Method of manufacturing electronic device, electronic device, electronic apparatus, and moving object

Patent metadata

Field	Value
Publication number	US-9291457-B2
Application number	US-201414164807-A
Country	US
Kind code	B2
Filing date	Jan 27, 2014
Priority date	Jan 30, 2013
Publication date	Mar 22, 2016
Grant date	Mar 22, 2016

Abstract

A method of manufacturing an electronic device in which an inner space for housing a gyro element is formed between a base and a lid and the base and the lid are bonded includes bonding the base and the lid in which a groove is provided on a surface to be bonded with the base so that the inner space communicates with the outside by not bonding the inner surface of the groove to the base and to position the groove around a concave portion provided on a side surface of the base, and closing a communication portion by irradiating a laser beam to the lid in the communication portion.

First claim

What is claimed is:

1. A method of manufacturing an electronic device in which an inner space for housing an electronic component is formed between a base and a lid body, and the base and the lid body are bonded, the method comprising:
preparing the base to have a base bonding surface at a periphery of the base;
preparing the lid body to have a lid bonding surface facing the inner space and a lid top surface opposite to the lid bonding surface, and a groove at a part of the lid bonding surface that is bonded with the base bonding surface of the base;
housing the electronic component in the inner space;
bonding the lid bonding surface of the lid body to the base bonding surface of the base so that the inner space communicates with a region exterior of the inner space via the groove;
exhausting an air in the inner space to the outer region via the groove; and
welding a part of the groove closed by applying an energy beam to the lid top surface located above the groove, wherein, during the welding step, the energy beam is in a state in which a part of an irradiation range of the energy beam is positioned outside the base bonding surface in a plan view.

2. The method of manufacturing an electronic device according to claim 1 , wherein
a concavity is provided on an outer side surface of the base, and
during the welding step of closing the part of the groove, the energy beam is in a state in which a part of the irradiation range of the energy beam is overlapped with the concavity in the plan view.

3. The method of manufacturing an electronic device according to claim 2 ,
wherein the concavity extends from the base bonding surface to a base bottom surface that is located opposite to the base bonding surface.

4. The method of manufacturing an electronic device according to claim 1 ,
wherein a bonding material is provided between the base bonding surface and the lid bonding surface,
in the bonding step, an outer edge of the bonding material is offset from an outer edge of the lid bonding surface so that the bonding material is exposed from the lid body in the plan view, and
during the welding step of closing the groove, a part of the irradiation range of the energy beam overlaps with an exposed portion of the bonding material exposed from the lid body in the plan view.

5. The method of manufacturing an electronic device according to claim 2 ,
wherein a bonding material is provided between the base bonding surface and the lid bonding surface, and the bonding material is provided over the concavity so that an outer edge of the bonding material overlaps with the concavity in the plan view,
in the bonding step, the outer edge of the bonding material is offset from an outer edge of the lid bonding surface so that the bonding material is exposed from the lid body in the plan view, and
during the welding step of closing the groove, a part of the irradiation range of the energy beam overlaps with an exposed portion of the bonding material exposed from the lid body in the plan view, and the exposed portion overlaps with the concavity in the plan view.

6. The method of manufacturing an electronic device according to claim 2 ,
wherein in the bonding step, an edge of the groove is spaced apart from the concavity in the plan view so that a part of the groove is located between the concavity and the inner space in the plan view.

7. The method of manufacturing an electronic device according to claim 1 ,
wherein in the welding step of closing the groove, the energy beam is applied toward the lid top surface located above the groove a plurality of times.

8. A method of manufacturing an electronic device in which an inner space for housing an electronic component is formed between a base and a lid body, and the base and the lid body are bonded, the method comprising:
preparing the base to have a base bonding surface at a periphery of the base;
preparing the lid body to have a lid bonding surface facing the inner space and a lid top surface opposite to the lid bonding surface, and a groove at a part of the lid bonding surface that is bonded with the base bonding surface of the base;
housing the electronic component in the inner space;
bonding the lid bonding surface of the lid body to the base bonding surface of the base by a bonding material so that the inner space communicates with a region exterior of the inner space via the groove, and an outer edge of the bonding material is offset from an outer edge of the lid bonding surface so that the bonding material is exposed from the lid body in the plan view; and
welding a part of the groove closed by applying an energy beam to the lid top surface located above the groove, wherein, during the welding step, the energy beam is in a state in which a part of an irradiation range of the energy beam overlaps with an exposed portion of the bonding material exposed from the lid body in the plan view.

Assignees

• Seiko Epson Corp

Inventors

• Aoki Shinya
• Matsuzawa Juichiro
• Kawauchi Osamu
• Mikami Masaru

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• G01C19/5783 Primary

  Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719 · CPC title

• H05K5/066

  sealed by fusion of the joining parts without bringing material; sealed by brazing · CPC title