Patterning device, method of producing a marker on a substrate and device manufacturing method

Patent metadata

Field	Value
Publication number	US-9726991-B2
Application number	US-201414764522-A
Country	US
Kind code	B2
Filing date	Mar 6, 2014
Priority date	Mar 14, 2013
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A patterning device, for use in forming a marker on a substrate by optical projection, the patterning device including a marker pattern having a density profile that is periodic with a fundamental spatial frequency corresponding to a desired periodicity of the marker to be formed. The density profile is modulated (such as sinusoidally) so as to suppress one or more harmonics of the fundamental frequency, relative to a simple binary profile having the fundamental frequency.

First claim

The invention claimed is:

1. A patterning device for use in forming a marker on a substrate by optical projection, the patterning device comprising a marker pattern having a density profile that is periodic in at least a first direction, a fundamental spatial frequency of the periodic density profile of the marker pattern corresponding to a desired periodicity of the marker to be formed, wherein the density profile is modulated so as to suppress one or more harmonics of the fundamental frequency, relative to a simple binary profile having the fundamental frequency and the density profile comprises one or more pattern elements having three or more different widths.

2. The patterning device of claim 1 , wherein the periodic density profile is a binary profile modulated in a second direction orthogonal to the first direction, the modulation in the second direction having a spatial frequency greater than the fundamental frequency.

3. The patterning device of claim 1 , wherein the periodic density profile is a binary profile modulated in the first direction not only with the fundamental spatial frequency but with a spatial frequency or frequencies greater than the harmonics to be suppressed.

4. The patterning device of claim 1 , wherein the periodic density profile is modulated so as to suppress all harmonics of the fundamental frequency below a certain harmonic.

5. The patterning device of claim 1 , wherein the periodic density profile is modulated so as to suppress all but the third harmonic of the fundamental frequency below a certain harmonic.

6. A method of producing a marker on a substrate, the method comprising illuminating the patterning device of claim 1 with radiation, projecting an image of the marker pattern onto the substrate, and using the image to form a marker on the substrate by a lithographic process.

7. A substrate comprising a marker produced using the method of claim 6 .

8. A device manufacturing method, the method comprising producing a marker on a substrate as recited in claim 6 , and using the formed marker for alignment in a subsequent lithographic process comprising: exposing a photosensitive resist coated on the substrate with an image of a circuit pattern, while using the formed marker to align the exposure or to correct alignment of the exposure, developing the resist to form a resist integrated circuit pattern and transferring the resist integrated circuit pattern to the substrate by etching to form an integrated circuit of a device.

9. A patterning device, for use with an optical projection system, comprising a periodic marker pattern with pattern features within each period that are sub-resolution with respect to the optical projection system's imaging resolution, wherein the pattern features are non-rectangular shaped or spaced apart at three or more different distances, to suppress at least one harmonic in an image of the periodic marker pattern projected by the optical projection system, compared to an image of a rectangular periodic marker pattern without sub-resolution pattern features.

10. The patterning device of claim 9 , wherein the periodic marker pattern is configured to approximate a sinusoidal periodic pattern to suppress all harmonics in the image of the periodic marker pattern projected by the optical projection system.

11. The patterning device of claim 9 , wherein the periodic marker pattern is configured to approximate a non-rectangular periodic pattern to suppress all but the third harmonic in the image of the periodic marker pattern projected by the optical projection system.

12. The patterning device of claim 9 , wherein the periodic marker pattern further comprises an alternating phase shift structure to suppress a zeroth order intensity component in the image of the periodic marker pattern projected by the optical projection system.

13. The patterning device of claim 9 , wherein the patterning device comprises a circuit pattern and the periodic marker pattern is configured for aligning an exposure or correcting alignment of an exposure using the circuit pattern in a lithographic process.

14. A method of producing a periodic marker on a substrate, the method comprising illuminating the patterning device of claim 9 with radiation, using an optical projection system to project an image of the periodic marker pattern onto the substrate, and using the image to form a periodic marker on the substrate.

15. A substrate comprising a periodic marker produced using the method of claim 14 .

16. A device manufacturing method, the method comprising producing a periodic marker on a substrate as recited in claim 14 , and using the formed periodic marker to align a subsequent lithographic process comprising: exposing a photosensitive resist coated on the substrate with the an image of a circuit pattern, while using the formed periodic marker to align the exposure or to correct alignment of the exposure, developing the resist to form a resist integrated circuit pattern and transferring the integrated circuit pattern to the substrate by etching to form an integrated circuit of a device.

17. A patterning device for use in forming a marker on a substrate by optical projection, the patterning device comprising a marker pattern having a density profile that is periodic in at least a first direction, a fundamental spatial frequency of the periodic density profile of the marker pattern corresponding to a desired periodicity of the marker to be formed, wherein the density profile is modulated so as to suppress one or more harmonics of the fundamental frequency, relative to a simple binary profile having the fundamental frequency and wherein the periodic density profile is modulated so as to suppress all harmonics, or all but the third harmonic, of the fundamental frequency below a certain harmonic.

18. A patterning device, for use with an optical projection system, comprising a periodic marker pattern with pattern features within each period that are sub-resolution with respect to the optical projection system's imaging resolution, the periodic marker pattern being configured to approximate a non-rectangular periodic pattern to suppress at least one harmonic in an image of the periodic marker pattern projected by the optical projection system, compared to an image of a rectangular periodic marker pattern without sub-resolution pattern features, wherein the periodic marker pattern is configured to approximate a sinusoidal periodic pattern to suppress all harmonics, or configured to approximate a non-rectangular periodic pattern to suppress all but the third harmonic, in the image of the periodic marker pattern projected by the optical projection system.

19. A patterning device, for use with an optical projection system, comprising a periodic marker pattern with pattern features within each period that are sub-resolution with respect to the optical projection system's imaging resolution, the periodic marker pattern being configured to approximate a non-rectangular periodic pattern to suppress at least one harmonic in an image of the periodic marker pattern projected by the optical projection system, compared to an image of a rectangular periodic marker pattern without sub-resolution pattern features, wherein the periodic marker pattern further comprises an alternating phase shift structure to suppress a zeroth order intensity component in the image of the periodic marker pattern projected by the optical projection system.

Assignees

• Asml Netherlands Bv

Inventors

• Baselmans Johannes Jacobus Matheus
• Bijnen Franciscus Godefridus Casper
• Palmen Daniëlle Elisabeth Maria

Classifications

• G03F1/44

  Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales · CPC title

• G03F7/70058

  Mask illumination systems · CPC title

• G03F1/42

  Alignment or registration features, e.g. alignment marks on the mask substrates · CPC title

• G03F9/708 Primary

  Mark formation · CPC title