Conductive adhesive, anisotropic conductive film and electronic devices using both

Patent metadata

Field	Value
Publication number	US-2016060490-A1
Application number	US-201414781746-A
Country	US
Kind code	A1
Filing date	Mar 27, 2014
Priority date	Apr 2, 2013
Publication date	Mar 3, 2016
Grant date	—

Abstract

[Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 massppm or less, preferably 50 massppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid.

First claim

1 . A conductive adhesive comprising conductive fillers and a binder resin,
the binder resin comprising an epoxy (meth)acrylate resin, and the epoxy (meth)acrylate resin being formed by adding a (meth)acrylic acid to an epoxy compound having the sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less.

2 . A conductive adhesive according to claim 1 , wherein the sum of total chlorine atom concentration and total bromine atom concentration is 50 mass ppm or less.

3 . A conductive adhesive according to claim 1 , wherein a raw material for the epoxy (meth)acrylate resin is an epoxy compound obtained by epoxidizing a carbon-carbon double bond of a raw material compound (substrate) having a carbon-carbon double bond, using a peroxide as an oxidant.

4 . A conductive adhesive according to claim 1 , wherein the raw material compound (substrate) is a compound having two or more allyl ether groups.

5 . A conductive adhesive according to claim 1 , wherein the content of the binder resin in the conductive adhesive is 5 to 90% by mass.

6 . A conductive adhesive according to claim 1 , wherein the conductive filler is a particle or a fiber made of at least one kind of metal, or an alloy of a plurality of kinds of metal selected from a group of gold, silver, copper, nickel, aluminum, and palladium; a metal particle or fiber the surface of which is plated with gold, palladium, or silver; a resin core ball having a resin ball plated with nickel, gold, palladium, or silver; a carbon or graphite particle or fiber; or the metal particle, the core ball, the carbon or graphite particle the surface of which is coated with an insulation resin thin film.

7 . An electronic device comprising a substrate on which a semiconductor element, a solar panel, a thermoelectric element, a chip part, a discrete part, or a combination of these are mounted using a conductive adhesive according to claim 1 .

8 . An electronic device in which a wiring pattern of a film antenna, a keyboard membrane, a touch panel, a RFID antenna is formed and connected to a substrate, using a conductive adhesive according to claim 1 .

9 . An anisotropic conductive film comprising conductive particles and a binder resin, the binder resin comprising an epoxy (meth)acrylate resin, the epoxy (meth)acrylate resin being formed by adding a (meth)acrylic acid to an epoxy compound having the sum of a total chlorine atom concentration and a total bromine atom concentration of 300 mass ppm or less, and 0.1 to 20% by mass of conductive particles being dispersed in the binder resin.

10 . An anisotropic conductive film according to claim 9 , wherein the epoxy compound has the sum of a total chlorine atom concentration and a total bromine atom concentration of 50 mass ppm or less.

11 . An anisotropic conductive film according to claim 9 , wherein the epoxy (meth)acrylate resin is formed from an epoxy resin obtained by using a raw material compound (substrate) having a carbon-carbon double bond, and by epoxidizing the carbon-carbon double bond using a peroxide as an oxidant.

12 . An anisotropic conductive film according to claim 9 , wherein the raw material compound (substrate) is a compound having two or more allyl ether groups.

13 . An anisotropic conductive film according to claim 9 , wherein the conductive particle used is at least one kind of metal, or an alloy of a plurality of kinds of metal selected from a group of gold, silver, copper, nickel, aluminum, and palladium; a metal particle the surface of which is plated with gold, palladium, or silver; a resin core ball having a resin ball plated with nickel, gold, palladium, or silver; a carbon or graphite particle; or the particle as mentioned above the surface of which is coated with an insulation resin thin film.

14 . An electronic device in which electronic components are connected by anisotropic conductive connection, using an anisotropic conductive film according to claim 9 .

Assignees

• Showa Denko Kk

Inventors

• Uchida Hiroshi
• Ishibashi Yoshitaka

Classifications

• C09J9/02 Primary

  Electrically-conducting adhesives · CPC title

• C09J7/00

  Adhesives in the form of films or foils · CPC title

• C09J133/14

  of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen · CPC title

• C08K7/18

  inorganic · CPC title

• C09J2301/314

  the adhesive layer and/or the carrier being conductive · CPC title