Anisotropic conductive film, connection method, and assembly

Patent metadata

Field	Value
Publication number	US-9723715-B2
Application number	US-201314425462-A
Country	US
Kind code	B2
Filing date	Sep 10, 2013
Priority date	Sep 18, 2012
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

An anisotropic conductive film, which contains a crystalline resin, an amorphous resin, and conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a first electronic part and a terminal of a second electronic part, and wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin.

First claim

The invention claimed is:

1. An anisotropic conductive film, comprising:
a crystalline resin;
an amorphous resin; and
conductive particles,
wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a first electronic part and a terminal of a second electronic part,
wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin, and
wherein the anisotropic conductive film is an anisotropic conductive film which shows an endothermic peak at a time of heating and an exothermic peak at a time of cooling when measured by differential scanning calorimetry.

2. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film satisfies the following formula:
ΔT1>ΔT2

where ΔT1 is an absolute value of a difference between melting onset temperature and endothermic peak temperature at the time of heating, and ΔT2 is an absolute value of a difference between crystallization onset temperature and exothermic peak temperature at the time of cooling, as the anisotropic conductive film is measured by differential scanning calorimetry with the following measuring temperature range, the following heating speed, and the following cooling speed:
Measuring temperature range: 30° C. to 250° C.;
Heating speed: 10° C./min; and
Cooling speed: 20° C./min.

3. The anisotropic conductive film according to claim 1 , wherein a mass ratio (crystalline resin:amorphous resin) of the crystalline resin to the amorphous resin is 25:75 to 75:25.

4. The anisotropic conductive film according to claim 1 , wherein the crystalline resin contains a crystalline polyester resin, and the amorphous resin contains an amorphous polyester resin.

5. The anisotropic conductive film according to claim 1 , further comprising an elastomer.

6. The anisotropic conductive film according to claim 5 , wherein a mass ratio (X:Y) of a sum (X) of an amount of the crystalline resin and an amount of the amorphous resin to an amount (Y) of the elastomer is 160:40 to 60:140.

7. The anisotropic conductive film according to claim 1 , wherein the conductive particles have an average particle diameter of 2 μm to 40 μm.

8. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film satisfies a relationship that a difference (P1−P2) is 11.0° C. or greater, where P1 is the endothermic peak temperature at the time of heating, and P2 is the exothermic peak temperature at the time of cooling, as the anisotropic conductive film is measured by differential scanning calorimetry with the following measuring temperature range, the following heating speed, and the following cooling speed:
Measuring temperature range: 30° C. to 250° C.;
Heating speed: 10° C./min; and
Cooling speed: 20° C./min.

9. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film gives an endothermic value of 1.0 J/g to 12 J/g at the time of heating, and an exothermic value of 1.0 J/g to 6.0 J/g at the time of cooling, as the anisotropic conductive film is measured by differential scanning calorimetry with the following measuring temperature range, the following heating speed, and the following cooling speed:
Measuring temperature range: 30° C. to 250° C.;
Heating speed: 10° C./min; and
Cooling speed: 20° C./min.

10. A connecting method, comprising:
arranging an anisotropic conductive film on a terminal of a second electronic part;
arranging a first electronic part on the anisotropic conductive film in a manner that a terminal of the first electronic part is in contact with the anisotropic conductive film; and
heating and pressing the first electronic part with a heat-press member, to thereby anisotropic conductively connect the terminal of the first electronic part to the terminal of the second electronic part,
wherein the anisotropic conductive film contains:
a crystalline resin;
an amorphous resin; and
conductive particles,
wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin, and
wherein the anisotropic conductive film is an anisotropic conductive film which shows an endothermic peak at a time of heating and an exothermic peak at a time of cooling when measured by differential scanning calorimetry.

11. A bonded structure, comprising:
a first electronic part containing a terminal;
a second electronic part containing a terminal; and
an anisotropic conductive film, which is present between the first electronic part and the second electronic part, and is configured to electrically connect the terminal of the first electronic part and the terminal of the second electronic part,
wherein the anisotropic conductive film contains:
a crystalline resin;
an amorphous resin; and
conductive particles,
wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin, and
wherein the anisotropic conductive film is an anisotropic conductive film which shows an endothermic peak at a time of heating and an exothermic peak at a time of cooling when measured by differential scanning calorimetry.

12. The connecting method according to claim 10 , wherein the anisotropic conductive film satisfies the following formula:
ΔT1>ΔT2

where ΔT1 is an absolute value of a difference between melting onset temperature and endothermic peak temperature at the time of heating, and ΔT2 is an absolute value of a difference between crystallization onset temperature and exothermic peak temperature at the time of cooling, as the anisotropic conductive film is measured by differential scanning calorimetry with the following measuring temperature range, the following heating speed, and the following cooling speed:
Measuring temperature range: 30° C. to 250° C.;
Heating speed: 10° C./min; and
Cooling speed: 20° C./min.

13. The connecting method according to claim 10 , wherein a mass ratio (crystalline resin:amorphous resin) of the crystalline resin to the amorphous resin is 25:75 to 75:25.

14. The connecting method according to claim 10 , wherein the crystalline resin contains a crystalline polyester resin, and the amorphous resin contains an amorphous polyester resin.

15. The connecting method according to claim 10 , wherein the anisotropic conductive film satisfies a relationship that a difference (P1−P2) is 11.0° C. or greater, where P1 is the endothermic peak temperature at the time of heating, and P2 is the exothermic peak temperature at the time of cooling, as the anisotropic conductive film is measured by differential scanning calorimetry with the following measuring temperature range, the following heating speed, and the following cooling speed:
Measuring temperature range: 30° C. to 250° C.;
Heating speed: 10° C./min; and
Cooling speed: 20° C./min.

16. The bonded structure according to 11 , wherein the anisotropic conductive film satisfies the following formula:
ΔT1>ΔT2

where ΔT1 is an absolute value of a difference between melting onset temperature and endothermic peak temperature at the time of heating, and ΔT2 is an absolute value of a difference between crystallization onset temperature and exothermic peak temperature at the time of cooling, as the anisotropic conductive film is measured by differential scanning calorime

Assignees

• Dexerials Corp

Inventors

• Yamada Yasunobu
• Uesawa Naoya
• Aoki Kazuhisa

Classifications

• H05K1/11 Primary

  Printed elements for providing electric connections to or between printed circuits · CPC title

• C08K3/08

  Metals · CPC title

• C08L2203/16

  used for films · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C09J9/02

  Electrically-conducting adhesives · CPC title