Single use rinse in a linear Marangoni drier

Patent metadata

Field	Value
Publication number	US-9728428-B2
Application number	US-201313932698-A
Country	US
Kind code	B2
Filing date	Jul 1, 2013
Priority date	Jul 1, 2013
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

An apparatus for drying of wet substrates in a post CMP cleaning apparatus is provided. The apparatus provides a waterfall or shallow reservoir of rinsing solution, such as DIW, through which a substrate may be lifted. A solvent vapor may be provided at the rinsing solution interface on the substrate, such as in a Marangoni process. In certain embodiments, the volume of solution through which the substrate is lifted is reduced, which may provide for reduced or eliminated particle reattachment to the substrate.

First claim

The invention claimed is:

1. An apparatus for rinsing and drying a substrate, comprising:
a body defining a volume configured to accommodate a semiconductor substrate;
one or more reservoir members comprising a weir, the one or more reservoir members coupled to one or more rinse fluid sources and to the body having a substrate passage disposed therethrough, wherein the substrate passage is sized to allow passage of a substrate, the substrate passage allowing the reservoir members to provide a waterfall of rinse fluid from the one or more rinse fluid sources through the substrate passage into a lower portion of the volume;
a plurality of nozzles positioned to provide rinse fluid for coverage across an area of the substrate below the one or more reservoir members;
a plurality of solvent spray members positioned to provide a drying agent above the one or more reservoir members, and
a fluid collection member spaced from the body and below the body and extending outward beyond the body such that the volume is open to a region external to the body and rinse fluid does not collect in the volume, wherein the fluid collection member is adapted to collect rinse fluid that flows over the weir and rinse fluid that flows through the substrate passage.

2. The apparatus of claim 1 , further comprising a guide member disposed in the volume and adapted to control an elevation of the substrate within the volume.

3. The apparatus of claim 2 , wherein the guide member is coupled to the body in a manner such that the substrate remains above rinse fluid collected within the fluid collection member.

4. The apparatus of claim 1 , wherein the one or more reservoir members further comprise:
a first reservoir member and a second reservoir member coupled to the body, wherein the first reservoir member and the second reservoir member face one another.

5. The apparatus of claim 4 , further comprising a guide member adapted to pass the substrate between the first and second reservoir members.

6. The apparatus of claim 1 , wherein the rinse fluid sources are configured to provide de-ionized water to the volume.

7. The apparatus of claim 6 , wherein the guide member is adapted to pass the substrate between at least two of the plurality of nozzles.

8. The apparatus of claim 6 , wherein the guide member is adapted to pass the substrate between at least two of the solvent spray members.

9. The apparatus of claim 1 , further comprising an unload port formed in the body above the plurality of solvent spray members.

10. The apparatus of claim 1 , wherein the nozzles are configured to provide a fluid adapted to change a zeta potential of the substrate surface.

11. The apparatus of claim 1 , wherein the substrate passage is configured such that the waterfall of rinse fluid from the one or more rinse fluid sources is precisely controlled at an interface where rinse fluid contacts the substrate to create a meniscus suitable for performing a Marangoni drying process.

Assignees

• Applied Materials Inc

Inventors

• Brown Brian J

Classifications

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0408 Primary

  for drying · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P70/18 Primary

  by combined dry cleaning and wet cleaning (H10P70/52 takes precedence) · CPC title