Electronic module and fabrication method thereof

Patent metadata

Field	Value
Publication number	US-9735075-B2
Application number	US-201414516010-A
Country	US
Kind code	B2
Filing date	Oct 16, 2014
Priority date	Sep 3, 2014
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed.

First claim

What is claimed is:

1. An electronic module, comprising:
an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface connecting the active and inactive surfaces;
a passivation layer formed on the active surface with the electrode pads exposed from the passivation layer;
a strengthening layer formed on the side surface of the electronic element and being free from being formed on the passivation layer on the active surface of the electronic element; and
an RDL structure formed on and in direct contact with the strengthening layer and the passivation layer on the active surface of the electronic element and electrically connected to the electrode pads of the electronic element.

2. The module of claim 1 , wherein the electronic element is bonded to a packaging substrate via the active surface thereof.

3. The module of claim 1 , wherein the strengthening layer is further formed on the inactive surface of the electronic element.

4. The module of claim 1 , wherein the strengthening layer is formed around the side surface of the electronic element.

5. The module of claim 1 , wherein the strengthening layer is made of an insulating material.

6. The module of claim 1 , further comprising a separation portion formed on the strengthening layer on the side surface of the electronic element in a manner that the strengthening layer is sandwiched between the side surface of the electronic element and the separation portion.

7. The module of claim 6 , wherein the separation portion has a width less than 1 mm.

8. The module of claim 6 , wherein the RDL structure is further formed on the separation portion.

9. The module of claim 1 , further comprising a plurality of conductive elements formed on the RDL structure and electrically connected to the electrode pads of the electronic element.

Assignees

• Siliconware Precision Industries Co Ltd

Inventors

• Chen Lu-Yi
• Lu Chang-Lun
• Chen Shih-Ching

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W74/014

  using batch processing · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title