Electronic component mounting system and electronic component mounting method

Patent metadata

Field	Value
Publication number	US-9706695-B2
Application number	US-201213578364-A
Country	US
Kind code	B2
Filing date	Mar 2, 2012
Priority date	Jul 28, 2011
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

In an electronic component mounting system 1 configured by coupling electronic component mounting devices M 1 to M 4 A each having a first substrate transport mechanism 12 A and a second substrate transport mechanism 12 B together, the electronic component mounting device M 4 A includes a first tray feeder 20 A that stores an electronic component extracted by a first mounting head 15 A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20 B that stores an electronic component extracted by a second mounting head 15 B of a component mounting mechanism as a second work operation mechanism.

First claim

The invention claimed is:

1. An electronic component mounting system configured by coupling a plurality of component mounting devices that each conducts a component mounting work for mounting an electronic component on a substrate,
the electronic component mounting system comprising:
a mode instruction unit configured to instruct one or more of the plurality of the component mounting devices to execute a first work mode and concurrently one or more of the plurality of the component mounting devices to execute a second work mode which is different from the first work mode;
a communication unit connected to the mode instruction unit and each of the plurality of the component mounting devices to communicate one of the first or second work mode to each of the plurality of the component mounting devices; and
the plurality of component mounting devices, each of the component mounting devices comprising:
a first substrate transport mechanism and a second substrate transport mechanism each transporting a substrate delivered from an upstream device in a substrate transport direction, and having a substrate holding unit that positions and holds the substrate; and
a first work operation mechanism and a second work operation mechanism that are disposed in correspondence with the first substrate transport mechanism and the second substrate transport mechanism, respectively, and each executes a given work operation on the substrate held by the substrate holding unit,

wherein at least one of the component mounting devices serves as an electronic component mounting device that includes a first tray feeder that stores an electronic component and a second tray feeder that stores an electronic component, and the at least one of the component mounting devices further comprises a first mounting head that extracts the electronic component stored in the first tray feeder as the first work operation mechanism and a second mounting head that extracts the electronic component stored in the second tray feeder as the second work operation mechanism.

2. The electronic component mounting system according to claim 1 ,
wherein each of the component mounting devices includes a work controller that controls the first substrate transport mechanism, the second substrate transport mechanism, the first work operation mechanism, and the second work operation mechanism according to the instruction sent from the mode instruction unit to selectively execute the first work mode or the second work mode, in the first work mode, one of the work operation mechanisms executes a work operation on only a substrate held by the substrate holding unit of the substrate transport mechanism corresponding to the work operation mechanism, in the second work mode, one of the work operation mechanisms executes the work operation on both of two substrates held by the substrate holding units of the substrate transport mechanism and the other substrate transport mechanism,
wherein the first tray feeder and the second tray feeder are used for the component mounting work to be executed on both of the two substrates held by the substrate holding units of the first substrate transport mechanism and the second substrate transport mechanism of the at least one electronic component mounting device.

3. The electronic component mounting system according to claim 1 , wherein the first tray feeder is disposed together with a first other-type parts feeder and the second tray feeder is disposed together with a second other-type parts feeder, the first tray feeder is the same type of parts feeder as the second tray feeder, the first other-type parts feeder is the same type of parts feeder as the second other-type parts feeder, and a first set of the first tray feeder and the first other-type parts feeder is disposed point-symmetrically to a second set of the second tray feeder and the second other-type parts feeder with respect to a center of the at least one electronic component mounting device in a plan view,
wherein the first tray feeder and the first other-type parts feeder are aligned substantially in line to be parallel to the substrate transport direction and the second tray feeder and the second other-type parts feeder are aligned substantially in line to be parallel to the substrate transport direction.

4. The electronic component mounting system according to claim 3 , wherein each of the first other-type feeder and the second other-type feeder is a tape feeder.

5. The electronic component mounting system according to claim 3 , wherein each of the first tray feeder and the second tray feeder comprises a tray storage unit that stores a plurality of trays that accommodates the electronic component and tray holding unit that extracts each of the plurality of the trays to a pickup position.

6. The electronic component mounting system according to claim 3 , wherein the first tray feeder comprises different electronic components from the electronic components comprised in the second tray feeder, and the first other-type feeder comprises different electronic components from the electronic components comprised in the second other-type feeder.

7. An electronic component mounting method for mounting an electronic component on a substrate by an electronic component mounting system configured by coupling a plurality of component mounting devices that each conducts a component mounting work,
the method comprising:
instructing one or more of the plurality of the component mounting devices to execute a first work mode and concurrently one or more of the plurality of the component mounting devices to execute a second work mode which is different from the first work mode; and
connecting a mode instruction unit and each of the plurality of the component mounting devices to communicate one of the first or second work mode to each of the plurality of the component mounting devices,
wherein each of the plurality of component mounting devices comprising:
a first substrate transport mechanism and a second substrate transport mechanism each transporting a substrate delivered from an upstream device in a substrate transport direction, and having a substrate holding unit that positions and holds the substrate; and
a first work operation mechanism and a second work operation mechanism that are disposed in correspondence with the first substrate transport mechanism and the second substrate transport mechanism, respectively, and each executes a given work operation on the substrate held by the substrate holding unit,
wherein at least one of the component mounting devices serves as an electronic component mounting device that includes a first tray feeder that stores an electronic component and a second tray feeder that stores an electronic component, and the at least one of the component mounting devices further comprises a first mounting head that extracts the electronic component stored in the first tray feeder as the first work operation mechanism and a second mounting head that extracts the electronic component stored in the second tray feeder as the second work operation mechanism.

8. The electronic component mounting method according to claim 7 ,
wherein each of the component mounting devices includes a work controller that controls the first substrate transport mechanism, the second substrate transport mechanism, the first work operation mechanism, and the second work operation mechanism according to the instruction sent from the mode instruction unit to selectively execute any one of the first work mode or the second work mode, in the first work mode, one of the work operation mechanisms executes a work operation on only a substrate held by the substrate holding unit of the substrate transport mechanism corresponding to the work operation m

Assignees

• Yagi Shuzo
• Tamura Takashi
• Yamamoto Hiroki
• Ikeda Toru
• Kishikawa Kazuhiro
• Panasonic Ip Man Co Ltd

Inventors

• Yagi Shuzo
• Tamura Takashi
• Yamamoto Hiroki
• Ikeda Toru
• Kishikawa Kazuhiro

Classifications

• Y10T29/53174

  Means to fasten electrical component to wiring board, base, or substrate · CPC title

• H05K13/0411 Primary

  having multiple mounting heads · CPC title

• H05K13/0434 Primary

  with containers · CPC title

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

• H05K13/0452 Primary

  Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place (H05K13/0406, H05K13/041 take precedence) · CPC title