Use of an esterified aromatic polyphenol derivative for the production of a phenol-aldehyde resin for reinforcement of a rubber composition
US-10711132-B2 · Jul 14, 2020 · US
HMF-based phenol formaldehyde resin
US9725552B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9725552-B2 |
| Application number | US-201514881993-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 13, 2015 |
| Priority date | Oct 14, 2014 |
| Publication date | Aug 8, 2017 |
| Grant date | Aug 8, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted groups including H, halide, C 1 -C 20 alkyl group, C 1 -C 20 alkenyl group, C 1 -C 20 cycloalkyl group, C 1 -C 20 cycloalkenyl group, homocyclic aromatic group or heterocyclic aromatic group.
First claim
Opening claim text (preview).
What is claimed is: 1. A hydroxymethylfurfural-based phenol formaldehyde resin having the following formula (I): wherein A comprises non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, wherein the disubstituted phenol has substituted groups selected from the group consisting of halide, C 1 -C 20 alkyl group, C 1 -C 20 alkenyl group, C 1 -C 20 cycloalkyl group, C 1 -C 20 cycloalkenyl group, homocyclic aromatic group and heterocyclic aromatic group, B comprises phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20. 2. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 1 , wherein the phosphate ester has the following formulae: wherein R 1 and R 2 are selected from the group consisting of aryl group, alkyl group and alkenyl group. 3. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 2 , wherein the aryl group comprises phenyl group and the alkyl group comprises ethyl group or iso-propyl group. 4. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 1 , wherein the phosphate has the following formulae: wherein R is selected from the group consisting of aryl group, alkyl group and alkenyl group, and M is selected from the group consisting of lithium ion, sodium ion, calcium ion, potassium ion, cesium ion, magnesium ion, barium ion, aluminum ion, boron ion, ammonium ion and melamine. 5. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 4 , wherein the aryl group comprises phenyl group and the alkyl group comprises ethyl group or iso-propyl group. 6. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 1 , wherein the phosphine oxide has the following formulae: wherein R 1 and R 2 are selected from the group consisting of aryl group, alkyl group and alkenyl group. 7. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 6 , wherein the aryl group comprises phenyl group and the alkyl group comprises ethyl group or iso-propyl group. 8. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 1 , wherein the phosphinate ester has the following formulae: wherein R 1 and R 2 are selected from the group consisting of aryl group, alkyl group and alkenyl group. 9. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 8 , wherein the aryl group comprises phenyl group and the alkyl group comprises ethyl group or iso-propyl group. 10. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 1 , wherein the phosphinate has the following formulae: wherein R is selected from the group consisting of aryl group, alkyl group and alkenyl group, and M is selected from the group consisting of lithium ion, sodium ion, calcium ion, potassium ion, cesium ion, magnesium ion, barium ion, aluminum ion, boron ion, ammonium ion and melamine. 11. The hydroxymethylfurfural-based phenol formaldehyde resin as claimed in claim 10 , wherein the aryl group comprises phenyl group and the alkyl group comprises ethyl group or iso-propyl group.
Assignees
Inventors
Classifications
of aldehydes · CPC title
Epoxynovolacs · CPC title
Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) · CPC title
of furfural · CPC title
Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title
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Frequently asked questions
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- What does patent US9725552B2 cover?
- A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted …
- Who is the assignee on this patent?
- Ind Tech Res Inst
- What technology area does this patent fall under?
- Primary CPC classification C08G8/32. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).