Pre-fill wafer cleaning formulation

Patent metadata

Field	Value
Publication number	US-9691622-B2
Application number	US-201514675538-A
Country	US
Kind code	B2
Filing date	Mar 31, 2015
Priority date	Sep 7, 2008
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A pre-fill solution for application onto a substrate surface prior to a fill operation is provided, the fill operation defined by application of an electroless deposition solution onto the substrate surface to deposit a metallic material in an etched feature, the substrate surface having metallic contaminants generated from an etch operation that generated the etched feature in the substrate surface, the pre-fill solution effective for preventing the electroless deposition solution from depositing on the metallic contaminants, the pre-fill solution comprising: a surfactant, the surfactant configured to enhance wetting of the substrate surface, the concentration of the surfactant in the solution being approximately in the range of 10 ppm to 2000 ppm, wherein the surfactant is an amphoteric surfactant; oxalic acid dihydrate; and hypophosphorous acid as a pH adjusting agent configured to reduce the pH of the solution to approximately less than 2 during the application onto the substrate surface.

First claim

What is claimed is:

1. A pre-fill solution for application onto a substrate surface prior to a fill operation, the fill operation defined by application of an electroless deposition solution onto the substrate surface to deposit a metallic material in an etched feature in the substrate surface, the substrate surface having metallic contaminants generated from an etch operation that generated the etched feature in the substrate surface, the pre-fill solution effective for preventing the electroless deposition solution from depositing on the metallic contaminants, the pre-fill solution comprising:
a surfactant, the surfactant configured to enhance wetting of the substrate surface, the concentration of the surfactant in the solution being approximately in the range of 10 ppm to 2000 ppm, wherein the surfactant is an amphoteric surfactant;
oxalic acid dihydrate; and
hypophosphorous acid as a pH adjusting agent configured to reduce the pH of the solution to approximately less than 2 during the application onto the substrate surface.

2. The pre-fill solution of claim 1 , wherein the surfactant is configured to form a self-assembled monolayer (SAM) on the substrate surface that prevents the electroless deposition solution from depositing on the metallic contaminants, wherein hydrophobic tails of the surfactant SAM block access to the metallic contaminants.

3. The pre-fill solution of claim 2 , wherein the surfactant SAM is configured to increase hydrophobicity of the substrate surface and increase a contact angle of the substrate surface to about 40 to 60 degrees.

4. The pre-fill solution of claim 3 , wherein the surfactant SAM is configured to be gradually released from the substrate surface during the application of the electroless deposition solution onto the substrate surface, such that the hydrophobicity of the substrate surface is reduced and the contact angle of the substrate surface reduces to a level that is substantially similar to an initial contact angle prior to the application of the pre-fill solution onto the substrate surface.

5. The pre-fill solution of claim 4 , wherein the gradual release of the surfactant from the substrate surface removes the metallic contaminants from the substrate surface into the electroless deposition solution.

6. The pre-fill solution of claim 5 , wherein the oxalic acid dihydrate defines a complexing agent that is configured to bind to a portion of the metallic contaminants which have been removed from the substrate surface into the pre-fill solution, the binding of the complexing agent to the metallic contaminants preventing redeposition of the metallic contaminants onto the substrate surface.

7. The pre-fill solution of claim 1 , wherein the concentration of the surfactant is approximately in the range of 300 ppm to 700 ppm.

8. The pre-fill solution of claim 1 , wherein the concentration of the oxalic acid dihydrate is approximately in the range of 0.05 g/L to 20 g/L.

9. The pre-fill solution of claim 1 , wherein the concentration of the oxalic acid dihydrate is approximately 1 g/L.

10. The pre-fill solution of claim 1 , wherein the concentration of the pH adjusting agent is approximately in the range of 0.01 g/L to 20 g/L.

11. The pre-fill solution of claim 1 , wherein the pH adjusting agent is configured to reduce the pH of the pre-fill solution to approximately 1.8 to 1.9 during the application onto the substrate surface.

12. The pre-fill solution of claim 1 , wherein the concentration of the pH adjusting agent is approximately 8 ml/L 50 w/w %.

13. The pre-fill solution of claim 1 , wherein the pre-fill solution does not significantly inhibit the functionality of the electroless deposition solution when recirculated, in the case of cross-contamination with the electroless deposition solution.

14. The pre-fill solution of claim 1 , wherein the substrate surface includes regions of a hard mask material, the regions of the hard mask material having the metallic contaminants situated thereon prior to application of the pre-fill solution.

15. The pre-fill solution of claim 1 , wherein the substrate surface includes regions of a dielectric material, the regions of the dielectric material having the metallic contaminants situated thereon prior to application of the pre-fill solution.

16. The pre-fill solution of claim 15 , wherein the dielectric material has a K value of approximately less than or equal to 3.0.

17. The pre-fill solution of claim 1 , wherein the metallic material deposited by the electroless deposition solution includes cobalt or a cobalt alloy.

18. The pre-fill solution of claim 1 , wherein the etched feature defines an interconnect structure that exposes an underlying metallic feature, the metallic contaminants being generated from the underlying metallic feature during the etch operation.

19. A method for processing a substrate, comprising:
performing an etch operation on a surface of the substrate to define an etched feature in the substrate surface, the etch operation configured to expose an underlying metallic feature below the etched feature, the etch operation generating metallic contaminants from the underlying metallic feature that are deposited on the substrate surface;
applying a pre-fill solution onto the substrate surface;
applying an electroless deposition solution onto the substrate surface to deposit a metallic material in the etched feature;
wherein the pre-fill solution prevents the electroless deposition solution from depositing the metallic material on the metallic contaminants, the pre-fill solution including,
a surfactant, the surfactant configured to enhance wetting of the substrate surface, the concentration of the surfactant in the solution being approximately in the range of 10 ppm to 2000 ppm, wherein the surfactant is an amphoteric surfactant,
oxalic acid dihydrate as a complexing agent, and
hypophosphorous acid as a pH adjusting agent configured to reduce the pH of the solution to approximately less than 2 during the application onto the substrate surface.

Assignees

• Lam Res Corp

Inventors

• Kolics Artur

Classifications

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P14/46 Primary

  using a liquid · CPC title

• C11D3/3409

  Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates · CPC title

• C11D3/2082

  Polycarboxylic acids-salts thereof · CPC title

• C11D3/042

  Acids · CPC title