Wireless sensor platform

Patent metadata

Field	Value
Publication number	US-9729193-B2
Application number	US-201414538219-A
Country	US
Kind code	B2
Filing date	Nov 11, 2014
Priority date	Nov 11, 2014
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A wireless sensor platform and methods of manufacture are provided. The platform involves providing a plurality of wireless sensors, where each of the sensors is fabricated on flexible substrates using printing techniques and low temperature curing. Each of the sensors can include planar sensor elements and planar antennas defined using the printing and curing. Further, each of the sensors can include a communications system configured to encode the data from the sensors into a spread spectrum code sequence that is transmitted to a central computer(s) for use in monitoring an area associated with the sensors.

First claim

What is claimed is:

1. A wireless sensor, comprising:
a flexible substrate formed of at least one of a paper material and a fabric material having at least one surface that is electrically insulating; and
a plurality of components disposed on the at least one surface, the plurality of components comprising a communications system, at least one sensor device communicatively coupled to the communications system, and at least one antenna electrically coupled to the communications system;
wherein each of the at least one sensor device and the at least one antenna is a planar device fabricated using ink during an ink printing process performed by an ink printing machine, the ink defining high conductivity printed metal lines;
wherein the communications system receives sensor signals from the at least one sensor device, encodes the sensor signals into a bit sequence via code shift keying using a spread spectrum coding, and transmits the bit sequence; and
wherein the communications system comprises a transmitter power equal to 10 milliwatts and a range of over 5 miles that are at least partially enabled using a pulse thermal processing (“PTP”) curing process to cure the high conductivity printed metal lines at a low thermal budget on the flexible substrate with a processing temperature less than or equal to 200° C.

2. The wireless sensor of claim 1 , wherein the communications system is configured for performing the encoding by:
combining at least a portion of the sensor signals into an n-bit word; and
generating the bit sequence using a linear feedback shift register (LFSR) using the n-bit word as a seed;
wherein a feedback arrangement for the LFSR is selected to provide a Gold code.

3. The wireless sensor of claim 1 , wherein the communications system is configured for performing the encoding by:
combining at least the portion of the sensor signals into a plurality of n-bit words; and
generating the bit sequence via an exclusive-ORing of the output of a plurality of linear feedback shift registers (LFSRs);
wherein each of the plurality LFSRs using one of the plurality n-bit words as the seed;
wherein a feedback arrangement for the plurality of LFSRs is selected to provide a Gold code.

4. The wireless sensor of claim 1 , wherein the at least one antenna comprises one of an inverted F-antenna or an L-shaped antenna.

5. The wireless sensor of claim 1 , wherein the at least one sensor device comprises at least one of a resistive temperature sensor, a capacitive humidity sensor, or a resistive strain gauge sensor.

6. The wireless sensor of claim 1 , wherein each of the at least one sensor device comprises one of an active sensor or a passive sensor.

7. The wireless sensor of claim 1 , wherein the at least one sensor device comprises a plurality of printed features.

8. The wireless sensor of claim 7 , wherein the plurality of printed features comprise printed lines with a line width between about 1 μm and 100 μm.

9. The wireless sensor of claim 1 , wherein the plurality of printed features are disposed over at least two of the at least one surface.

10. The wireless sensor of claim 1 , wherein the code shift keying is achieved by:
encoding a first portion of seed data using a first linear feedback shift register to generate first encoded data;
encoding a second different portion of the seed data using a second linear feedback shift register to generate second encoded data; and
combining the first and second encoded data together using an exclusive OR gate to generate the bit sequence.

11. A method of fabricating a sensor device, comprising:
providing a flexible substrate formed of a paper material or a fabric material having at least one surface that is electrically insulating;
forming at least one planar sensor and at least one antenna on the flexible substrate using an ink printing machine that performs an ink printing process to print ink on the at least one surface;
performing a pulse thermal processing (“PTP”) curing process to cure the ink;
mounting one or more discrete components on the at least one surface; and
electrically coupling a communications system to the at least one planar sensor and the at least one antenna;
wherein discrete components define at least the communications system for receiving sensor signals from the at least one planar sensor and for transmitting a bit sequence based on the sensor signals via the at least one antenna;
wherein the communications system comprises a transmitter power equal to 10 milliwatts and a range over 5 miles that are at least partially enabled using the PTP curing process to cure the high conductivity printed metal lines at a low thermal budget on the flexible substrate with a processing temperature less than or equal to 200° C.; and
wherein the ink printing process is selected so as to limit thermal damage to the flexible substrate.

12. The method of claim 11 , wherein the ink printing process comprises an inkjet printing process, a stencil printing process, or screen printing process.

13. The method of claim 12 , wherein the ink printing process is configured to provide line widths between about 1 μm and 100 μm.

14. The method of claim 12 , wherein the ink printing process comprises a multi-pass printing process, and each pass of the multi-pass printing process is selected to add a width between about 0.1 μm and 10 μm.

15. The method of claim 11 , wherein the PTP curing process provides at least one pulse having a peak pulse energy of about 20 kW/cm 2 and a pulse width between about 20 microseconds and 20 milliseconds.

16. The method of claim 11 , wherein the PTP curing process provides at least one pulse that is ramped up or down using at least one step.

17. The method of claim 11 , wherein the PTP curing process comprises applying the at least one pulse using a broadband PTP spectrum source.

18. The method of claim 17 , further comprising filtering the broadband PTP spectrum source.

Assignees

• Ut Battelle Llc

Inventors

• Joshi Pooran C
• Killough Stephen M
• Kuruganti Phani Teja

Classifications

• H05K3/125

  by ink-jet printing · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H05K2201/09263

  Meander · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title