Ceramic electronic component
US-2024153709-A1 · May 9, 2024 · US
US9704621B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9704621-B2 |
| Application number | US-201414472650-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 29, 2014 |
| Priority date | Aug 30, 2013 |
| Publication date | Jul 11, 2017 |
| Grant date | Jul 11, 2017 |
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A chip resistor includes a base member, a resistive element formed on the base member, a first inner electrode held in contact with a first end portion or the resistive element, a second inner electrode held in contact with a second end portion of the resistive element, a first reverse surface electrode reaching a first end portion of the base member, and a second reverse surface electrode reaching a second end portion of the base member. The length of the first and the second reverse surface electrodes is in a range of 2/10 to 3/10 of the length of the base member. Also, the length of the first and the second reverse surface electrodes is greater than the length of the first and the second inner electrodes.
Opening claim text (preview).
The invention claimed is: 1. A chip resistor comprising: a base member including an obverse surface and a reverse surface opposite to the obverse surface, the base member also including a first side surface and a second side surface spaced apart from each other in a first direction; a resistive element formed on the obverse surface and including a first end portion and a second end portion spaced apart from each other in the first direction; a first inner electrode formed on the obverse surface and held in contact with the first end portion of the resistive element; a second inner electrode formed on the obverse surface and held in contact with the second end portion of the resistive element; a first reverse surface electrode formed on the reverse surface and reaching the first side surface of the base member; and a second reverse surface electrode formed on the reverse surface and spaced apart from the first reverse surface, the second reverse surface electrode reaching the second side surface of the base member; wherein a length of each of the first reverse surface electrode and the second reverse surface electrode measured in the first direction is in a range of 2/10 to 3/10 of a length of the base member measured in the first direction, and said length of each of the first reverse surface electrode and the second reverse surface electrode is greater than a length of each of the first inner electrode and the second inner electrode measured in the first direction, each of the first end portion and the second end portion of the resistive element has a curved upper surface, the first inner electrode being in contact with the curved upper surface of the first end portion, the second inner electrode being in contact with the curved upper surface of the second end portion, and the first inner electrode reaches the first side surface of the base member, and the second inner electrode reaches the second side surface of the base member. 2. The chip resistor according to claim 1 , wherein the first inner electrode includes a part overlapping on the first end portion of the resistive element such that a length of said part of the first inner electrode measured in the first direction is not greater than 1/14 of a length of the resistive element measured in the first direction, and the second inner electrode includes a part overlapping on the second end portion of the resistive element such that a length of said part of the second inner electrode measured in the first direction is not greater than 1/14 of the length of the resistive element measured in the first direction. 3. The chip resistor according to claim 1 , wherein the first inner electrode includes both a part overlapping on the first end portion of the resistive element and a remaining part, a length of the remaining part measured in the first direction being not greater than 1/16 of the length of the base member measured in the first direction, and wherein the second inner electrode includes both a part overlapping on the second end portion of the resistive element and a remaining part, a length of the remaining part of the second inner electrode measured in the first direction being not greater than 1/16 of the length of the base member measured in the first direction. 4. The chip resistor according to claim 3 , wherein the resistive element has a width measured in a second direction perpendicular to the first direction is in a range of ½ to 9/10 of a width of the obverse surface measured in the second direction. 5. The chip resistor according to claim 1 , further comprising an undercoat covering the resistive element. 6. The chip resistor according to claim 5 , further comprising an overcoat covering the undercoat. 7. The chip resistor according to claim 6 , further comprising a first groundwork electrode and a second groundwork electrode each held in contact with the overcoat, wherein the first groundwork electrode covers the first inner electrode, and the second groundwork electrode covers the second inner electrode. 8. The chip resistor according to claim 7 , wherein the first groundwork electrode being formed on the first side surface, the second groundwork electrode being formed on the second side surface. 9. The chip resistor according to claim 8 , wherein the first reverse surface electrode is electrically connected to the first groundwork electrode, and the second reverse surface electrode is electrically connected to the second groundwork electrode. 10. The chip resistor according to claim 9 , further comprising a first plating electrode and a second plating electrode, wherein the first plating electrode covers the first groundwork electrode and the first reverse surface electrode, and the second plating electrode covers the second groundwork electrode and the second reverse surface electrode. 11. The chip resistor according to claim 1 , wherein the length of the base member measured in the first direction is in a range of 1.0 to 3.2 mm, and a width of the base member measured in a second direction perpendicular to the first direction is in a range of 0.5 to 2.5 mm. 12. The chip resistor according to claim 11 , wherein the resistive element is formed with a trimming groove. 13. The chip resistor according to claim 12 , wherein the trimming groove includes a main portion and an additional portion, wherein the main portion extends from an initial point to a midway point, the initial point being set at an edge of the resistive element, the midway point being offset with respect to the initial point in both the first direction and the second direction, and wherein the additional portion extends from the midway point to an ending point that is offset from the midway point toward the initial point in the second direction. 14. The chip resistor according to claim 13 , wherein the additional portion extends at an angle of not greater than 90° with respect to the main portion. 15. The chip resistor according to claim 13 , wherein the main portion has an L-shaped form that includes a first portion extending from the initial point in the second direction, and a second portion extending from an end of the first portion in the first direction.
the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title
by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence) · CPC title
adapted for manufacturing resistor chips · CPC title
Thick film resistors · CPC title
the terminals or tapping points being coated on the resistive element · CPC title
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