Determining a configuration for an optical element positioned in a collection aperture during wafer inspection

Patent metadata

Field	Value
Publication number	US-9709510-B2
Application number	US-201514749564-A
Country	US
Kind code	B2
Filing date	Jun 24, 2015
Priority date	Jun 26, 2014
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

First claim

What is claimed is:

1. A system configured to determine a configuration for an optical element positioned in a collection aperture during wafer inspection, comprising:
a light source configured to generate light that is directed to the wafer;
an optical element positioned in a collection pupil plane, wherein the optical element comprises a set of collection apertures;
a detector configured to detect light from the wafer that passes through the optical element when the optical element has different configurations thereby generating different images for the different configurations, wherein at least one of the different configurations comprises only a single collection aperture in the set, and wherein at least another of the different configurations comprises two of the collection apertures in the set; and
a computer subsystem configured for:
constructing one or more additional images from two or more of the different images, wherein the two or more different images used to generate any one of the one or more additional images do not comprise only the different images generated for single collection apertures in the set;
determining one or more characteristics of the different images and the one or more additional images;
comparing the one or more characteristics of the different images and the one or more additional images;
selecting one of the different or additional configurations for the optical element for inspection of the wafer based on results of said comparing;
determining phase shift between the light scattered at different directions from the wafer based on the different images; and
determining one or more parameters of a phase contrast filter for use in the system during the inspection of the wafer based on the determined phase shift.

2. The system of claim 1 , wherein the collection apertures comprise three or more slots, wherein each of the three or more slots extends across an entirety of the collection pupil plane in a first dimension, and wherein the set of collection apertures extends across an entirety of the collection pupil plane in a second dimension perpendicular to the first dimension.

3. The system of claim 1 , wherein the collection apertures comprise two or more sets of slots, wherein the slots in each of the two or more sets extends across only a portion of the collection pupil plane in a first dimension, and wherein each of the two or more sets of slots extends across an entirety of the collection pupil plane in a second dimension perpendicular to the first dimension.

4. The system of claim 1 , wherein the light generated by the light source is incoherent light.

5. The system of claim 1 , wherein the light generated by the light source is coherent light.

6. The system of claim 1 , wherein said selecting comprises selecting the one of the different or additional configurations that produced the best values of the one or more characteristics for maximizing detection of defects of interest on the wafer.

7. The system of claim 1 , wherein said selecting comprises selecting the one of the different or additional configurations that produced the best values of the one or more characteristics for minimizing detection of nuisance defects on the wafer.

8. The system of claim 1 , wherein the collection apertures are openings that can be created in the optical element by moving one or more portions of the optical element out of the collection pupil plane.

9. The system of claim 1 , wherein the collection apertures are light blocking regions that can be created in the optical element by moving one or more portions of the optical element into the collection pupil plane.

10. The system of claim 1 , wherein the set of collection apertures comprises a regular array of the collection apertures.

11. The system of claim 1 , wherein the different images are further generated for predetermined locations of defects on the wafer.

12. The system of claim 1 , wherein the different images are further generated with predetermined parameters for the light source, the detector, and any other optical elements of the system.

13. The system of claim 1 , wherein the different images are further generated with different parameters for at least one of the light source, the detector, and any other optical elements of the system thereby generating different images for the different configurations and the different parameters, and wherein said selecting comprises selecting one combination of the one of the different or additional configurations for the optical element and one or more of the different parameters for the inspection of the wafer based on the results of said comparing.

14. The system of claim 1 , wherein the different configurations further comprise all possible combinations of the collection apertures in the set.

15. The system of claim 1 , wherein the system is further configured to cause the optical element to have the different configurations by stepping a square aperture across the collection pupil plane.

16. The system of claim 1 , further comprising an illumination aperture positioned in a path of the generated light that is directed to the wafer, wherein the different images are further generated with different parameters for the illumination aperture.

17. The system of claim 16 , wherein the different configurations for the optical element are determined based on the different parameters for the illumination aperture to thereby block specularly reflected light from the wafer due to illumination of the wafer with the different parameters for the illumination aperture.

18. The system of claim 17 , wherein the different configurations for the optical element are determined based on the different parameters for the illumination aperture to thereby block diffraction orders of the light from the wafer due to illumination of the wafer with the different parameters for the illumination aperture.

19. The system of claim 17 , wherein, while the illumination aperture has one set of the different parameters for the illumination aperture, the different images are further generated with the different configurations for the optical element.

20. The system of claim 1 , further comprising an illumination aperture positioned in a path of the generated light that is directed to the wafer, wherein the different images are further generated with different parameters for the illumination aperture by stepping a square aperture opening across an illumination pupil plane.

21. The system of claim 20 , wherein the different configurations for the optical element are created by stepping a single light blocking element across the collection pupil plane based on the stepping of the square aperture opening across the illumination pupil plane to thereby block specularly reflected light from the wafer due to illumination of the wafer with the different parameters for the illumination aperture.

22. The system of claim 21 , wherein the different configurations for the optical element are created by placing one or more additional light blocking elements in the collection pupil plane based on the stepping of the square aperture opening across the illumination pupil plane to thereby block diffraction orders of the light from the wafer due to illumination of the wafer with the different parameters for the illumination aperture.

23. The system of claim 21 , wherein, while the illumination aperture has one set of the different parameters for the illumination aperture, the different images

Assignees

• Kla Tencor Corp
• Kla Tencor Corp

Inventors

• Kolchin Pavel
• Haurylau Mikhail
• Wei Junwei
• Kapp Dan
• Danen Robert
• Chen Grace

Classifications

• G01N2021/8887

  based on image processing techniques · CPC title

• G01N21/9501 Primary

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

• G01N21/956

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title

• G01N21/95623

  using a spatial filtering method (per se G02B) · CPC title

• G01N2201/0668

  Multiple paths; optimisable path length · CPC title