Using millisecond pulsed laser welding in MEMS packaging

Patent metadata

Field	Value
Publication number	US-9688533-B2
Application number	US-201213982427-A
Country	US
Kind code	B2
Filing date	Jan 31, 2012
Priority date	Jan 31, 2011
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A new packaging method for a wide range of MEMS for application on both the wafer and device scale. Titanium is used as the packaging material and both silicon and titanium MEMS devices are integrated on to a titanium substrate. A Nd:YAG pulsed laser is used to micro-weld the titanium cap to the substrate. A three-dimensional time dependent model of heat flow during laser beam welding is presented. The heat transfer and parametric design capabilities of COMSOL were employed for this purpose. Model calculations are compared and calibrated with experimental results of pulsed laser welds. The functionality and hermiticity of the proposed packaging was evaluated by packaging a self actuated Veeco Instrument AFM cantilever tip. The experimental measurements show that the resonance frequency and quality factor of the device stay the same before and after packaging and the applied technique has no effect on the device.

First claim

What is claimed is:

1. An apparatus, comprising:
a titanium substrate;
a micro-electro-mechanical system (MEMS) device mounted on the substrate; and
a titanium cap laser welded to the substrate at welding locations so as to hermetically seal the MEMS device;
wherein:
a distance between the MEMS device and the welding locations is 450 micrometers or less,
the welding locations consist essentially of a direct titanium to titanium weld, and
the cap is welded onto a trench in the substrate.

2. The apparatus of claim 1 , wherein the the distance is no more than 85 micrometers from the welding locations.

3. The apparatus of claim 1 , wherein the cap is micro laser welded to the substrate using a neodymium-doped yttrium aluminum garnet (Nd:Y 3 Al 5 O 12 )(Nd:YAG) laser.

4. The apparatus of claim 3 , wherein the Nd:YAG laser is a millisecond pulsed laser type with a wavelength of 1064 nm.

5. The apparatus of claim 1 , wherein wafer level packaging is applied to the apparatus.

6. The apparatus of claim 1 , wherein a size of the cap is scalable up to 400 mm by 400 mm.

7. The apparatus of claim 1 , wherein the cap is thermally matched to the substrate.

8. The apparatus of claim 1 , wherein:
the MEMS device comprises a cantilever,
and
the cap is directly welded to the titanium substrate such that a resonance frequency of the cantilever changes by less than 1% as compared to before the cap is laser welded to the substrate.

9. A method of packaging a micro-electromechanical system (MEMS) device, comprising:
obtaining at least one MEMS device mounted on a titanium substrate; and
laser welding a titanium cap to the titanium substrate, at welding locations, to hermetically seal the at least one MEMS device;
wherein a distance between the at least one MEMS device and the welding locations is 450 micrometers or less.

10. The method of claim 9 , wherein the at least one MEMS device is either a silicon-based.

11. The method of claim 9 , wherein a size of the cap is less than 400 mm by 400 mm.

12. The method of claim 9 , wherein the at least one MEMS device can be integrated into a cavity of the titanium substrate that is less than 15 inch by 15 inch square.

13. The method of claim 9 , wherein the laser welding:
uses a laser spot size greater than 20 μm and less than 400 μm in diameter, and
use a laser power of at least 650 Watts.

14. The method of claim 9 , wherein a packaging, comprising the titanium substrate and the cap, is biocompatible.

15. The method of claim 9 , wherein the at least one MEMS device is mounted at the distance of no more than 85 micrometers form the welding locations, the method further comprising selecting the distance based on at least a temperature gradient in the substrate.

16. The method of claim 15 , wherein the laser welding uses at least one laser parameter selected from a laser pulse frequency, a laser pulse energy, a laser pulse duration, and a laser pulse size, the method further comprising selecting the distance based on:
the at least one laser parameter, and
a geometry and configuration of an interface between the substrate and the cap.

17. The method of claim 15 , wherein the laser welding uses an yttrium aluminum garnet laser and and an interface film is not deposited between the substrate and the cap at the welding locations prior to the laser welding.

18. The method of claim 9 , further comprising selecting a geometry of the substrate at the welding locations, based on a target temperature at a location where the at least one MEMS device is mounted.

19. The method of claim 18 , further comprising forming a trench in the substrate, wherein:
the cap is laser welded on the trench,
the trench's width is selected so as to reduce thermal distortion and reduce laser power used during the laser welding, and
the laser welding directly welds the titanium in the substrate to the titanium in the cap.

Assignees

• Bozorgi Payam
• Macdonald Noel C
• Univ California

Inventors

• Bozorgi Payam
• Macdonald Noel C

Classifications

• H10W76/63

  characterised by their shape or disposition, e.g. between cap and walls of a container · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W76/60

  Seals · CPC title

• B81C2203/038

  Bonding techniques not provided for in B81C2203/031 - B81C2203/037 · CPC title