Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body

Patent metadata

Field	Value
Publication number	US-9706673-B2
Application number	US-201414527947-A
Country	US
Kind code	B2
Filing date	Oct 30, 2014
Priority date	Oct 31, 2013
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the base, and an opening area of the groove on the inner space side which is greater than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

First claim

What is claimed is:

1. A manufacturing method of an electronic device that accommodates an electronic component in an inner space formed by a base and a lid body, the manufacturing method comprising:
preparing the lid body in which a groove is provided on a surface which is welded with the base, the groove having a first opening on an inner space side of the lid body and a second opening on an outer periphery side of the lid body;
first welding the base and the lid body at a portion excluding an unwelded portion that includes at least a part of the groove, of a planned welding portion of the base and the lid body, in a state in which the inner space has air communication with an outside through the groove; and
second welding the base and the lid body at the unwelded portion such that the second opening of the groove is closed in a state in which the inner space has no air communication with the outside,
wherein the first opening has a first width in a plan view, the second opening has a second width in the plan view, and the first width is larger than the second width, and
part of the groove directly adjacent to the first opening is overlapped with the inner space in the plan view.

2. The manufacturing method of an electronic device according to claim 1 , further comprising:
exhausting air from the inner space to the outside through the groove between the first welding and the second welding.

3. An electronic device that is manufactured, using the manufacturing method according to claim 2 .

4. An electronic apparatus comprising:
an electronic device that is manufactured, using the manufacturing method according to claim 2 .

5. A moving object comprising:
an electronic device that is manufactured, using the manufacturing method according to claim 2 .

6. The manufacturing method of an electronic device according to claim 1 ,
wherein the groove continuously widens from the second opening on the outer periphery side toward the first opening on the inner space side.

7. An electronic device that is manufactured, using the manufacturing method according to claim 6 .

8. An electronic apparatus comprising:
an electronic device that is manufactured, using the manufacturing method according to claim 6 .

9. A moving object comprising:
an electronic device that is manufactured, using the manufacturing method according to claim 6 .

10. The manufacturing method of an electronic device according to claim 1 ,
wherein the first opening has a first height, the second opening has a second height, and the first height is larger than the second height.

11. An electronic device that is manufactured, using the manufacturing method according to claim 1 .

12. An electronic apparatus comprising:
an electronic device that is manufactured, using the manufacturing method according to claim 1 .

13. A moving object comprising:
an electronic device that is manufactured, using the manufacturing method according to claim 1 .

14. The manufacturing method of an electronic device according to claim 1 ,
wherein the groove widens in a stepwise manner from the second opening on the outer periphery side toward the first opening on the inner space side.

15. An electronic device that is manufactured, using the manufacturing method according to claim 14 .

16. An electronic apparatus comprising:
an electronic device that is manufactured, using the manufacturing method according to claim 14 .

17. A moving object comprising:
an electronic device that is manufactured, using the manufacturing method according to claim 14 .

18. The manufacturing method of an electronic device according to claim 1 ,
wherein the first opening has a first height, the second opening has a second height, and the first height is equal to the second height.

Assignees

• Seiko Epson Corp

Inventors

• Kawauchi Osamu
• Aoki Shinya
• Matsuzawa Juichiro
• Mikami Masaru

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• B23K11/06 Primary

  using roller electrodes · CPC title

• B23K26/244

  Overlap seam welding · CPC title

• H05K5/0239

  Electricity · mapped topic

• H01L2224/16225

  Electricity · mapped topic