Method of fabricating semiconductor device

Patent metadata

Field	Value
Publication number	US-9728446-B2
Application number	US-201514938941-A
Country	US
Kind code	B2
Filing date	Nov 12, 2015
Priority date	Dec 16, 2013
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %. hydroxide based on a total weight of the cleaning composition and deionized water.

First claim

What is claimed is:

1. A method of fabricating a semiconductor device, the method comprising:
forming a first structure including an insulating layer on a substrate and a first recess region in the insulating layer;
forming an organic layer on the first structure to fill the first recess region;
performing a polishing process to remove at least a portion of the organic layer; and
performing a cleaning process using the cleaning composition including:
0.01 to 5 wt. % hydroxide based on a total weight of the cleaning composition; and
deionized water,

wherein the hydroxide is at least one of tetramethylammonium hydroxide (TMAH), ammonium hydroxide (NH 4 OH), lithium hydroxide (LiOH), sodium hydroxide (NaOH), potassium hydroxide (KOH), rubidium hydroxide (RbOH), or cesium hydroxide (CsOH).

2. The method as claimed in claim 1 , wherein:
the cleaning composition further includes 0.1 to 10 wt. % of an organic solvent based on a total weight of the cleaning composition, and
the organic solvent is at least one selected from the group of hydrocarbon-containing, halogenated hydrocarbon-containing, ester-containing, ether-containing, acetate-containing, glycol-containing, alcohol-containing, ketone-containing, amide-containing, aldehyde-containing, and amine-containing organic solvents.

3. The method as claimed in claim 1 , wherein:
the cleaning composition further includes 0.1 to 10 wt. % of an organic acid based on a total weight of the cleaning composition, and
the organic acid is at least one selected from the group of citric acid, lactic acid, acetic acid, formic acid, oxalic acid, uric acid, fumaric acid, tartaric acid, glutamic acid, malic acid, phthalic acid, levulinic acid, stearic acid, benzoic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, and sebacid acid.

4. The method as claimed in claim 1 , wherein:
the cleaning composition further includes 0.1 to 10 wt. % of an amino acid based on a total weight of the cleaning composition, and
the amino acid is at least one selected from the group of alanine, arginine, asparagine, aspartic acid, cysteine, glutamic acid, glutamine, glycine, histidine, isoleucine, leucine, lysine, methionine, phenylalanine, proline, serine, threonine, tryptophan, tyrosine, and valine.

5. The method as claimed in claim 1 , wherein the cleaning composition has a pH of 5 or higher.

6. The method as claimed in claim 1 , wherein performing the cleaning process comprises removing an organic residue produced in or after the polishing process.

7. The method as claimed in claim 1 , wherein:
the polishing process exposes a top surface of the first structure and forms an organic pattern in the first recess region, and the first recess region is a first hole exposing the substrate, and
the method further comprises:
forming a second structure on the first structure after the cleaning process, the second structure being formed to have a second hole exposing a top surface of the organic pattern;
removing the organic pattern that is exposed by the second hole through the second hole;
forming an active pillar to cover at least sidewalls of the first and second holes; and
forming conductive lines in the first and second structures.

8. The method as claimed in claim 7 , wherein each of the first and second structures is formed to include a plurality of insulating layers and a plurality of sacrificial layers that are alternatingly stacked on the substrate, and
the forming of the conductive lines in the first and second structures includes:
selectively removing the sacrificial layers to form gap regions; and
forming the conductive lines in the gap regions.

9. The method as claimed in claim 1 , wherein:
the first structure further includes an etch-target layer provided on the substrate, and a plurality of first mask patterns provided parallel to each other on the etch-target layer,
the insulating layer conformally covers top and side surfaces of the mask patterns and defining the first recess region between the mask patterns,
the polishing process exposes a top surface of the insulating layer and forms an organic pattern in the first recess region, and
the method further comprises anisotropically etching the insulating layer to form a second mask pattern below the organic pattern.

10. A method for removing an organic residue from a hydrocarbon layer or organic layer, the method comprising:
providing a cleaning composition including:
0.01 to 5 wt. % hydroxide based on a total weight of the cleaning composition; and
deionized water; and

polishing the hydrocarbon or organic layer, the organic residue is produced in or after the polishing process;
cleaning the hydrocarbon or organic layer to remove the organic residue using the cleaning composition,
wherein the hydroxide is at least one of tetramethylammonium hydroxide (TMAH), ammonium hydroxide (NH 4 OH), lithium hydroxide (LiOH), sodium hydroxide (NaOH), potassium hydroxide (KOH), rubidium hydroxide (RbOH), or cesium hydroxide (CsOH).

11. The method as claimed in claim 10 , wherein the cleaning involves use of an ultrasonic wave.

12. The method as claimed in claim 10 , wherein the cleaning involves use of a brush.

13. The method as claimed in claim 10 , further comprising:
after the cleaning, treating the hydrocarbon or organic layer with deionized water; and
drying the hydrocarbon layer or organic layer using argon, nitrogen, or isopropyl alcohol.

14. The method as claimed in claim 10 , wherein:
the cleaning composition further includes 0.1 to 10 wt. % of an organic solvent based on a total weight of the cleaning composition, and
the organic solvent is at least one selected from the group of hydrocarbon-containing, halogenated hydrocarbon-containing, ester-containing, ether-containing, acetate-containing, glycol-containing, alcohol-containing, ketone-containing, amide-containing, aldehyde-containing, and amine-containing organic solvents.

15. The method as claimed in claim 10 , wherein:
the cleaning composition further includes 0.1 to 10 wt. % of an organic acid based on a total weight of the cleaning composition, and
the organic acid is at least one selected from the group of citric acid, lactic acid, acetic acid, formic acid, oxalic acid, uric acid, fumaric acid, tartaric acid, glutamic acid, malic acid, phthalic acid, levulinic acid, stearic acid, benzoic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, and sebacid acid.

16. The method as claimed in claim 10 , wherein:
the cleaning composition further includes 0.1 to 10 wt. % of an amino acid based on a total weight of the cleaning composition, and
the amino acid is at least one selected from the group of alanine, arginine, asparagine, aspartic acid, cysteine, glutamic acid, glutamine, glycine, histidine, isoleucine, leucine, lysine, methionine, phenylalanine, proline, serine, threonine, tryptophan, tyrosine, and valine.

17. The method as claimed in claim 10 , wherein the cleaning composition has a pH of 5 or higher.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kang Ingoo
• Kang Dong-Min
• Kim Sangkyun
• Kim Yun-Jeong
• Choi Jungsik
• Hong Young Taek

Classifications

• H10P95/08

  Planarisation of organic insulating materials · CPC title

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P70/237

  the processing being a planarisation of insulating layers · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P50/71

  using masks for conductive or resistive materials · CPC title