Cleaning composition, cleaning process, and process for producing semiconductor device

Patent metadata

Field	Value
Publication number	US-9726978-B2
Application number	US-201514717437-A
Country	US
Kind code	B2
Filing date	May 20, 2015
Priority date	Sep 30, 2009
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A cleaning composition for removing plasma etching residue and/or ashing residue formed above a semiconductor substrate is provided that includes (component a) water, (component b) a hydroxylamine and/or a salt thereof, (component c) a basic organic compound, and (component d) an organic acid and has a pH of 7 to 9. There are also provided a cleaning process and a process for producing semiconductor device employing the cleaning composition.

First claim

What is claimed is:

1. A cleaning process comprising:
a preparation step of preparing a cleaning composition comprising (component a) water;
(component b) a hydroxylamine and/or a salt thereof; (component c) a basic organic compound;
and (component d) an organic acid; and the composition has a pH of 7 to 9; and
a cleaning step of cleaning, by means of the cleaning composition, plasma etching residue and/or ashing residue formed above a semiconductor substrate,
wherein component a is contained at 50 to 99.5 wt % relative to the total weight of the cleaning composition,
wherein component b is at least one compound selected from the group consisting of hydroxylamine sulfate, hydroxylamine hydrochloride, hydroxylamine nitrate, and hydroxylamine phosphate,
wherein component c is at least one compound selected from the group consisting of an alkanolamine and an organic amine having no hydroxy group, and
wherein the semiconductor substrate comprises aluminum and titanium nitride.

2. The cleaning process according to claim 1 , wherein the semiconductor substrate comprises aluminum and/or copper.

3. The cleaning process according to claim 1 , wherein component b is hydroxylamine sulfate.

4. The cleaning process according to claim 1 , wherein component b is contained at 0.01 to 30.0 wt % relative to the total weight of the cleaning composition.

5. The cleaning process according to claim 1 , wherein component c is at least one compound selected from the group consisting of an organic amine and a quaternary ammonium hydroxide.

6. The cleaning process according to claim 1 , wherein component c is contained at 0.01 to 20.0 wt % relative to the total weight of the cleaning composition.

7. The cleaning process according to claim 1 , wherein component d is a monofunctional, difunctional, trifunctional, or tetrafunctional organic acid.

8. The cleaning process according to claim 7 , wherein component d is at least one compound selected from the group consisting of citric acid, lactic acid, acetic acid, propionic acid, malic acid, tartaric acid, malonic acid, oxalic acid, succinic acid, gluconic acid, glycolic acid, diglycolic acid, maleic acid, benzoic acid, phthalic acid, salicylic acid, salicylhydroxamic acid, and phthalhydroxamic acid.

9. The cleaning process according to claim 7 , wherein component d is a hydroxycarboxylic acid.

10. The cleaning process according to claim 9 , wherein component
d is at least one compound selected from the group consisting of citric acid, malic acid, tartaric acid, glycolic acid, gluconic acid, and lactic acid.

11. The cleaning process according to claim 1 , wherein component
d is contained at 0.01 to 20.0 wt % relative to the total weight of the cleaning composition.

12. The cleaning process according to claim 1 , wherein the pH is 7.0 to 8.5.

13. The cleaning process according to claim 12 , wherein the pH is 7.2 to 8.4.

14. The cleaning process according to claim 1 , wherein the cleaning composition further comprises (component e) an amino group-containing carboxylic acid.

15. The cleaning process according to claim 14 , wherein component e is histidine and/or arginine.

16. The cleaning process according to claim 14 , wherein component e is contained at 0.01 to 5.0 wt % relative to the total weight of the cleaning composition.

17. A process for producing a semiconductor device, the process comprising:
an etching step of subjecting a semiconductor substrate to plasma etching; and/or,
an ashing step of subjecting a resist above the semiconductor substrate to ashing; and
a cleaning step of cleaning plasma etching residue and/or ashing residue formed above the semiconductor substrate in the etching step and/or the ashing step, by means of a cleaning composition comprising (component a) water; (component b) a hydroxylamine and/or a salt thereof; (component c) a basic organic compound; and (component d) an organic acid, the cleaning composition having a pH of 7 to 9,
wherein component a is contained at 50 to 99.5 wt % relative to the total
weight of the cleaning composition,
wherein component b is at least one compound selected from the group consisting of hydroxylamine sulfate, hydroxylamine hydrochloride, hydroxylamine nitrate, and hydroxylamine phosphate,
wherein component c is an alkanolamine or an organic amine having no hydroxy group, and
wherein the semiconductor substrate comprises aluminum and titanium nitride.

18. The process for producing a semiconductor device according to claim 17 , wherein the semiconductor substrate comprises aluminum and/or copper.

Assignees

• Fujifilm Corp

Inventors

• Takahashi Tomonori
• Takahashi Kazutaka
• Mizutani Atsushi
• Seki Hiroyuki
• Fushimi Hideo
• Kato Tomoo

Classifications

• H10P70/273

  the processing being a delineation of conductive layers, e.g. by RIE · CPC title

• H10P70/234

  the processing being the formation of vias or contact holes · CPC title

• H10P70/27

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title