Feature and depth measurement using multiple beam sources and interferometry

Patent metadata

Field	Value
Publication number	US-9719776-B2
Application number	US-201514676070-A
Country	US
Kind code	B2
Filing date	Apr 1, 2015
Priority date	Apr 1, 2014
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

Systems and techniques for processing materials using wavelength beam combining for high-power operation in concert with interferometry to detect the depth or height of features as they are created.

First claim

What is claimed is:

1. A system for processing a workpiece, the system comprising:
a wavelength beam combining (WBC) emitter for emitting a multi-wavelength output beam comprising optical radiation having a plurality of wavelengths;
a movable surface reflective to all of the wavelengths in the multi-wavelength output beam;
a photodetector;
a beamsplitter for (i) diverting a portion of the multi-wavelength output beam to the movable reflective surface and (ii) diverting a portion of a reflection of the multi-wavelength output beam from a surface of the workpiece to the photodetector, the photodetector being aligned with the movable reflective surface to receive therefrom a reflection of the diverted portion of the multi-wavelength output beam;
a database storing parameters relating process types and material compositions to output-beam properties; and
a controller, coupled to the WBC emitter device and the photodetector, for (i) computing a height or depth of a feature on the surface of the workpiece based at least in part on a signal from photodetector and (ii) controlling a property of the multi-wavelength output beam, in accordance with one or more parameters in the database, to process the surface of the workpiece to thereby form a feature in or on the surface of the workpiece.

2. The system of claim 1 , wherein the height or depth is determined based on a distance between the beamsplitter and the surface of the workpiece.

3. The system of claim 1 , wherein the signal from the photodetector indicates a degree of interference between the reflection of the multi-wavelength output beam from the surface of the workpiece and the reflection from the movable reflective surface of the diverted portion of the multi-wavelength output beam.

4. The system of claim 1 , wherein the controller is configured to control a parameter of the multi-wavelength output beam to maintain a target distance between the beamsplitter and the surface of the workpiece.

5. The system of claim 4 , wherein the controlled parameter of the multi-wavelength output beam is power.

6. The system of claim 4 , wherein the controlled parameter of the multi-wavelength output beam is beam parameter product.

7. The system of claim 1 , wherein the WBC emitter comprises:
a plurality of beam emitters each emitting a beam;
a combining optical element arranged to receive the plurality of beams and cause a chief ray of each of the beams to converge along a beam-combining axis;
a dispersive element, positioned along the beam-combining axis, to receive and transmit the converging chief rays; and
a partially reflective output coupler arranged to receive the transmitted beams from the dispersive element, to reflect a portion of the transmitted beams toward the dispersive element, and to transmit the multi-wavelength output beam.

8. The system of claim 1 , wherein the controller is configured to control a parameter the property of the multi-wavelength output beam to cut, etch, anneal, drill, solder, and/or weld the workpiece.

9. The system of claim 1 , wherein the controlled property of the multi-wavelength output beam comprises at least one of power or beam parameter product.

10. The system of claim 1 , wherein the feature has a height above the surface of the workpiece or has a depth below the surface of the workpiece.

11. A method for processing a workpiece, the method comprising the steps of:
causing emission of an output beam from a wavelength beam combining (WBC) emitter, the output beam comprising optical radiation having a plurality of wavelengths;
diverting a portion of the multi-wavelength output beam to a movable surface reflective to all of the wavelengths in the multi-wavelength output beam;
diverting a portion of a reflection of the multi-wavelength output beam from a surface of the workpiece to a photodetector;
receiving, at the photodetector, a reflection from the movable reflective surface of the diverted portion of the multi-wavelength output beam, the reflection including all of the wavelengths in the multi-wavelength output beam;
computing a height or depth of a feature on the workpiece based at least in part on a signal from the photodetector; and
processing the surface of the workpiece with the multi-wavelength output beam to thereby form a feature in or on the surface of the workpiece,
wherein the surface of the workpiece is processed based on stored parameters relating process types to properties of the multi-wavelength output beam.

12. The method of claim 11 , wherein the height or depth is determined based on a distance between the surface of the workpiece and a location where the portion of the reflection is diverted.

13. The method of claim 11 , wherein the signal from the photodetector indicates a degree of interference between the reflection of the multi-wavelength output beam from the surface of the workpiece and the reflection, from the movable surface, of the diverted portion of the multi-wavelength output beam.

14. The method of claim 11 , further comprising the step of controlling a parameter of the multi-wavelength output beam to maintain a target distance between the beamsplitter and the surface of the workpiece.

15. The method of claim 14 , wherein the controlled parameter of the multi-wavelength output beam is power.

16. The method of claim 14 , wherein the controlled parameter of the multi-wavelength output beam is beam parameter product.

17. The method of claim 11 , wherein processing the surface of the workpiece comprises at least one of cutting the workpiece, etching the workpiece, annealing the workpiece, drilling the workpiece, soldering the workpiece, or welding the workpiece.

18. The method of claim 11 , wherein the surface of the workpiece is processed in response to user selection of a material composition of the workpiece.

19. The method of claim 11 , wherein processing the surface of the workpiece comprises controlling a property of the multi-wavelength output beam in accordance with the stored parameters.

20. The method of claim 19 , wherein the controlled property of the multi-wavelength beam comprises at least one of power or beam parameter product.

21. The method of claim 11 , wherein the feature has a height above the surface of the workpiece or has a depth below the surface of the workpiece.

Assignees

• Tayebati Parviz
• Teradiode Inc

Inventors

• Tayebati Parviz

Classifications

• B23K26/0613

  having a common axis (B23K26/0619 takes precedence) · CPC title

• G01B11/22

  for measuring depth · CPC title

• G01B11/0608 Primary

  Height gauges · CPC title

• G01B9/02007

  Two or more frequencies or sources used for interferometric measurement (using only beat G01B9/02003) · CPC title

• B23K26/21

  by welding · CPC title