Wafer-based light source parameter control

Patent metadata

Field	Value
Publication number	US-9715180-B2
Application number	US-201414295558-A
Country	US
Kind code	B2
Filing date	Jun 4, 2014
Priority date	Jun 11, 2013
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

A photolithography method includes instructing an optical source to produce a pulsed light beam; scanning the pulsed light beam across a wafer of a lithography exposure apparatus to expose the wafer with the pulsed light beam; during scanning of the pulsed light beam across the wafer, receiving a characteristic of the pulsed light beam at the wafer; receiving a determined value of a physical property of a wafer for a particular pulsed light beam characteristic; and based on the pulsed light beam characteristic that is received during scanning and the received determined value of the physical property, modifying a performance parameter of the pulsed light beam during scanning across the wafer.

First claim

What is claimed is:

1. A photolithography method comprising:
instructing an optical source to produce a pulsed light beam;
scanning the pulsed light beam across a wafer of a lithography exposure apparatus to expose the wafer with the pulsed light beam;
detecting a property of the pulsed light beam at the wafer as the pulsed light beam is scanned across the wafer;
during scanning of the pulsed light beam across the wafer, receiving the property of the pulsed light beam at the wafer;
determining a value of a physical property of a wafer that correlates with the received pulsed light beam property by selecting the value of the physical property of the wafer based on the received pulsed light beam property;
determining a modification to a performance parameter of the pulsed light beam based on the pulsed light beam property that is received during scanning and the determined value of the wafer physical property; and
modifying the performance parameter of the pulsed light beam during scanning across the wafer based on the determined modification.

2. The method of claim 1 , wherein the determined value of the wafer physical property comprises an error in the physical property of the wafer.

3. The method of claim 1 , wherein the wafer physical property is one or more of a contrast of a feature formed on the wafer, a critical dimension at a wafer area exposed to the pulsed light beam, a photoresist profile at a wafer area exposed to the pulsed light beam, and a side-wall angle at a wafer area exposed to the pulsed light beam.

4. The method of claim 1 , wherein determining the value of the physical property of the wafer that correlates with the received pulsed light beam property comprises receiving a set of determined values of the physical property for a wafer that has been previously exposed by the light beam of the optical source for a set of light beam properties on the previously-exposed wafer.

5. The method of claim 1 , wherein receiving the property of the light beam at the wafer during scanning of the pulsed light beam across the wafer comprises receiving a location at which the light beam exposes the wafer.

6. The method of claim 1 , wherein receiving the property of the light beam at the wafer during scanning of the pulsed light beam across the wafer comprises receiving an energy of the light beam as it exposes the wafer.

7. The method of claim 1 , wherein modifying the performance parameter of the pulsed light beam comprises modifying a target performance parameter of the pulsed light beam, the method further comprising:
receiving a measurement of the performance parameter of the pulsed light beam;
determining whether the measured performance parameter matches the modified target performance parameter; and
if it is determined that the measured performance parameter does not match the modified target performance parameter, sending a signal to the optical source to modify the performance parameter of the pulsed light beam.

8. The method of claim 1 , wherein receiving the light beam property at the wafer comprises:
receiving a control signal from the lithography exposure apparatus to the optical source; and
determining the light beam property at the wafer based on the received control signal.

9. The method of claim 1 , wherein determining the modification to the performance parameter of the pulsed light beam comprises:
accessing a stored set of performance parameters as a function of light beam properties at the wafer;
selecting the value for the performance parameter within the accessed set that corresponds to the received property of the light beam at the current wafer; and
comparing the selected value of the performance parameter with a current value of the performance parameter of the pulsed light beam.

10. The method of claim 9 , further comprising, if the selected value of the performance parameter does not match the current value, then determining that the current performance parameter needs to be adjusted to match the selected value.

11. The method of claim 9 , wherein determining the value of the wafer physical property comprises receiving a set of measured physical properties of the wafer at a set of light beam properties at the wafer.

12. The method of claim 11 , further comprising:
for each light beam property at the wafer in the set, determining a performance parameter of the pulsed light beam based on the measured wafer physical property; and
storing the determined performance parameter at each light beam property within the set.

13. The method of claim 1 , wherein:
scanning the pulsed light beam across the wafer comprises scanning the pulsed light beam across a field of the wafer, the field being a fraction of the total area of the wafer exposed; and
receiving the property of the light beam comprises receiving the property of the light beam during the scanning of the pulsed light beam across the field of the wafer.

14. The method of claim 1 , wherein modifying the performance parameter of the pulsed light beam comprises modifying one or more of a spectral feature, an error of a spectral feature, an energy of the pulsed light beam, a dose of the pulsed light beam, an error in a wavelength of the pulsed light beam, a bandwidth of the pulsed light beam, and a spectral shape of the pulsed light beam.

15. The method of claim 1 , further comprising correcting errors in patterning at the wafer based on modifying the performance parameter of the pulsed light beam.

16. The method of claim 15 , wherein the errors in the wafer patterning are corrected without modifying the lithography exposure apparatus.

17. The method of claim 15 , wherein the errors in the wafer patterning are corrected without modifying optical features or components within the lithography exposure apparatus.

18. The method of claim 1 , wherein modifying the performance parameter of the pulsed light beam comprises modifying a spectral feature of the pulsed light beam, the method further comprising generating an estimate of a spectral feature each time the light beam property is received.

19. The method of claim 1 , wherein the light beam property is received at each field of the wafer, the field being a fraction of the total area of the wafer exposed and that area of the wafer that is exposed in one scan of an exposure window.

20. The method of claim 1 , wherein producing the pulsed light beam comprises perturbing a spectral shape of the pulsed light beam on a pulse-to-pulse basis.

21. The method of claim 20 , wherein perturbing the spectral shape of the pulsed light beam on a pulse-to-pulse basis comprises shifting a central wavelength of each pulse of the light beam from a baseline wavelength in a predefined repeating pattern.

22. The method of claim 21 , wherein modifying the performance parameter of the pulsed light beam comprises modifying how much the central wavelength of each pulse of the light beam is shifted from the baseline wavelength.

23. The method of claim 1 , further comprising, before scanning the wafer:
measuring the wafer physical property within a scan at each exposure field of one or more previously exposed wafers; and
creating a table that correlates each measured wafer physical property for each exposure field across an entire wafer that is exposed with the pulsed light beam.

24. The method of claim 23 , wherein determining the value of the wafer physical property comprises receiving the measured wafer physical prope

Assignees

• Cymer LLC

Inventors

• Lalovic Ivan
• Zurita Omar
• Rechtsteiner Gregory Allen
• Alagna Paolo
• Hsieh Simon
• Lee Jason J
• Rokitski Rostislav
• Jiang Rui

Classifications

• G03F7/70041

  by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control · CPC title

• G03F7/70358 Primary

  Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging · CPC title