Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

Patent metadata

Field	Value
Publication number	US-9728519-B2
Application number	US-201514710070-A
Country	US
Kind code	B2
Filing date	May 12, 2015
Priority date	Oct 30, 2014
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

According to one embodiment, there is provided a bonding method of a semiconductor chip. The bonding method includes arranging an activated front surface of a semiconductor chip and an activated front surface of a substrate so as to face each other with a back surface of the semiconductor chip attached to a sheet. The bonding method includes pushing the back surface of the semiconductor chip through the sheet to closely attach the activated front surface of the semiconductor chip and the activated front surface of the substrate. The bonding method includes stripping the sheet from the back surface of the semiconductor chip while maintaining a state in which the activated front surface of the semiconductor chip is closely attached to the activated front surface of the substrate.

First claim

What is claimed is:

1. A mounting apparatus for a chip comprising:
an arrangement mechanism configured to arrange a front surface of the chip and a front surface of a substrate so as to face each other in a state where a back surface of the chip is attached to a sheet with elasticity, the sheet having a first portion and a second portion, the first portion corresponding to the chip, and the second portion being arranged at a periphery of the first portion in the sheet when seen in a direction perpendicular to the front surface of the substrate;
a holding mechanism capable of moving in a direction that is not perpendicular to the front surface of the substrate so as to be arranged to hold the second portion of the sheet; and
a pushing mechanism configured to push the back surface of the chip through the first portion of the sheet to attach the front surface of the chip to the front surface of the substrate with the first portion elastically deformed in a state where the second portion is held by the holding mechanism, and configured to strip the sheet from the back surface of the chip while maintaining a state in which the front surface of the chip is attached to the front surface of the substrate, by releasing the pushing force to mechanism from the first portion of the sheet.

2. The mounting apparatus for the chip according to claim 1 , wherein the pushing mechanism includes:
a pushing head including a pushing surface corresponding to the back surface of the chip, and
a pin configured to retract from the pushing surface and to project from the pushing surface.

3. The mounting apparatus for the chip according to claim 2 , wherein the pushing head includes a buffer member on the pushing surface.

4. The mounting apparatus for the chip according to claim 2 , wherein the pushing mechanism further includes a driving unit which causes the pin to retract from the pushing surface and to project from the pushing surface.

5. The mounting apparatus for the chip according to claim 1 , further comprising:
a recognition mechanism configured to recognize the substrate and the chip; and
an alignment mechanism configured to align relative positions of the chip and the substrate based on a recognition result of the recognition mechanism,
wherein the pushing mechanism pushes the back surface of the chip through the first portion of the sheet with the relative positions of the chip and the substrate aligned.

6. The mounting apparatus according to claim 1 , wherein the holding mechanism includes a suctioning structure which suctions the second portion of the sheet.

7. The mounting apparatus according to claim 1 , wherein the arrangement mechanism includes:
a substrate stage which can position the substrate, and
a sheet stage which can position the chip attached to the sheet,
wherein the substrate stage and the sheet stage are controlled to be driven independently from each other.

8. The mounting apparatus according to claim 7 , wherein the sheet stage is configured to be able to hold a flat ring which can fix the sheet stage where the chip is attached.

9. The mounting apparatus of the chip according to claim 1 , wherein the chip is arranged face down above the substrate by the arrangement mechanism.

10. A mounting apparatus for a chip comprising:
an arrangement mechanism configured to arrange a front surface of a chip and a front surface of a substrate so as to face each other in a state where a back surface of the chip is attached to a sheet with elasticity, the sheet having a first portion and a second portion, the first portion corresponding to the chip, and the second portion being arranged at a periphery of the first portion in the sheet when seen in a direction perpendicular to the front surface of the substrate;
a holding mechanism capable of moving in a direction that is not perpendicular to the front surface of the substrate so as to be arranged to hold the second portion of the sheet; and
a pushing mechanism configured to push the back surface of the chip through the first portion of the sheet to attach the front surface of the chip to the front surface of the substrate with the first portion elastically deformed in a state where the second portion is held by the holding mechanism, and configured to strip the sheet from the back surface of the chip, by releasing the pushing force to mechanism from the first portion of the sheet,
wherein the pushing mechanism includes:
a pushing head including a pushing surface corresponding to the back surface of the chip; and
a pin configured to retract from the pushing surface and to project from the pushing surface.

11. The mounting bonding apparatus for the chip according to claim 10 , wherein the pushing head includes a buffer member on the pushing surface.

12. The mounting apparatus for the chip according to claim 10 , wherein the pushing mechanism further includes a driving unit which causes the pin to retract from the pushing surface and to project from the pushing surface.

13. The mounting apparatus of the chip according to claim 10 , wherein the chip is arranged face down above the substrate by the arrangement mechanism.

14. A mounting apparatus comprising:
an arrangement mechanism configured to arrange front surfaces of a plurality of chips and a front surface of a substrate so as to face each other in a state where back surfaces of the chips are attached to a sheet with elasticity, the sheet having a first portion and a second portion, the first portion corresponding to a selected one of the chips, and the second portion being arranged at a periphery of the first portion in the sheet when seen in a direction perpendicular to the front surface of the substrate;
a holding mechanism capable of moving in a direction that is not perpendicular to the front surface of the substrate so as to be arranged to hold the second portion of the sheet; and
a pushing mechanism configured to push the back surface of the selected one of the chips through the first portion of the sheet to attach the front surface of the one of the chips to the front surface of the substrate with the first portion elastically deformed in a state where the second portion is held by the holding mechanism, and configured to strip the sheet from the back surface of the one of the chips, by releasing the pushing force to mechanism from the first portion of the sheet.

15. The mounting apparatus for the chip according to claim 14 , wherein the pushing mechanism includes:
a pushing head including a pushing surface corresponding to the back surface of the one of the chips, and
a pin configured to retract from the pushing surface and to project from the pushing surface.

16. The mounting bonding apparatus for the chip according to claim 15 , wherein the pushing head includes a buffer member on the pushing surface.

17. The mounting apparatus for the chip according to claim 15 , wherein the pushing mechanism further includes a driving unit which causes the pin to retract from the pushing surface and to project from the pushing surface.

18. The mounting apparatus of the chip according to claim 14 , wherein the chips are arranged face down above the substrate by the arrangement mechanism.

Assignees

• Toshiba Kk

Inventors

• Kurita Yoichiro

Classifications

• H10W72/0198

  batch processes · CPC title

• H10P70/30

  Cleaning after the substrates have been singulated · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07183

  Means for monitoring · CPC title

• H10W72/07178

  Means for aligning · CPC title