System for non radial temperature control for rotating substrates

Patent metadata

Field	Value
Publication number	US-9728471-B2
Application number	US-201414247816-A
Country	US
Kind code	B2
Filing date	Apr 8, 2014
Priority date	May 2, 2008
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume.

First claim

The invention claimed is:

1. A method for processing a substrate, comprising:
placing a substrate on an edge ring disposed in a processing volume of a processing chamber;
rotating the substrate and the edge ring;
heating the substrate by directing radiant energy towards the substrate from a first heating source;
heating the edge ring by directing pulsed energy from a second heating source towards the edge ring;
measuring temperature of at least one of the edge ring and the substrate; and
adjusting at least one of frequency, phase and amplitude of the second heating source according to the measured temperature, wherein measuring the temperature comprises sampling a sensor directed at the substrate or the edge ring at a frequency higher than the frequency of substrate rotation by multiple times.

2. The method of claim 1 , further comprising: determining temperature variations within the edge ring or the substrate from the temperature measurements, wherein adjusting at least one of the frequency, phase and amplitude of the pulse heat source according to the determined temperature variations.

3. A method for processing a substrate, comprising:
placing a substrate on an edge ring disposed in a processing volume of a processing chamber;
rotating the substrate and the edge ring;
heating the substrate by directing radiant energy towards the substrate from a first heating source;
heating the edge ring by directing pulsed energy from a second heating source towards the edge ring;
measuring temperature of at least one of the edge ring and the substrate; and
adjusting at least one of frequency, phase and amplitude of the second heating source according to the measured temperature, wherein the second heating source has the same frequency as the frequency of substrate rotation, and adjusting the second heating source comprises striking a peak power level of the second heating source toward a point with a lowest temperature within the edge ring.

Assignees

• Applied Materials Inc

Inventors

• Aderhold Wolfgang R
• Hunter Aaron
• Ranish Joseph M

Classifications

• H10P95/90 Primary

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P74/20

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P74/238 Primary

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title