogonal to the element forming surface and shape corner portions at which the plurality of side surfaces intersect to round shapes; and
forming a protective film on the substrate so as to cover the element and the wiring films and to form round shapes at the corner portions of the protective film, wherein
portions of the thin film resistor body and the wiring films are used as a fuse element.

8. A method for manufacturing a chip part, comprising:
forming an element including a resistance as a thin film resistor body on an element forming surface of a substrate;
forming a plurality of wiring films so as to be connected to the resistance;
forming a plurality of external connection electrodes on the element forming surface of the substrate;
forming, on the substrate, a plurality of side surfaces that are orthogonal to the element forming surface and shaping corner portions at which the plurality of side surfaces intersect to round shapes; and
forming a protective film on the substrate so as to cover the element and the wiring films and to form round shapes at the corner portions of the protective film, wherein portions of the thin film resistor body and the wiring films are used as a fuse element.

9. A chip part, comprising:
a substrate of substantially rectangular parallelepiped shape having an element forming surface and a plurality of side surfaces orthogonal thereto, corner portions at which the plurality of side surfaces intersect having round shapes;
an element formed on the element forming surface of the substrate;
a plurality of wiring films connected to the element;
a plurality of external connection electrodes formed on the element forming surface of the substrate;
a protective film formed on the substrate so as to cover the element and the wiring films, the corner portions of the protective film having round shapes; and
a resin film covering an upper surface of the protective film,
the external connection electrodes being connected to the wiring films via penetrating holes penetrating through the resin film and the protective film.

10. The chip part according to claim 9 , wherein
the element includes a resistance formed as a thin film resistor body formed on the substrate and
the wiring films form wiring connected to the resistance.

11. The chip part according to claim 10 , wherein
portions of the thin film resistor body and the wiring films are used as a fuse element.

12. The chip part according to claim 9 , wherein
the protective film also covers the side surface of the substrate.

13. The chip part according to claim 9 , wherein
a recess or a projection is formed on at least one of the side surfaces.

14. A chip part, comprising:
a substrate of substantially rectangular parallelepiped shape having an element forming surface and a plurality of side surfaces orthogonal thereto, corner portions at which the plurality of side surfaces intersect having round shapes;
an element formed on the element forming surface of the substrate;
a plurality of wiring films connected to the element;
a plurality of external connection electrodes formed on the element forming surface of the substrate;
a protective film formed on the substrate so as to cover the element and the wiring films, the corner portions of the protective film having round shapes; and
a resin film covering an upper surface of the protective film, the resin film being made of a sheet and protruding beyond the protective film at the side surfaces.

15. The chip part according to claim 14 , wherein
the element includes a resistance formed as a thin film resistor body formed on the substrate and
the wiring films form wiring connected to the resistance.

16. The chip part according to claim 15 , wherein
portions of the thin film resistor body and the wiring films are used as a fuse element.

17. The chip part according to claim 14 , wherein
the protective film also covers the side surface of the substrate.

18. The chip part according to claim 14 , wherein
a recess or a projection is formed on at least one of the side surfaces.

Assignees

• Rohm Co Ltd

Inventors

• Tamagawa Hiroshi
• Kondo Yasuhiro
• Fuwa Yasuhiro
• Okada Hiroyuki
• Nukaga Eiji
• Matsuura Katsuya

Classifications

• H10P50/693

  characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H05K2201/10674

  Flip chip · CPC title

• H01C13/02

  Structural combinations of resistors · CPC title

• H05K3/3431

  Leadless components · CPC title