Methods and compositions for brazing, and earth-boring tools formed from such methods and compositions

US9687940B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9687940-B2
Application numberUS-201414546806-A
CountryUS
Kind codeB2
Filing dateNov 18, 2014
Priority dateNov 18, 2014
Publication dateJun 27, 2017
Grant dateJun 27, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method includes disposing a braze material between a first body and a second body. The braze material includes a first composition and a second composition. The second composition has a melting point higher than the first composition. The method also includes heating the braze material to a brazing temperature between the melting points of the first and second materials and maintaining the braze material at the brazing temperature for a period of time to transform a transient liquid phase to a solid phase, forming a bond between the first body and the second body. A braze material for securing solid bodies includes a first composition and a second composition. The first composition includes at least one element selected from the group consisting of indium, tin, zinc, and magnesium. An earth-boring tool includes a first body, a second body, and a braze material bonding the second body to the first body.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: disposing a braze material between a cutting element pocket of a bit body and a cutting element to be disposed in the cutting element pocket, wherein the braze material comprises a first composition and a second composition, the first composition having a first melting point and the second composition having a second melting point higher than the first melting point, wherein the first composition comprises at least one element selected from the group consisting of indium, tin, zinc, and magnesium; heating the braze material to a temperature higher than the first melting point and lower than the second melting point and forming a transient liquid phase; and maintaining the braze material above the first melting point for a period of time, transforming the transient liquid phase to a solid phase, and forming a bond between the bit body and the cutting element. 2. The method of claim 1 , wherein the second composition comprises an alloy comprising at least one element selected from the group consisting of silver, copper, manganese, nickel, titanium, cobalt, and aluminum. 3. The method of claim 1 , wherein transforming the transient liquid phase to a solid phase comprises forming a solid substantially free of intermetallic compounds. 4. The method of claim 1 , wherein disposing a braze material between the cutting element pocket of the bit body and the cutting element comprises disposing a paste comprising at least a composition of the braze material between the cutting element pocket of the bit body and the cutting element. 5. The method of claim 1 , wherein disposing a braze material between the cutting element pocket of the bit body and the cutting element comprises disposing a foil comprising at least a composition of the braze material between the cutting element pocket of the bit body and the cutting element. 6. A method, comprising: disposing a braze material between a cutting element pocket of a bit body and a cutting element to be disposed in the cutting element pocket, wherein the braze material comprises a first composition and a second composition, the first composition having a first melting point and the second composition having a second melting point higher than the first melting point; heating the braze material to a temperature higher than the first melting point and lower than the second melting point in a range extending from about 200° C. to about 600° C. and forming a transient liquid phase; and maintaining the braze material above the first melting point for a period of time, transforming the transient liquid phase to a solid phase, and forming a bond between the bit body and the cutting element. 7. The method of claim 1 , further comprising, after the bonded bit body and cutting element are used in an application, heating the solidified braze material to a temperature to weaken the bond between the bit body and the cutting element. 8. The method of claim 7 , wherein heating the solidified braze material to a temperature to weaken the bond between the bit body and the cutting element comprises heating the solidified braze material to a temperature in a range extending from about 600° C. to about 800° C. 9. The method of claim 7 , further comprising separating the cutting element from the bit body. 10. The method of claim 1 , wherein disposing a braze material between the cutting element pocket of the bit body and the cutting element comprises disposing a first volume of the second composition adjacent and in contact with the bit body, disposing a second volume of the second composition adjacent and in contact with the cutting element, and disposing a volume of the first composition adjacent and in contact with the first volume and second volume of the second composition. 11. The method of claim 1 , wherein disposing a braze material between the cutting element pocket of the bit body and the cutting element comprises disposing a first volume of the first composition adjacent and in contact with the bit body, disposing a second volume of the first composition adjacent and in contact with the cutting element, and disposing a volume of the second composition adjacent and in contact with the first volume and second volume of the first composition. 12. A method, comprising: disposing a braze material between a polycrystalline diamond table and a supporting substrate, wherein the braze material comprises a first composition and a second composition, the first composition having a first melting point and the second composition having a second melting point higher than the first melting point, wherein the first composition comprises at least one element selected from the group consisting of indium, tin, zinc, and magnesium; heating the braze material to a temperature higher than the first melting point and lower than the second melting point and forming a transient liquid phase; and maintaining the braze material above the first melting point for a period of time, transforming the transient liquid phase to a solid phase, and forming a bond between the polycrystalline diamond table and the supporting substrate. 13. The method of claim 12 , wherein the second composition comprises an alloy comprising at least one element selected from the group consisting of silver, copper, manganese, nickel, titanium, cobalt, and aluminum. 14. The method of claim 12 , wherein disposing a braze material between polycrystalline diamond table and a supporting substrate comprises disposing a first volume of the second composition adjacent and in contact with the polycrystalline diamond table, disposing a second volume of the second composition adjacent and in contact with the supporting substrate, and disposing a volume of the first composition adjacent and in contact with the first volume and second volume of the second composition. 15. The method of claim 12 , wherein disposing a braze material between a polycrystalline diamond table and a supporting substrate comprises disposing a first volume of the first composition adjacent and in contact with the polycrystalline diamond table, disposing a second volume of the first composition adjacent and in contact with the supporting substrate, and disposing a volume of the second composition adjacent and in contact with the first volume and second volume of the first composition. 16. A method, comprising: disposing a barrier material over at least a portion of at least one of a cutting element pocket of a bit body and a cutting element to be disposed in the cutting element pocket; disposing a braze material between the cutting element pocket and the cutting element, wherein the braze material comprises a first composition and a second composition, the first composition having a first melting point and the second composition having a second melting point higher than the first melting point, wherein the first composition comprises at least one element selected from the group consisting of indium, tin, zinc, and magnesium; heating the braze material to a temperature higher than the first melting point and lower than the second melting point and forming a transient liquid phase; and maintaining the braze material above the first melting point for a period of time, transforming the transient liquid phase to a solid phase, and forming a bond between the bit body and the cutting element. 17. The method of claim 16 , wherein the second composition comprises an alloy comprising at least one element selected from the group consisting of silver, copper, manganese, nickel, titanium, cobalt, and aluminum.

Assignees

Inventors

Classifications

  • characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element · CPC title

  • B23K1/19Primary

    taking account of the properties of the materials to be soldered · CPC title

  • with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts · CPC title

  • Drill-bits · CPC title

  • B23K35/24Primary

    Selection of soldering or welding materials proper (B23K35/34 takes precedence) · CPC title

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What does patent US9687940B2 cover?
A method includes disposing a braze material between a first body and a second body. The braze material includes a first composition and a second composition. The second composition has a melting point higher than the first composition. The method also includes heating the braze material to a brazing temperature between the melting points of the first and second materials and maintaining the br…
Who is the assignee on this patent?
Baker Hughes Inc
What technology area does this patent fall under?
Primary CPC classification B23K1/19. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 27 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).