Heat exchanger methods, apparatuses and systems with a manifold structure

Patent metadata

Field	Value
Publication number	US-9721871-B2
Application number	US-201514958420-A
Country	US
Kind code	B2
Filing date	Dec 3, 2015
Priority date	Dec 3, 2015
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. A heat exchanger for cooling an integrated circuit package, comprising:
a base plate having a bottom side to be thermally coupled to the integrated circuit package, and a fin side opposite to the bottom side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the integrated circuit package;
a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow over the plurality of fins to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package; and
a lid plate disposed on top of the manifold structure;
wherein either the manifold structure or the lid plate further comprises an inlet port and an outlet port for provision and removal of the coolant fluid flow;
wherein the plurality of channels and ports of the manifold structure includes one or more inlet flow channels and one or more distribution ports; wherein the one or more inlet flow channels are to receive the coolant fluid from the inlet port and to direct the coolant fluid to the one or more distribution ports.

2. The heat exchanger of claim 1 , wherein the one or more layers of the manifold structure include a port layer located immediately below the lid plate, and a distribution layer located below the port layer, wherein the one or more inlet flow channels are disposed on the port layer, and the one or more distribution ports are disposed on the distribution layer.

3. The heat exchanger of claim 1 , wherein the one or more distribution ports are to direct the coolant fluid to one or more cooling channels.

4. The heat exchanger of claim 3 , wherein the one or more layers of the manifold structure include a distribution layer and a cooling layer located below the distribution layer and immediately above the base plate, wherein the one or more distribution ports are disposed on the distribution layer, and the one or more cooling channels are disposed on the cooling layer.

5. The heat exchanger of claim 3 , wherein the plurality of channels and ports of the manifold structure further includes one or more return ports; wherein the one or more cooling channels are to direct the coolant fluid to flow over the plurality of fins, and onto the one or more return ports, tailored to the thermal energy emanation pattern of the integrated circuit package.

6. The heat exchanger of claim 5 , wherein the one or more layers of the manifold structure include a cooling layer located immediately above the base plate and a return layer located above the cooling layer, wherein the one or more cooling channels are disposed on the cooling layer, and the one or more return ports are disposed on the return layer.

7. The heat exchanger of claim 5 , wherein the plurality of channels and ports of the manifold structure are to further include one or more outlet flow channels; wherein one or more return ports are to direct the coolant fluid, after flowing over the plurality of fins, to the one or more outlet flow channels; and wherein the one or more outlet flow channels are to direct the coolant fluid to the outlet port to remove the coolant fluid from the heat exchanger.

8. The heat exchanger of claim 7 , wherein the one or more layers of the manifold structure include a return layer, and a port layer located above the return layer and immediately below the lid plate, wherein the one or more return ports are disposed on the return layer, and the one or more outlet flow channels are disposed on the port layer.

9. A heat exchanger for cooling an integrated circuit package, comprising:
a base plate having a bottom side to be thermally coupled to the integrated circuit package, and a fin side opposite to the bottom side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the integrated circuit package;
a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow over the plurality of fins to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package; and
a lid plate disposed on top of the manifold structure;
wherein either the manifold structure or the lid plate further comprises an inlet port and an outlet port of provision and removal of the collant fluid flow;
where the one or more layers of the manifold structure include a port layer located immediately below the lid plate and having one or more inlet flow channels to direct flow of the coolant fluid provided through the inlet port; a combined distribution-return layer located below the port layer and having one or more distribution ports to receive the coolant fluid from the one or more inlet flow channels and distribute the coolant fluid; and a cooling layer located below the combined distribution-return layer and immediately above the base plate, and having one or more cooling channels to receive the coolant fluid from the one or more distribution ports and direct the coolant fluid to flow over the plurality of fins, tailored to the thermal energy emanation pattern of the integrated circuit package.

10. The heat exchanger of claim 9 , wherein the combined distribution-return layer further includes one or more return ports to receive and direct the coolant fluid after flowing over the plurality of fins, and the port layer further includes one or more outlet flow channels to receive the coolant fluid from the one or more return ports, and direct the coolant fluid to the outlet port.

11. The heat exchanger of claim 9 , wherein the port layer further includes one or more structural members to contribute to strengthen the heat exchanger to support a predetermined amount of load.

12. The heat exchanger of claim 9 , wherein the cooling layer further includes one or more structural members to contribute to strengthen the heat exchanger to support a predetermined amount of load.

13. The heat exchanger of claim 9 , wherein the one or more layers of the manifold structure includes structural members disposed on one or more of the one or more layers to strengthen the heat exchanger to support a predetermined amount of load.

14. The heat exchanger of claim 13 , wherein thickness of the one or more layers, and geometry or size of the channels or ports are complementarily organized, tailored to the thermal energy emanation pattern of the integrated circuit package.

15. An apparatus for computing, including cooling of the apparatus;
comprising:
a die having computational circuitry; and
a heat exchanger thermally coupled with the die to cool the die, wherein the heat exchanger includes:
a base plate having a bottom side to be thermally coupled to the die, and a fin side opposite to the bottom side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the die;
a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow over the plurality of fins to cool the plurality of fins, including one or more layers having a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the die; and
a lid plate o

Assignees

• Intel Corp

Inventors

• Frey Emery E
• Mcafee Eric D
• Krishnan Shankar
• Cevallos Juan G
• Flynn Roger D

Classifications

• G06F1/20

  Cooling means · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title