Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Method of joining cooling component
US9694433B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9694433-B2 |
| Application number | US-201615196632-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2016 |
| Priority date | Jul 16, 2015 |
| Publication date | Jul 4, 2017 |
| Grant date | Jul 4, 2017 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of joining a cooling component comprising: bulging a bottom plate of a cooling component into a part of a spherical shape by supplying pressurized gas into the cooling component; and joining an electronic component and the bottom plate of the cooling component to each other by pressing an outer surface of the bottom plate after the bulging, the outer surface having the part of the spherical shape bulging outward, against the electronic component, while providing a thermal bonding material between the outer surface of the bottom plate and the electronic component. 2. The method of joining a cooling component according to claim 1 , wherein the bulging the bottom plate is performed while heating the bottom plate. 3. The method of joining a cooling component according to claim 1 , wherein the cooling component includes a cover thicker than the bottom plate, and the pressurized gas is supplied into a space between the cover and the bottom plate. 4. The method of joining a cooling component according to claim 3 , wherein a plurality of pins are provided to stand on a surface of the bottom plate exposed to the space.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Bump connectors and die-attach connectors · CPC title
Bolts or screws · CPC title
for cooling by change of state · CPC title
by flowing liquids, e.g. forced water cooling · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9694433B2 cover?
- A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.
- Who is the assignee on this patent?
- Fujitsu Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K35/025. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).