Stack unit

US9723764B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9723764-B2
Application numberUS-201514978474-A
CountryUS
Kind codeB2
Filing dateDec 22, 2015
Priority dateDec 24, 2014
Publication dateAug 1, 2017
Grant dateAug 1, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

With respect to a stack unit in which a plurality of power cards and a plurality of coolers are stacked, each of the plurality of power cards housing semiconductor element, a technique for improving the fitting of a stack unit to a housing is taught. A stack unit is a unit that coolers and power cards are stacked. An outer frame binds a stack of the power cards and the coolers. The outer frame pressurizes the stack along with the stacked direction. Each of the coolers comprises a main body and a metal plate. The main body includes a flow channel of coolant and an opening provided at a position facing the power card. The metal plate has one surface closing the opening. A seal between the opening and the metal plate is secured by pressure of the outer frame.

First claim

Opening claim text (preview).

What is claimed is: 1. A stack unit comprising: a plurality of power cards, each of the plurality of power cards housing a semiconductor element; a plurality of coolers stacked with the plurality of power cards, each of the plurality of coolers being in contact with a corresponding one of the plurality of power cards; and an outer frame binding a stack of the power cards and the coolers, the outer frame pressurizing the stack in a stacking direction along which the power cards and the coolers are stacked, the outer frame includes an upper side edge and a lower side edge, and ribs extend outwardly from the upper side edge and the lower side edge; wherein each of the plurality of coolers comprises: a main body including a flow channel of coolant inside the main body, and an opening provided at a position facing the corresponding power card, the opening communicating with the flow channel, the main body includes projections provided on a side surface of the main body being in contact with the outer frame, the projections restrict a position of the outer frame along an up-and-down direction, an inner surface of the projections contacts an outer surface of the ribs; and a metal plate having one surface closing the opening, and the other surface being in contact with the corresponding power card, and a seal between each of the openings and the corresponding metal plate is secured by pressure applied from the outer frame. 2. The stack unit according to claim 1 , wherein the outer frame is configured by a U-shaped part and a connection part connecting both ends of the U-shaped part. 3. The stack unit according to claim 1 , wherein the ribs and the projections are welded after the U-shaped part and the connection part are joined. 4. The stack unit according to claim 1 , wherein a gasket is positioned between each of the openings and the corresponding metal plate.

Assignees

Inventors

Classifications

  • by flowing liquids, e.g. forced water cooling · CPC title

  • Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

  • Bolts or screws · CPC title

  • for stacked arrangements of a plurality of semiconductor devices · CPC title

  • characterised by their shape, e.g. having conical or cylindrical projections · CPC title

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Frequently asked questions

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What does patent US9723764B2 cover?
With respect to a stack unit in which a plurality of power cards and a plurality of coolers are stacked, each of the plurality of power cards housing semiconductor element, a technique for improving the fitting of a stack unit to a housing is taught. A stack unit is a unit that coolers and power cards are stacked. An outer frame binds a stack of the power cards and the coolers. The outer frame …
Who is the assignee on this patent?
Toyota Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K7/20927. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 01 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).