Image sensor and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9704909-B2
Application number	US-201615072708-A
Country	US
Kind code	B2
Filing date	Mar 17, 2016
Priority date	Mar 25, 2015
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

An image sensor is provided. The sensor comprises a plurality of photoelectric conversion elements each including a charge accumulation region of a first conductivity type arranged in a semiconductor substrate and an element isolation region arranged between the charge accumulation regions adjacent to each other. The element isolation region includes an insulator isolation portion arranged on an inner side of a trench on a surface of the semiconductor substrate, and includes a semiconductor region of a second conductivity type opposite to the first conductivity type arranged along a side surface of the insulator isolation portion. A gettering region is arranged between the semiconductor region and the insulator isolation portion along at least a part of the side surface of the insulator isolation portion.

First claim

What is claimed is:

1. An image sensor comprising:
a plurality of photoelectric conversion elements each including a charge accumulation region of a first conductivity type arranged in a semiconductor substrate; and
an element isolation region arranged at least between the charge accumulation regions adjacent to each other,
wherein the element isolation region includes an insulator isolation portion arranged on an inner side of a trench on a surface of the semiconductor substrate, and includes a semiconductor region of a second conductivity type opposite to the first conductivity type, and the semiconductor region is arranged along a side surface of the insulator isolation portion,
wherein a gettering region is arranged between the semiconductor region and the insulator isolation portion, and the gettering region is arranged along at least a part of the side surface of the insulator isolation portion between the charge accumulation region and the side surface of the insulator isolation portion, and
wherein the gettering region contains at least one of carbon or germanium.

2. The sensor according to claim 1 , comprising:
a first region which has the charge accumulation region, a floating diffusion region, and a transfer gate configured to form a channel between the charge accumulation region and the floating diffusion region;
a second region which has an amplification transistor; and
a third region which has the element isolation region, the third region being arranged between the first region and the second region,
wherein between the first region and the element isolation portion of the third region, the gettering region is arranged between the semiconductor region and the insulator isolation portion along the side surface of the insulator isolation portion, and
wherein between the second region and the insulator isolation portion of the third region, the semiconductor region is arranged in contact with the insulator isolation portion along the side surface of the insulator isolation portion.

3. The sensor according to claim 1 , wherein a peak position of an impurity concentration in the gettering region is present between the surface of the semiconductor substrate and a peak position of an impurity concentration in the semiconductor region.

4. The sensor according to claim 1 , wherein an impurity concentration in the gettering region is lower than an impurity concentration in the semiconductor region at the same depth from the surface of the semiconductor substrate.

5. The sensor according to claim 1 , wherein a lower end of each charge accumulation region is deeper than a lower end of the gettering region.

6. The sensor according to claim 1 , wherein the element isolation region further includes a semiconductor isolation portion of the second conductivity type arranged in a position deeper than the semiconductor region,
wherein the gettering region is arranged in an inner side of the semiconductor isolation portion.

7. The sensor according to claim 1 , wherein the gettering region contains carbon.

8. The sensor according to claim 1 , wherein the gettering region contains one of oxygen and nitrogen.

9. A method of manufacturing an image sensor, the method comprising:
forming a trench on a surface of a semiconductor substrate;
forming a gettering region along a side surface of the trench by ion implantation of at least one of carbon or germanium;
forming a semiconductor region along the side surface of the trench by ion implantation of an impurity;
filling the trench with an insulator after the forming of the gettering region and the semiconductor region; and
forming a photoelectric conversion element adjacent to the semiconductor region,
wherein the gettering region is positioned between the insulator and the semiconductor region and between a side surface of the insulator and the photoelectric conversion element.

10. The method according to claim 9 , wherein the semiconductor region is formed after forming the gettering region.

11. The sensor according to claim 2 , wherein the gettering region is further arranged between the semiconductor region of the third region and the insulator isolation portion of the third region along at least a part of the side surface of the insulator isolation portion of the third region and between the floating diffusion region and the side surface of the insulator isolation portion of the third region.

12. The sensor according to claim 4 , wherein the impurity concentration in the gettering region is a concentration of at least one of carbon or germanium and the impurity concentration in the semiconductor region is a concentration of a p-type impurity.

13. The sensor according to claim 1 , wherein the image sensor comprises a well region of the second conductivity type, the charge accumulation region and the well region form a photodiode serving as the photoelectric conversion element, an impurity concentration in the semiconductor region is higher than an impurity concentration in the well region, and the semiconductor region is arranged between the gettering region and the charge accumulation region.

14. The sensor according to claim 2 , wherein in planar view to the semiconductor substrate, the gettering region and the semiconductor region surround the periphery of the first region, and the semiconductor region is arranged between the gettering region and the first region.

15. The sensor according to claim 2 , wherein between the second region and the insulator isolation portion of the third region, the gettering region is not arranged along the insulator isolation portion between the well region and the insulator isolation portion.

16. The sensor according to claim 2 , wherein in planar view to the semiconductor substrate, a periphery of the second region is surrounded by the well region and is not surrounded by the gettering region.

17. The sensor according to claim 1 , wherein a position where a concentration half the peak of the impurity concentration in the charge accumulation region is obtained is deeper than a position where a concentration half the peak of the impurity concentration in the gettering region is obtained.

18. The sensor according to claim 1 , wherein the gettering region is also arranged throughout inside of the insulator isolation portion.

Assignees

• Canon Kk

Inventors

• Kaneda Tasuku

Classifications

• H10W76/48

  Fillings including materials for absorbing or reacting with moisture or other undesired substances · CPC title

• H01L27/14643 Primary

  Electricity · mapped topic

• H01L27/1463

  Electricity · mapped topic

• H01L23/26

  Electricity · mapped topic

• H01L27/14689

  Electricity · mapped topic