Underfill composition and packaging process using the same

Patent metadata

Field	Value
Publication number	US-9688892-B2
Application number	US-201514804418-A
Country	US
Kind code	B2
Filing date	Jul 21, 2015
Priority date	Jan 23, 2013
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

The present invention provides a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition.

First claim

What is claimed is:

1. A one part underfill composition comprising:
an epoxy resin component,
a latent epoxy curing agent,
a photocurable resin or monomer,
a photoinitiator,
a filler, and
a thermal initiator wherein the epoxy resin component comprises at least one multifunctional epoxy resin, together with one or more monofunctional epoxy resins, wherein the multifunctional epoxy resin is included in an amount within the range of about 40 wt. % to 95 wt. % of the total epoxy resin component.

2. The underfill composition according to claim 1 , wherein epoxy resin comprises about 10 wt. % to about 90 wt. % of the total composition.

3. The underfill composition according to claim 1 , wherein the multifunctional epoxy resin is selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins, novolac epoxy resins, 2,6-diglycidylphenyl glycidyl ether, naphthalene epoxy resins, cycloaliphatic epoxy resins, polyepoxy compounds based on aromatic amines and epichlorohydrin, polyglycidyl derivatives of phenolic compounds, polyepoxides prepared from polyols, polybutadiene and the like, polyglycidyl derivatives of phenol-formaldehyde novolacs, and polyglycidyl adducts of amines, aminoalcohols and polycarboxylic acids.

4. An underfill composition comprising:
an epoxy resin component,
a latent epoxy curing agent,
a photocurable resin or monomer,
a photoinitiator, and
a thermal initiator,

wherein the epoxy resin component comprises at least one multifunctional epoxy resin together with one or more monofunctional epoxy resins, and wherein the one or more monofunctional epoxy resins has a viscosity of less than about 300 cps at 25° C.

5. An underfill composition comprising:
an epoxy resin component,
a latent epoxy curing agent,
a photocurable resin or monomer,
a photoinitiator, and
a thermal initiator,

wherein the epoxy resin component comprises at least one multifunctional epoxy resin together with one or more monofunctional epoxy resins, and wherein the one or more monofunctional epoxy resins is(are) selected from the group consisting of p-tert-butyl phenyl glycidyl ether, cresyl glycidyl ether, neodecanoic acid glycidyl ether, alkyl C12-C14 glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, and nonylphenyl glycidyl ether.

6. The underfill composition according to claim 1 , wherein the latent epoxy curing agent comprises about 0.5 wt. % to about 50 wt. % based on the total composition.

7. The underfill composition according to claim 1 , wherein the photocurable resin or monomer comprises about 0.1 wt. % to about 50 wt. % based on the total composition.

8. The underfill composition according to claim 1 , wherein the photocurable resin or monomer is selected from the group consisting of (meth)acrylate monomers or oligomers, vinyl ethers, and photocurable epoxy resins or monomers.

9. The underfill composition according to claim 1 , wherein the photoinitiator comprises about 0.2 wt. % to about 10 wt. % based on the total composition.

10. The underfill composition according to claim 1 , wherein the photoinitiator can be activated in a wavelength range of from about 250 nm to 850 nm.

11. The underfill composition according to claim 1 , wherein the photoinitiator is selected from cationic-type photoinitiators and free-radical-type photoinitiators.

12. The underfill composition according to claim 1 , wherein the thermal initiator is present in an amount of 0 wt. % to about 5 wt. % based on the total composition.

13. An underfill composition comprising:
an epoxy resin component,
a latent epoxy curing agent,
a photocurable resin or monomer,
a photoinitiator, and
a thermal initiator

wherein the thermal initiator is selected from the group consisting of di(4-tert-butylcyclohexyl) peroxydicarbonate, tert-butyl peroxyneodecanoate, tert-butyl peroxypivalate, dilauroyl peroxide, 2,2′-azodi(isobutyronitrile), 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)-hexane, tert-butyl peroxy-2-ethylhexanoate, and tert-butyl peroxybenzoate.

14. The underfill composition according to claim 1 , wherein the filler is present in an amount of 0 wt. % to about 60 wt. % based on the total composition.

15. The underfill composition according to claim 1 , wherein the filler is selected from the group consisting of alumina, silica and magnesia having a spherical shape, with an average particle size of from 1 nm to 20 μm.

16. The underfill composition according to claim 1 , having a viscosity ranging from 50 mpas to 10000 mpas.

17. A packaging process using the underfill composition according to claim 1 , comprising the steps of:
a) providing an assembly of a package and a circuit board;
b) dispensing the underfill composition;
c) the underfill composition flowing by capillary action to fill the gap between the package and the circuit board with or without board preheating, and forming fillet;
d) partially or fully curing the fillet by exposure to a UV light and/or a visible light; and
e) completely curing the uncured underfill composition by heat.

18. The packaging process according to claim 17 , wherein the package is selected from the group consisting of CSP, BGA, LGA, and POP.

19. The packaging process according to claim 17 , wherein the intensity of the light in step d) is from 30 mJ/cm 2 to 4000 mJ/cm 2 .

20. The packaging process according to claim 17 , wherein the light has a wavelength within the range of 250 nm to 850 nm.

21. The packaging process according to claim 17 , wherein the heat cure step e) is conducted at a temperature in the range of 60° C. to 250° C.

22. The underfill composition according to claim 1 , wherein the photoinitiator is selected from the group consisting of benzophenone, acetophenone, chlorinated acetophenone, dialkoxyacetophenones, dialkylhydroxyacetophenones, dialkylhydroxyacetophenone esters, benzoin, benzoin acetate, benzoin alkyl ethers, dimethoxybenzoin, dibenzylketone, benzoylcyclohexanol and other aromatic ketones, acyloxime esters, acylphosphine oxides, acylphosphosphonates, ketosulfides, dibenzoyldisulphides, diphenyldithiocarbonate, diphenyl(2,4,6-trimethylbenzoyl) phosphine oxide, phosphonium salts, sulfonium salts, and iodonium salts.

Assignees

• Henkel IP & Holding GmbH
• Ablestik (Shanghai) Ltd
• Henkel Ag & Co Kgaa

Inventors

• Hu Xiaolong
• Wyatt Derek
• England Jiong
• Gleeson Paul J
• He Renfel

Classifications

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title