Apparatus and method for forming electrical solder connections in a disk drive unit

Patent metadata

Field	Value
Publication number	US-9694442-B2
Application number	US-201213470432-A
Country	US
Kind code	B2
Filing date	May 14, 2012
Priority date	Mar 28, 2012
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

An apparatus for forming electrical solder connections in a disk drive unit includes: a nozzle device for carrying out soldering on two pre-welding surfaces; a solder ball feeding device for transferring a single solder ball to the nozzle device; a gas pump device for supplying pressurized gases to the nozzle device; a laser device for emitting laser beams to the solder ball; and a control device including at least one sensor for at least detecting status of the solder ball or pressure in the nozzle device or distance between the nozzle device and the pre-welding surfaces, and a control unit connected with the at least one sensor. The present invention can easily control the solder ball, the pressurized gases and the laser beams, thereby keeping the pressure of the nozzle device and the laser energy stable and, in turn improving the soldering result.

First claim

What is claimed is:

1. An apparatus for forming electrical solder connections in a disk drive unit, comprising:
a nozzle device for carrying out soldering on two pre-welding surfaces, the nozzle device comprising a nozzle and a holder for holding the nozzle, and the nozzle and the holder being two separate structures removably connected to one another by a fixture; the nozzle having a main passage and a solder ball outlet, and the holder having a guiding passage communicated with the main passage and a common passage, and the common passage, guiding passage and main passage being coaxial;
a solder ball feeding device for transferring a single solder ball to the nozzle device;
a gas pump device for supplying pressurized gases to the nozzle device;
a laser device for emitting laser beams to the solder ball, thereby melting and reflowing the solder ball; and
a control device comprising at least one sensor for at least detecting status of the solder ball or pressure in the nozzle device or distance between the nozzle device and the pre-welding surfaces, and a control unit connected with the at least one sensor, the control device further comprising a second sensor connected with the guiding passage and being configured to detect whether the pressure in the guiding passage achieves a predetermined value,
wherein the common passage is provided for connecting the nozzle device with the solder ball feeding device, the gas pump device and the laser device respectively, the common passage has a rectangular cross section, which has a first diameter larger than the diameter of the solder ball, and the guiding passage has a tapered cross section which has a maximum diameter and a minimum diameter, and the minimum diameter is larger than the first diameter.

2. The apparatus according to claim 1 , wherein the control device comprises a first sensor connected with the common passage for detecting whether a single solder ball is provided on the common passage.

3. The apparatus according to claim 1 , wherein the control device comprises a third sensor configured on the nozzle or the holder for detecting the distance between the solder ball outlet and the pre-welding surfaces.

4. The apparatus according to claim 1 , wherein the laser device comprises a laser generator connected with the control device and reflection glass connected with the common passage and the guiding passage via a through hole formed on the reflection glass.

5. An apparatus for forming electrical solder connections in a disk drive unit, comprising:
a nozzle device for carrying out soldering on two pre-welding surfaces, the nozzle device comprising a nozzle and a holder for holding the nozzle, and the nozzle and the holder being two separate structures removably connected to one another by a fixture; the nozzle having a main passage and a solder ball outlet, and the holder having a guiding passage communicated with the main passage and a common passage, and the common passage, guiding passage and main passage being coaxial;
a solder ball feeding device for transferring a single solder ball to the nozzle device;
a gas pump device for supplying pressurized gases to the nozzle device;
a laser device for emitting laser beams to the solder ball, thereby melting and reflowing the solder ball; and
a control device comprising at least one sensor for at least detecting status of the solder ball or pressure in the nozzle device or distance between the nozzle device and the pre-welding surfaces, and a control unit connected with the at least one sensor, the control device further comprising a second sensor connected with the guiding passage and being configured to detect whether the pressure in the guiding passage achieves a predetermined value,
wherein the common passage is provided for connecting the nozzle device with the solder ball feeding device, the gas pump device and the laser device respectively, the common passage has a rectangular cross section, which has a first diameter larger than the diameter of the solder ball, and
wherein the main passage has a tapered cross section, and the solder ball outlet narrows and has a second diameter which is smaller than the diameter of the solder ball.

6. The apparatus according to claim 1 , wherein the pressurized gases comprises protective gases and inert gases.

Assignees

• Li Ning
• Zhao qin ping
• Sae Magnetics Hk Ltd

Inventors

• Li Ning
• Zhao qin ping

Classifications

• B23K2201/42

  Operations & Transport · mapped topic

• B23K26/14 Primary

  using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor (B23K26/12 takes precedence) · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• B23K26/60

  Preliminary treatment · CPC title

• B23K1/0056

  soldering by means of beams, e.g. lasers, electron beams [EB] · CPC title