Electroless copper plating compositions

Patent metadata

Field	Value
Publication number	US-9702046-B2
Application number	US-201614993791-A
Country	US
Kind code	B2
Filing date	Jan 12, 2016
Priority date	Jul 15, 2014
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.

First claim

What is claimed is:

1. A method comprising:
a) providing a substrate;
b) applying an electroless copper plating composition to the substrate, the electroless copper plating composition comprises one or more sources of copper ions, one or more chelating agents and one or more compounds chosen from 2,2-dimethoxyacetaldehyde, 2,2-diethoxyacetaldehyde, 2,2-dipropoxyacetaldehyde and 2,2-dibutoxyacetaldehyde; and
c) electroless plating copper on the substrate with the electroless copper plating composition.

2. The method of claim 1 , wherein the substrate comprises a plurality of through-holes and further comprising:
d) desmearing the through-holes; and
e) plating copper on walls of the through-holes with the electroless copper plating composition.

3. The method of claim 2 , wherein the substrate is a printed circuit board.

4. The method of claim 1 , wherein the electroless copper plating composition is free of environmentally unfriendly reducing agents.

5. The method of claim 1 , wherein the one or more compounds are in amounts of 1 g/L to 50 g/L.

6. The method of claim 5 , wherein the one or more compounds are in amounts of 5 g/L to 30 g/L.

Assignees

• Rohm & Haas Elect Mat
• Dow Global Technologies Llc

Inventors

• Laitar David S
• Li Crystal P L
• Chow Andy Lok-Fung

Classifications

• H05K3/181

  by electroless plating (adhesives therefor H05K3/387) · CPC title

• H05K3/422

  characterised by electroless plating method; pretreatment therefor · CPC title

• C23C18/40 Primary

  using reducing agents · CPC title

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title

• C23C18/1633

  Process of electroless plating · CPC title