Organic film composition, process for forming organic film, patterning process, and compound

Patent metadata

Field	Value
Publication number	US-9728420-B2
Application number	US-201615091336-A
Country	US
Kind code	B2
Filing date	Apr 5, 2016
Priority date	May 14, 2015
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

An organic film composition including a compound represented by the following general formula (1),

wherein n1 and n2 each independently represent 0 or 1; “W” represents a single bond or any of structures represented by the following formula (2); R 1 represents any of structures represented by the following general formula (3); m1 and m2 each independently represent an integer of 0 to 7, with the proviso that m1+m2 is 1 to 14.

There can be provided an organic film composition for forming an organic film having dry etching resistance as well as advanced filling/planarizing characteristics.

First claim

What is claimed is:

1. An organic film composition comprising a compound represented by the following general formula (4),

wherein m3 and m4 each independently represent 1 or 2; “W” represents a single bond or any of structures represented by the following formula (2); R 1 represents any of structures represented by the following general formula (3);

wherein “t” represents an integer of 0 to 3; R a to R f each independently represent a hydrogen atom, or an alkyl group having 1 to 10 carbon atoms, a phenyl group, or a phenylethyl group which may be substituted by a fluorine atom, and R a and R b may be bonded to each other to form a ring compound;

wherein “*” represents a bonding site to the aromatic ring; Q 1 represents a linear or branched saturated hydrocarbon group having 1 to 30 carbon atoms, an alicyclic group having 4 to 20 carbon atoms, or a substituted or unsubstituted phenyl group, naphthyl group, anthracenyl group, or pyrenyl group, and the methylene group constituting Q 1 may be substituted by an oxygen atom or a carbonyl group when Q 1 represents a linear or branched saturated hydrocarbon group having 1 to 30 carbon atoms.

2. The organic film composition according to claim 1 , wherein “W” represents a single bond or any of structures represented by the following formula (5),

wherein “t” has the same meaning as defined above.

3. The organic film composition according to claim 2 , the compound represented by the general formula (4) has two or more Q 1 in the molecule, and contains one or more structures represented by the following general formula (6) and one or more structures represented by the following general formula (7) respectively as Q 1 ,
**—R h   (6)

wherein “**” represents a bonding site to the carbonyl group; R h represents a linear or branched saturated hydrocarbon group having 1 to 30 carbon atoms, and the methylene group constituting R h may be substituted by an oxygen atom or a carbonyl group,

wherein “**” represents a bonding site to the carbonyl group; R i represents a hydrogen atom, or a linear or branched hydrocarbon group having 1 to 10 carbon atoms; R j represents a linear or branched hydrocarbon group having 1 to 10 carbon atoms, a halogen atom, a nitro group, an amino group, a nitrile group, an alkoxycarbonyl group having 1 to 10 carbon atoms, or an alkanoyloxy group having 1 to 10 carbon atoms; n3 and n4 represent the numbers of substituents on the aromatic ring, and each represent an integer of 0 to 7, with the proviso that n3+n4 is 0 to 7; n5 represents 0 to 2.

4. The organic film composition according to claim 1 , the compound represented by the general formula (4) has two or more Q 1 in the molecule, and contains one or more structures represented by the following general formula (6) and one or more structures represented by the following general formula (7) respectively as Q 1 ,
**—R h   (6)

wherein “**” represents a bonding site to the carbonyl group; R h represents a linear or branched saturated hydrocarbon group having 1 to 30 carbon atoms, and the methylene group constituting R h may be substituted by an oxygen atom or a carbonyl group,

wherein “**” represents a bonding site to the carbonyl group; R i represents a hydrogen atom, or a linear or branched hydrocarbon group having 1 to 10 carbon atoms; R j represents a linear or branched hydrocarbon group having 1 to 10 carbon atoms, a halogen atom, a nitro group, an amino group, a nitrile group, an alkoxycarbonyl group having 1 to 10 carbon atoms, or an alkanoyloxy group having 1 to 10 carbon atoms; n3 and n4 represent the numbers of substituents on the aromatic ring, and each represent an integer of 0 to 7, with the proviso that n3+n4 is 0 to 7; n5 represents 0 to 2.

5. The organic film composition according to claim 1 , further comprising at least one of (A) an acid generator, (B) a cross-linking agent, (C) a surfactant, and (D) an organic solvent.

6. A process for forming an organic film which acts as a resist under layer film of a multilayer resist film used in lithography or a planarizing film for manufacturing a semiconductor apparatus, comprising:
coating a substrate to be processed with the organic film composition according to claim 1 , and
subjecting the organic film composition to heat treatment at a temperature of 100° C. or higher and 600° C. or lower for 10 to 600 seconds to form a cured film.

7. The process for forming an organic film according to claim 6 , wherein the substrate to be processed is a substrate to be processed having a structure or step(s) each with a height of 30 nm or more.

8. A process for forming an organic film which acts as a resist under layer film of a multilayer resist film used in lithography or a planarizing film for manufacturing a semiconductor apparatus, comprising:
coating a substrate to be processed with the organic film composition according to claim 1 , and
baking the organic film composition under an atmosphere with an oxygen concentration of 0.1% or more and 21% or less to form a cured film.

9. A patterning process which is a process for forming a pattern on a substrate to be processed, comprising at least the steps of:
forming a resist under layer film on the substrate to be processed by using the organic film composition according to claim 1 ;
forming a resist middle layer film on the resist under layer film by using a resist middle layer film composition containing a silicon atom;
forming a resist upper layer film on the resist middle layer film by using a resist upper layer film composition comprising a photoresist composition, to form a multilayer resist film;
forming a resist pattern on the resist upper layer film by exposing a pattern circuit region of the resist upper layer film and then developing the same with a developer;
forming a resist middle layer film pattern by etching the resist middle layer film using the obtained resist pattern as an etching mask;
forming a resist under layer film pattern by etching the resist under layer film using the obtained resist middle layer film pattern as an etching mask; and further
forming a pattern on the substrate to be processed by etching the substrate to be processed using the obtained resist under layer film pattern as an etching mask.

10. The patterning process according to claim 9 , wherein the step of etching the resist under layer film using the resist middle layer film as an etching mask is performed by using an etching gas mainly comprising an oxygen gas or a hydrogen gas.

11. The patterning process according to claim 9 , wherein the substrate to be processed is a substrate to be processed having a structure or step(s) each with a height of 30 nm or more.

12. A patterning process which is a process for forming a pattern on a substrate to be processed, comprising at least the steps of:
forming a resist under layer film on the substrate to be processed by using the organic film composition according to claim 1 ;
forming an inorganic hard mask middle layer film selected from any on

Assignees

• Shinetsu Chemical Co

Inventors

• Kori Daisuke
• Noda Kazumi
• Maeda Kazunori
• Kikuchi Rie
• Ogihara Tsutomu

Classifications

• H10P50/283

  by chemical means · CPC title

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P95/066

  the removal being a selective chemical etching step, e.g. selective dry etching through a mask · CPC title

• H10P95/08

  Planarisation of organic insulating materials · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title