Producing method of suspension board with circuit

Patent metadata

Field	Value
Publication number	US-9693467-B2
Application number	US-201414558070-A
Country	US
Kind code	B2
Filing date	Dec 2, 2014
Priority date	Dec 4, 2013
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A method for producing a suspension board with circuit includes the steps of (7) removing a first electroless plating layer corresponding to a first terminal and/or a second electroless plating layer corresponding to a second terminal by etching, (8) removing a metal supporting board in contact with the lower surface of a first conductive layer filling the inside of a first opening portion, and (9) providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and/or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board.

First claim

What is claimed is:

1. A method for producing a suspension board with circuit comprising the steps of:
(1) providing a first insulating layer on a metal supporting board so as to provide a first opening portion and a second opening portion penetrating in a thickness direction of the first insulating layer,
(2) providing a first conductive layer including a first terminal on the first insulating layer so as to fill the inside of the first opening portion,
(3) providing a first electroless plating layer on the surface of the first conductive layer by electroless plating,
(4) providing a second insulating layer on the first insulating layer so as to provide a third opening portion penetrating in the thickness direction of the second insulating layer and exposing the first electroless plating layer and also forming the third opening portion so as to expose a part of the first electroless plating layer provided on the surface of the first conductive layer,
(5) providing a second conductive layer including a second terminal on the second insulating layer so as to fill the inside of the third opening portion or on the second insulating layer and the first insulating layer so as to fill the second opening portion and the third opening portion,
(6) providing a second electroless plating layer on the surface of the second conductive layer by electroless plating,
(7) removing the first electroless plating layer corresponding to the first terminal and/or the second electroless plating layer corresponding to the second terminal by etching,
(8) removing the metal supporting board in contact with the lower surface of the first conductive layer filling the inside of the first opening portion, and
(9) providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and/or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board.

2. The method for producing a suspension board with circuit according to claim 1 , wherein
(4) in the step of forming the second insulating layer, a fourth opening portion is formed in the second insulating layer so as to communicate with the second opening portion and
(5) in the step of providing the second conductive layer, the second conductive layer is provided on the second insulating layer so as to fill the inside of the second opening portion, the third opening portion, and the fourth opening portion.

3. The method for producing a suspension board with circuit according to claim 2 further comprising:
(10) a step of insulating the metal supporting board in contact with the lower surface of the second conductive layer filling the inside of the second opening portion from the surrounding metal supporting.

4. The method for producing a suspension board with circuit according to claim 1 , wherein
(4) in the step of providing the second insulating layer, the third opening portion is, when projected in the thickness direction, formed so as to be disposed at the same position as that of the first opening portion.

5. The method for producing a suspension board with circuit according to claim 1 , wherein
(4) in the step of providing the second insulating layer, the third opening portion is, when projected in the thickness direction, formed so as to be disposed at a position different from that of the first opening portion.

6. The method for producing a suspension board with circuit according to claim 1 , wherein the metal supporting board is disposed along a longitudinal direction;
(1) in the step of providing the first insulating layer, a plurality of the first opening portions are provided; and
(8) in the step of removing the metal supporting board in contact with the lower surface of the first conductive layer filling the inside of the first opening portion, the metal supporting board in contact with the lower surface of the first conductive layer filling the inside of the first opening portion is removed so that a plurality of support opening portions penetrating in the thickness direction are provided and
a plurality of the support opening portions are symmetrically disposed with respect to a reference line along the longitudinal direction.

7. The method for producing a suspension board with circuit according to claim 1 , wherein
the metal supporting board is made of stainless steel and
the first electroless plating layer and/or the second electroless plating layer are/is formed of nickel.

Assignees

• Nitto Denko Corp

Inventors

• Tanabe Hiroyuki
• Kanagawa Hitoki

Classifications

• G11B5/4873

  the arm comprising piezoelectric or other actuators for adjustment of the arm · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title

• H05K3/4661 Primary

  Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387) · CPC title

• H05K3/44

  Manufacturing insulated metal core circuits {or other insulated electrically conductive core circuits (H05K3/0058, H05K3/4608, and H05K3/4641 take precedence)} · CPC title