Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
US9704773B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9704773-B2 |
| Application number | US-201113301617-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2011 |
| Priority date | Nov 21, 2011 |
| Publication date | Jul 11, 2017 |
| Grant date | Jul 11, 2017 |
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A method and system for selectively dissipating thermal energy are provided. The system includes a heat-generating structure, a first heat sink, a second heat sink, and a heat transfer element. The heat-generating structure generates thermal energy. The first heat sink is in thermal communication with the heat-generating structure. The heat transfer element is configured to be selectively positioned between the first heat sink and the second heat sink to establish a path for the transfer of thermal energy between the first heat sink and the second heat sink. Upon positioning the heat transfer element between the first heat sink and the second heat sink, at least a portion of the thermal energy from the heat-generating structure is allowed to travel through the first heat sink and through the heat transfer element to the second heat sink.
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What is claimed is: 1. A system for selectively dissipating thermal energy from a heat-generating structure, the system comprising: a first heat sink configured to be placed in thermal communication with the heat-generating structure; a second heat sink having an external surface exposed to an ambient environment; a third heat sink disposed in proximity to the second heat sink; and a heat transfer element housed within a chamber in contact with the first, second, and third heat sinks, the heat transfer element configured to move within the chamber between (i) a first position between the first heat sink and the second heat sink to establish a first path for a transfer of the thermal energy between the first heat sink and the second heat sink and (ii) a second position between the first heat sink and the third heat sink to establish a second path for a transfer of the thermal energy between the first heat sink and the third heat sink; wherein each heat sink is configured to sink thermal energy, wherein, upon positioning of the heat transfer element at the first position between the first heat sink and the second heat sink, the heat transfer element is configured to allow at least a portion of the thermal energy from the heat-generating structure to travel from the first heat sink through the heat transfer element to the second heat sink and the second heat sink is configured to transfer at least some of the thermal energy received by the second heat sink to the ambient environment, and wherein, upon positioning of the heat transfer element at the second position between the first heat sink and the third heat sink, the heat transfer element is configured to allow at least part of the thermal energy from the heat-generating structure to travel from the first heat sink through the heat transfer element to the third heat sink. 2. The system of claim 1 , wherein the heat transfer element is a fluid, and the first heat sink is configured to sink heat produced from the heat-generating structure independently of whether the heat transfer element establishes the first path for transfer of the thermal energy to the second heat sink. 3. The system of claim 2 , wherein the heat transfer element is a ferrofluid or is a fluid containing a colloidal suspension of magnetic particles. 4. The system of claim 3 , wherein the heat transfer element is configured to be moved with one or more magnets. 5. The system of claim 3 , wherein the heat transfer element is configured to be moved with one or more electromagnets. 6. The system of claim 1 , further comprising: a sensor configured to measure at least a temperature of the second heat sink, wherein the system is configured, in response to detecting that a threshold has been satisfied, to automatically position the heat transfer element at the first position between the first heat sink and the second heat sink, the threshold based on at least the temperature of the second heat sink; and wherein the system is configured, in response to detecting that the threshold has not been satisfied, to automatically position the heat transfer element at a location not at the first position between the first heat sink and the second heat sink. 7. The system of claim 6 , wherein the threshold is not satisfied when: the temperature of the second heat sink is lower than a first value; or a temperature differential between the second heat sink and the first heat sink is higher than a second value. 8. The system of claim 1 , wherein the heat transfer element is configured to be rotated into the first position between the first heat sink and the second heat sink. 9. The system of claim 1 , further comprising an actuator configured to move the heat transfer element between the first position and the second position. 10. A method for selectively dissipating thermal energy from a heat-generating structure, the method comprising: moving a heat transfer element within a chamber between (i) a first position between a first heat sink of a system and a second heat sink of the system to establish a first path for a transfer of the thermal energy between the first heat sink and the second heat sink and (ii) a second position between the first heat sink and a third heat sink of the system to establish a second path for a transfer of the thermal energy between the first heat sink and the third heat sink, wherein each heat sink is configured to sink thermal energy, the first heat sink in thermal communication with the heat-generating structure, the second heat sink having an external surface exposed to an ambient environment, the chamber being in contact with the first, second, and third heat sinks; when the heat transfer element is positioned at the first position between the first heat sink and the second heat sink, transferring at least a portion of the thermal energy from the heat-generating structure from the first heat sink through the heat transfer element to the second heat sink and transferring at least some of the thermal energy received by the second heat sink to the ambient environment; and when the heat transfer element is positioned at the second position between the first heat sink and the third heat sink, transferring at least a portion of the thermal energy from the heat-generating structure from the first heat sink through the heat transfer element to the third heat sink. 11. The method of claim 10 , wherein the heat transfer element is a fluid. 12. The method of claim 11 , wherein the heat transfer element is a ferrofluid or is a fluid containing a colloidal suspension of magnetic particles. 13. The method of claim 12 , wherein the heat transfer element is moved with one or more magnets. 14. The method of claim 12 , wherein the heat transfer element is moved with one or more electromagnets. 15. The method of claim 10 , further comprising: measuring a temperature of the second heat sink, upon detecting that a threshold has been satisfied, automatically initiating movement of the heat transfer element to the first position between the first heat sink and the second heat sink, the threshold based on at least the temperature of the second heat sink; and upon detecting that the threshold has not been satisfied, automatically initiating movement of the heat transfer element to a location not at the first position between the first heat sink and the second heat sink. 16. The method of claim 10 , further comprising: activating an actuator to move the heat transfer element to the first position between the first heat sink and the second heat sink, wherein the heat transfer element maintains its position at the first position between the first heat sink and the second heat sink after a deactivation of the actuator. 17. A system for selectively dissipating thermal energy from a heat-generating structure, the system comprising: a first heat sink configured to be placed in thermal communication with the heat-generating structure; a second heat sink having an external surface exposed to an ambient environment; a third heat sink disposed in proximity to the second heat sink; a heat transfer element housed within a chamber in contact with the first, second, and third heat sinks, the heat transfer element configured to be moved within the chamber between (i) a first position between the first heat sink and the second heat sink to establish a first path for a transfer of the thermal energy between the first heat sink and the second heat sink and (ii) a second position between the first heat sink and the third heat sink to establish a second path for a transfer
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