Hardmask composition, hardmask layer, and method of forming patterns
US-2024377746-A1 · Nov 14, 2024 · US
US9711360B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9711360-B2 |
| Application number | US-201615203032-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 6, 2016 |
| Priority date | Aug 27, 2015 |
| Publication date | Jul 18, 2017 |
| Grant date | Jul 18, 2017 |
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Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of boron-containing amorphous carbon films on a substrate with reduced particle contamination. In one implementation, the method comprises flowing a hydrocarbon-containing gas mixture into a processing volume having a substrate positioned therein, flowing a boron-containing gas mixture into the processing volume, stabilizing the pressure in the processing volume for a predefined RF-on delay time period, generating an RF plasma in the processing volume after the predefined RF-on delay time period expires to deposit a boron-containing amorphous film on the substrate, exposing the processing volume of the process chamber to a dry cleaning process and depositing an amorphous boron season layer over at least one surface in the processing volume of the process chamber.
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The invention claimed is: 1. A method, comprising: flowing a hydrocarbon-containing gas mixture into a processing volume having a substrate positioned therein; flowing a boron-containing gas mixture into the processing volume; stabilizing a pressure in the processing volume for a predefined RF-on delay time period; generating an RF plasma in the processing volume after the predefined RF-on delay time period expires to deposit a boron-containing amorphous film on the substrate; exposing the processing volume to a dry cleaning process; and depositing an amorphous boron season layer over at least one surface in the processing volume. 2. The method of claim 1 , wherein the predefined RF-on delay time period is a fixed time delay defined as the time period between flowing the boron-containing gas mixture into the processing volume and generating the RF plasma. 3. The method of claim 2 , wherein a length of the predefined RF-on delay time period is selected so that the boron-containing gas mixture does not begin to thermally decompose or substantially thermally decompose in the processing volume. 4. The method of claim 1 , wherein flowing the hydrocarbon-containing gas mixture into the processing volume having the substrate positioned therein, flowing the boron-containing gas mixture into the processing volume, and stabilizing the pressure in the processing volume for the predefined RF-on delay time period at least partially overlap. 5. The method of claim 1 , wherein the predefined RF-on delay time period is between about 0.1 seconds and 5 seconds. 6. The method of claim 1 , wherein stabilizing the pressure in the processing volume for the predefined RF-on delay time period further comprises: measuring a pressure variation in the processing volume caused by the flowing the boron-containing gas mixture into the processing volume; comparing the pressure variation to a predetermined pressure band; and generating the RF plasma in the processing volume after the predefined RF-on delay time period expires if the pressure variation is less than or falls within the predetermined pressure band. 7. The method of claim 6 , wherein the predetermined pressure band is from about 0.05 Torr to about 0.5 Torr. 8. The method of claim 1 , wherein the dry cleaning process comprises: delivering a fluorine-containing gas, an oxidizing gas, or mixture thereof into the processing volume; forming a plasma via a remote plasma source; and delivering the plasma to the processing volume. 9. The method of claim 1 , wherein depositing the amorphous boron season layer comprises: flowing a second boron-containing gas mixture into the processing volume; and thermally decomposing the second boron-containing gas mixture to deposit the amorphous boron season layer over the at least one surface in the processing volume. 10. The method of claim 9 , wherein the amorphous boron season layer has a thickness between about 300 Å and about 1,500 Å. 11. A method, comprising: flowing a hydrocarbon-containing gas mixture into a processing volume having a substrate positioned therein; flowing a boron-containing gas mixture into the processing volume; stabilizing a pressure in the processing volume for a predefined RF-on delay time period; and generating an RF plasma in the processing volume after the predefined RF-on delay time period expires to deposit a boron-containing amorphous film on the substrate. 12. The method of claim 11 , wherein the predefined RF-on delay time period is a fixed time delay defined as the time period between flowing the boron-containing gas mixture into the processing volume and generating the RF plasma. 13. The method of claim 12 , wherein a length of the predefined RF-on delay time period is selected so that the boron-containing gas mixture does not begin to thermally decompose or substantially thermally decompose in the processing volume. 14. The method of claim 11 , wherein flowing the hydrocarbon-containing gas mixture into the processing volume having the substrate positioned therein, flowing the boron-containing gas mixture into the processing volume, and stabilizing the pressure in the processing volume for the predefined RF-on delay time period at least partially overlap. 15. The method of claim 11 , wherein the predefined RF-on delay time period is between about 0.1 seconds and about 5 seconds. 16. The method of claim 11 , wherein stabilizing the pressure in the processing volume for the predefined RF-on delay time period further comprises: measuring a pressure variation in the processing volume caused by the flowing the boron-containing gas mixture into the processing volume; comparing the pressure variation to a predetermined pressure band; and generating the RF plasma in the processing volume after the predefined RF-on delay time period expires if the pressure variation is less than or falls within the predetermined pressure band. 17. The method of claim 16 , wherein the predetermined pressure band is from about 0.05 Torr to about 0.5 Torr. 18. A method, comprising: flowing a hydrocarbon-containing gas mixture into a processing volume having a substrate positioned therein, wherein the hydrocarbon-containing gas mixture comprises propene (C 3 H 6 ); flowing a boron-containing gas mixture into the processing volume, wherein the boron-containing gas mixture comprises diborane (B 2 H 6 ) and at least one of nitrogen (N 2 ), helium, argon, and hydrogen (H 2 ); stabilizing a pressure in the processing volume for a predefined RF-on delay time period, comprising: measuring a pressure variation in the processing volume caused by the flowing the boron-containing gas mixture into the processing volume; and comparing the pressure variation to a predetermined pressure band; and generating an RF plasma in the processing volume after the predefined RF-on delay time period expires if the pressure variation is less than or falls within the predetermined pressure band to deposit a boron-containing amorphous film on the substrate, wherein the predefined RF-on delay time period is a fixed time delay defined as the time period between flowing the boron-containing gas mixture into the processing volume and generating the RF plasma. 19. The method of claim 18 , wherein the predefined RF-on delay time period is between about 0.1 seconds and about 5 seconds. 20. The method of claim 19 , wherein the predetermined pressure band is from about 0.05 Torr to about 0.5 Torr.
characterised by the processes involved to create the masks · CPC title
characterised by their behaviours during the lithography processes, e.g. soluble masks or redeposited masks · CPC title
characterised by their composition, e.g. multilayer masks · CPC title
of materials not containing Si, e.g. PZT or Al2O3 · CPC title
by chemical means · CPC title
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