Power cable with a thick insulation layer and a method for its manufacture

US9728300B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9728300-B2
Application numberUS-201414770322-A
CountryUS
Kind codeB2
Filing dateFeb 25, 2014
Priority dateMar 12, 2013
Publication dateAug 8, 2017
Grant dateAug 8, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A power cable comprising a: (A) Conductor, (B) First semiconductor in contact with the conductor; (C) First insulation layer in contact with the first semiconductor; (D) Second semiconductor layer in contact with the first insulation layer; (E) Third semiconductor layer in contact with the second semiconductor layer; (F) Second insulation layer in contact with the third semiconductor layer; and (G) Fourth semiconductor layer in contact with the second insulation layer.

First claim

Opening claim text (preview).

I claim: 1. A method of manufacturing a power cable comprising a conductor, semiconductor layers and insulation layers, the process comprising the steps of: (A) Extruding about the conductor a first insulation layer positioned between first and second semiconductor layers to make an inner power cable comprising: (1) The conductor which is in contact with, (2) A first semiconductor layer which is also in contact with, (3) A first insulation layer which is also in contact with, (4) A second semiconductor layer, and (B) Extruding about the inner power cable a second insulation layer positioned between third and fourth semiconductor layers to make the power cable with a total insulation thickness of greater than or equal to 9 mm, the power cable comprising the inner power cable of which the second semiconductor layer is in contact with: (5) The third semiconductor layer which is also in contact with, (6) The second insulation layer which is also in contact with, (7) The fourth semiconductor layer. 2. The method of claim 1 in which the first insulation layer of the inner power cable is subjected to free radical promoted crosslinking prior to the extrusion of the second insulation layer about the inner power cable. 3. The method of claim 1 in which the first insulation layer of the inner power cable is subjected to moisture-promoted crosslinking prior to the extrusion of the second insulation layer about the inner power cable. 4. The method of claim 1 in which one or more days elapse between the manufacture of the inner power cable and the extrusion of the second insulation layer about the inner power cable.

Assignees

Inventors

Classifications

  • H01B13/141Primary

    of two or more insulating layers · CPC title

  • Operations & Transport · mapped topic

  • with conductive additives or conductive layers · CPC title

  • composed of semi-conducting layers · CPC title

  • Operations & Transport · mapped topic

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9728300B2 cover?
A power cable comprising a: (A) Conductor, (B) First semiconductor in contact with the conductor; (C) First insulation layer in contact with the first semiconductor; (D) Second semiconductor layer in contact with the first insulation layer; (E) Third semiconductor layer in contact with the second semiconductor layer; (F) Second insulation layer in contact with the third semiconductor layer; and…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification H01B13/141. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).