Slurry for chemical-mechanical polishing of metals and use thereof

Patent metadata

Field	Value
Publication number	US-9708508-B2
Application number	US-201514733235-A
Country	US
Kind code	B2
Filing date	Jun 8, 2015
Priority date	Sep 23, 2011
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.

First claim

What is claimed is:

1. A slurry composition, comprising:
between about 0.5% by weight and about 6% by weight abrasive particles;
between about 1 gm/liter and about 50 gm/liter of ferric nitrate;
between about 0.1 ml/liter and about 100 ml/liter of surfactant anion;
between about 0.003 ml/liter and about 3.05 ml/liter of octanol; and
water as a diluent.

2. The slurry composition of claim 1 , wherein said surfactant anion is octyl sulfate.

3. The slurry composition of claim 1 , further comprising:
between about 0.001 gm/liter and about 5 gm/liter of a chloride ion source; and
between about 0.001 gm/liter and about 20 gm/liter of a sulfate ion source.

4. The slurry composition of claim 1 , further comprising:
between about 0.1 gm/liter and about 5 gm/liter of a copper corrosion inhibitor.

5. The slurry composition of claim 1 , wherein there is less than 1% by weight in total of one or more of sodium citrate, sodium nitrate, Na 2 HPO 4 , sodium oxalate, and NaSiF 6 in said slurry composition.

6. The slurry composition of claim 1 , wherein there is less than 1% by weight of organic amine or ammonium ion (NH 4 +) in said slurry composition.

7. A slurry composition, consisting essentially of:
between about 0.5% by weight and about 6% by weight abrasive particles;
between about 1 gm/liter and about 50 gm/liter of ferric nitrate;
between about 0.1 ml/liter and about 100 ml/liter of surfactant anion;
between about 0.003 ml/liter and about 3.05 ml/liter of octanol; and
water as a diluent.

8. The slurry composition of claim 7 , wherein said surfactant anion is octyl sulfate.

9. The slurry composition of claim 7 , wherein there is less than 1% by weight in total of one or more of sodium citrate, sodium nitrate, Na 2 HPO 4 , sodium oxalate, and NaSiF 6 in said slurry composition.

10. The slurry composition of claim 7 , wherein there is less than 1% by weight of organic amine or ammonium ion (NH 4 +) in said slurry composition.

11. The slurry composition of claim 7 , further comprising:
between about 0.1 gm/liter and about 5 gm/liter of a copper corrosion inhibitor.

12. The slurry composition of claim 7 , further comprising:
between about 0.001 gm/liter and about 5 gm/liter of a chloride ion source; and
between about 0.001 gm/liter and about 20 gm/liter of a sulfate ion source.

13. A slurry composition, comprising:
abrasive particles;
ferric nitrate;
a surfactant anion;
octanol; and
water as a diluent.

14. The slurry composition of claim 13 , wherein said surfactant anion is octyl sulfate.

15. The slurry composition of claim 13 , further comprising:
a chloride ion source; and
a sulfate ion source.

16. The slurry composition of claim 13 , further comprising:
a copper corrosion inhibitor.

Assignees

• Globalfoundries Inc

Inventors

• Bates Graham M
• Brigham Michael T
• Comeau Joseph K
• Ritter Jason P
• Tiersch Matthew T
• Shah Eva A
• White Eric J

Classifications

• H10P52/403 Primary

  of conductive or resistive materials · CPC title

• H10W20/062

  by smoothing of conductive parts, e.g. by planarisation · CPC title

• C09K3/1463

  Aqueous liquid suspensions · CPC title

• C09G1/02

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

• C09G1/04 Primary

  Aqueous dispersions (C09G1/02 takes precedence) · CPC title