Cooler with two substantially parallel flow chambers and three substantially parallel plates
US-2024003639-A1 · Jan 4, 2024 · US
Heat dissipation device with mounting structure
US8985196B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8985196-B2 |
| Application number | US-201113226462-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2011 |
| Priority date | Aug 17, 2011 |
| Publication date | Mar 24, 2015 |
| Grant date | Mar 24, 2015 |
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Abstract
Official abstract text for this publication.
A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; and a plurality of connection sections in the form of recesses formed on an outer surface of the main body at positions corresponding to the supports in the chamber. The mounting elements are connected to the connection sections. With these arrangements, the heat dissipation device with the mounting elements connected to one outer surface thereof can maintain the chamber in the main body in an airtight state and ensure tight contact of it with a heat-generating element.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat dissipation device with mounting structure, comprising: a main body having an outer surface and including an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; a wick structure layer provided on the first and the second side of the chamber; and a…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
- F28F3/12Primary
Mechanical Engineering · mapped topic
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Frequently asked questions
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- What does patent US8985196B2 cover?
- A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; and…
- Who is the assignee on this patent?
- Yang Hsiu-Wei, Asia Vital Components Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification F28F3/12. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Mar 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).