Light emitting device, package, and methods of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9698324-B2
Application number	US-201514921706-A
Country	US
Kind code	B2
Filing date	Oct 23, 2015
Priority date	Oct 24, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A light emitting device includes a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; and a light emitting element electrically connected to the lead frame. An outer side surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film.

First claim

What is claimed is:

1. A light emitting device comprising:
a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; and
a light emitting element electrically connected to the lead frame,
wherein an outer side surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film containing particles of a first light reflective substance,
wherein the first light reflective substance comprises particles of a white pigment, and
wherein the reflective film has a higher reflectance than the resin member.

2. The light emitting device according to claim 1 , wherein the resin member comprises a second light reflective substance in a light transmissive resin.

3. The light emitting device according to claim 1 , further comprising a light-transmissive member provided in the recess and covering the light emitting element.

4. The light emitting device according to claim 1 , wherein:
the first light reflective substance comprises nanoparticles having an average particle size in a range of 10 nm to 300 nm, and
the reflective film is a coagulation film of the nanoparticles.

5. The light emitting device according to claim 2 , wherein the second light reflective substance comprises particles having an average particle size in a range of 0.08 μm to 10 μm.

6. The light emitting device according to claim 1 , wherein the particles of the white pigment comprise TiO 2 .

7. The light emitting device according to claim 1 , wherein:
the recess is defined by two opposing thin wall portions, and two opposing thick wall portions that are thicker than the thin wall portions, and
the reflective film covers at least a portion of an outer surface of the thin wall portions.

8. The light emitting device according to claim 7 , wherein the lead frame extends from the bottom surface of the recess to a side of the outer surface of one of the thin wall portions.

9. The light emitting device according to claim 3 , wherein the light-transmissive member contains a wavelength conversion substance that converts light emitted from the light emitting element into light of different wavelength.

10. A package comprising:
a resin member having an inner side surface defining a recess; and
a lead frame supported by the resin member and arranged at a bottom surface of the recess,
wherein an outer surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film containing particles of a first light reflective substance,
wherein the first light reflective substance comprises particles of a white pigment, and
wherein the reflective film has a higher reflectance than the resin member.

11. The package according to claim 10 , wherein:
the recess is defined by two opposing thin wall portions, and two opposing thick wall portions that are thicker than the thin wall portions, and
the reflective film is provided to at least partially cover an outer surface of the thin wall portions.

12. The light emitting device according to claim 1 , wherein:
a thickness of the reflective film is in a range of 0.02 μm to 1.0 μm.

13. The light emitting device according to claim 1 , wherein:
the lead frame has an inner lead frame portion and an external lead frame portion, the external lead frame portion projecting from a bottom surface of the resin member and bending so as to extend along the bottom surface and side surfaces of the resin member.

14. The light emitting device according to claim 13 , wherein:
the reflective film is disposed only at an outer surface of an upper wall portion defining the recess.

15. A light emitting device comprising:
a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; and
a light emitting element electrically connected to the lead frame,
wherein an outer side surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film,
wherein the recess is defined by two opposing thin wall portions, and two opposing thick wall portions that are thicker than the thin wall portions, and
wherein the reflective film covers at least a portion of an outer surface of the thin wall portions.

16. A light emitting device comprising:
a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; and
a light emitting element electrically connected to the lead frame; and
a light-transmissive member provided in the recess and covering the light emitting element
wherein an outer side surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film, and
wherein the light-transmissive member contains a wavelength conversion substance that converts light emitted from the light emitting element into light of different wavelength.

17. A package comprising:
a resin member having an inner side surface defining a recess; and
a lead frame supported by the resin member and arranged at a bottom surface of the recess,
wherein an outer surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film,
wherein the recess is defined by two opposing thin wall portions, and two opposing thick wall portions that are thicker than the thin wall portions, and
wherein the reflective film is provided to at least partially cover an outer surface of the thin wall portions.

Assignees

• Nichia Corp

Inventors

• Abe Koji

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H01L33/62

  Electricity · mapped topic

• H01L2224/48247

  Electricity · mapped topic

• H01L33/60 Primary

  Electricity · mapped topic