Wafer inspection recipe setup

Patent metadata

Field	Value
Publication number	US-9714905-B1
Application number	US-201414311270-A
Country	US
Kind code	B1
Filing date	Jun 21, 2014
Priority date	Jun 23, 2013
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

Methods and systems for setting up a wafer inspection recipe are provided. Inspection results produced by complete wafer inspection recipe candidates, each of which includes one or more optical mode candidates with at least one set of defect detection parameters, are compared to determine which of the complete wafer inspection recipe candidates is the best for use as the wafer inspection recipe. The method does not involve making any decisions regarding performance of the complete wafer inspection recipe candidates until after the inspection results have been compared. In other words, the method does not involve selecting optical mode(s) that will be used in the wafer inspection recipe followed by selecting the defect detection parameters for the selected optical mode(s). In this manner, a greater number of optical mode and defect detection parameters can be considered in an efficient manner to determine the best wafer inspection recipe for any given wafer.

First claim

What is claimed is:

1. A method for setting up a wafer inspection recipe, comprising:
scanning a wafer with a wafer inspection tool and a number of optical mode candidates for the wafer inspection recipe thereby generating output for the wafer for each of the optical mode candidates;
for a first of the optical mode candidates, applying different sets of defect detection parameters to the output generated with the first of the optical mode candidates thereby producing different inspection results for the first of the optical mode candidates, wherein the defect detection parameters are included in defect detection algorithms used with the output generated by scanning the wafer to generate the different inspection results for the wafer, and wherein at least some of the different sets of defect detection parameters are determined based on input from a user;
storing the first of the optical mode candidates with each of the different sets of defect detection parameters as one or more of a number of complete wafer inspection recipe candidates;
repeating the applying and storing steps for at least one other of the optical mode candidates;
comparing the inspection results generated with the complete wafer inspection recipe candidates to each other, wherein no decisions regarding performance of the complete wafer inspection recipe candidates are made until after the comparing step is performed;
determining which of the complete wafer inspection recipe candidates produced the inspection results that are the best based on results of said comparing;
selecting the complete wafer inspection recipe candidate that produced the best inspection results for use as the wafer inspection recipe, wherein the applying, storing, comparing, determining, and selecting steps are performed with one or more computer systems; and
comparing the inspection results generated with the complete wafer inspection recipe candidates to requirements for the inspection results received from the user and eliminating any of the complete wafer inspection recipe candidates that did not produce inspection results that meet the requirements from the determining and selecting steps.

2. The method of claim 1 , wherein not all of the complete wafer inspection recipe candidates are previously used wafer inspection recipes.

3. The method of claim 1 , wherein the optical mode candidates comprise all possible optical modes for use in the wafer inspection recipe.

4. The method of claim 1 , wherein at least some of the optical mode candidates are determined based on input from a user.

5. The method of claim 1 , further comprising selecting at least some of the optical mode candidates and the different sets of defect detection parameters based on a wafer inspection recipe received as the input from the user.

6. The method of claim 1 , further comprising selecting at least some of the optical mode candidates and the different sets of defect detection parameters based on a wafer inspection recipe received as the input from the user with an instruction to generate two or more of the complete wafer inspection recipe candidates that are similar to the wafer inspection recipe received from the user.

7. The method of claim 1 , further comprising selecting at least some of the optical mode candidates and the different sets of defect detection parameters based on a wafer inspection recipe received as the input from the user, wherein the wafer inspection recipe received from the user was selected for use as the wafer inspection recipe in a previously performed iteration of the method.

8. The method of claim 1 , wherein applying the different sets of defect detection parameters to the output comprises comparing the inspection results produced with a first of the different sets to user-specified targets for the inspection results, altering the first of the different sets based on results of comparing the inspection results produced with the first of the different sets thereby generating a second of the different sets of defect detection parameters, and performing the steps of the applying step with the second of the different sets.

9. The method of claim 1 , wherein at least some of the complete wafer inspection recipe candidates are received as the input from the user.

10. The method of claim 1 , wherein the selecting step does not comprise selecting optical parameters for use in the wafer inspection recipe followed by selecting defect detection parameters for use in the wafer inspection recipe.

11. The method of claim 1 , wherein the method does not comprise selecting optical parameters for use in the wafer inspection recipe followed by selecting defect detection parameters for use in the wafer inspection recipe.

12. The method of claim 1 , wherein the method does not comprise eliminating any of the complete wafer inspection recipe candidates prior to comparing the inspection results generated with the complete wafer inspection recipe candidates to each other.

13. The method of claim 1 , wherein the inspection results that are compared do not comprise signal-to-noise ratios generated for defects on the wafer by more than one of the complete wafer inspection recipe candidates.

14. The method of claim 1 , wherein the inspection results comprise multiple types of information for the wafer generated by each of the complete wafer inspection recipe candidates and for performance of the complete wafer inspection recipe candidates.

15. The method of claim 1 , wherein the inspection results comprise information for different types of defects detected on the wafer by each of the complete wafer inspection recipe candidates.

16. A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for setting up a wafer inspection recipe, wherein the computer-implemented method comprises:
scanning a wafer with a wafer inspection tool and a number of optical mode candidates for the wafer inspection recipe thereby generating output for the wafer for each of the optical mode candidates;
for a first of the optical mode candidates, applying different sets of defect detection parameters to the output generated with the first of the optical mode candidates thereby producing different inspection results for the first of the optical mode candidates, wherein the defect detection parameters are included in defect detection algorithms used with the output generated by scanning the wafer to generate the different inspection results for the wafer, and wherein at least some of the different sets of defect detection parameters are determined based on input from a user;
storing the first of the optical mode candidates with each of the different sets of defect detection parameters as one or more of a number of complete wafer inspection recipe candidates;
repeating the applying and storing steps for at least one other of the optical mode candidates;
comparing the inspection results generated with the complete wafer inspection recipe candidates to each other, wherein no decisions regarding performance of the complete wafer inspection recipe candidates are made until after the comparing step is performed;
determining which of the complete wafer inspection recipe candidates produced the inspection results that are the best based on results of said comparing;
selecting the complete wafer inspection recipe candidate that produced the best inspection results for use as the wafer inspection recipe; and
comparing the inspection results generated with the complete wafer inspection recipe candidates to requirements for the in

Assignees

• Kla Tencor Corp
• Kla Tencor Corp

Inventors

• Plihal Martin
• Gupta Deepak
• Anantha Vidyasagar
• Vijayaraman Premkumar
• Deenadayalan Lakshman

Classifications

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G01N21/9501 Primary

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

• G05B2219/37224

  Inspect wafer · CPC title

• G05B19/41875 Primary

  characterised by quality surveillance of production · CPC title