Transient liquid phase joining of dissimilar materials
US-2016151854-A1 · Jun 2, 2016 · US
US9687940B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9687940-B2 |
| Application number | US-201414546806-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 18, 2014 |
| Priority date | Nov 18, 2014 |
| Publication date | Jun 27, 2017 |
| Grant date | Jun 27, 2017 |
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A method includes disposing a braze material between a first body and a second body. The braze material includes a first composition and a second composition. The second composition has a melting point higher than the first composition. The method also includes heating the braze material to a brazing temperature between the melting points of the first and second materials and maintaining the braze material at the brazing temperature for a period of time to transform a transient liquid phase to a solid phase, forming a bond between the first body and the second body. A braze material for securing solid bodies includes a first composition and a second composition. The first composition includes at least one element selected from the group consisting of indium, tin, zinc, and magnesium. An earth-boring tool includes a first body, a second body, and a braze material bonding the second body to the first body.
Opening claim text (preview).
What is claimed is: 1. A method, comprising: disposing a braze material between a cutting element pocket of a bit body and a cutting element to be disposed in the cutting element pocket, wherein the braze material comprises a first composition and a second composition, the first composition having a first melting point and the second composition having a second melting point higher than the first melting point, wherein the first composition comprises at least one element selected from the group consisting of indium, tin, zinc, and magnesium; heating the braze material to a temperature higher than the first melting point and lower than the second melting point and forming a transient liquid phase; and maintaining the braze material above the first melting point for a period of time, transforming the transient liquid phase to a solid phase, and forming a bond between the bit body and the cutting element. 2. The method of claim 1 , wherein the second composition comprises an alloy comprising at least one element selected from the group consisting of silver, copper, manganese, nickel, titanium, cobalt, and aluminum. 3. The method of claim 1 , wherein transforming the transient liquid phase to a solid phase comprises forming a solid substantially free of intermetallic compounds. 4. The method of claim 1 , wherein disposing a braze material between the cutting element pocket of the bit body and the cutting element comprises disposing a paste comprising at least a composition of the braze material between the cutting element pocket of the bit body and the cutting element. 5. The method of claim 1 , wherein disposing a braze material between the cutting element pocket of the bit body and the cutting element comprises disposing a foil comprising at least a composition of the braze material between the cutting element pocket of the bit body and the cutting element. 6. A method, comprising: disposing a braze material between a cutting element pocket of a bit body and a cutting element to be disposed in the cutting element pocket, wherein the braze material comprises a first composition and a second composition, the first composition having a first melting point and the second composition having a second melting point higher than the first melting point; heating the braze material to a temperature higher than the first melting point and lower than the second melting point in a range extending from about 200° C. to about 600° C. and forming a transient liquid phase; and maintaining the braze material above the first melting point for a period of time, transforming the transient liquid phase to a solid phase, and forming a bond between the bit body and the cutting element. 7. The method of claim 1 , further comprising, after the bonded bit body and cutting element are used in an application, heating the solidified braze material to a temperature to weaken the bond between the bit body and the cutting element. 8. The method of claim 7 , wherein heating the solidified braze material to a temperature to weaken the bond between the bit body and the cutting element comprises heating the solidified braze material to a temperature in a range extending from about 600° C. to about 800° C. 9. The method of claim 7 , further comprising separating the cutting element from the bit body. 10. The method of claim 1 , wherein disposing a braze material between the cutting element pocket of the bit body and the cutting element comprises disposing a first volume of the second composition adjacent and in contact with the bit body, disposing a second volume of the second composition adjacent and in contact with the cutting element, and disposing a volume of the first composition adjacent and in contact with the first volume and second volume of the second composition. 11. The method of claim 1 , wherein disposing a braze material between the cutting element pocket of the bit body and the cutting element comprises disposing a first volume of the first composition adjacent and in contact with the bit body, disposing a second volume of the first composition adjacent and in contact with the cutting element, and disposing a volume of the second composition adjacent and in contact with the first volume and second volume of the first composition. 12. A method, comprising: disposing a braze material between a polycrystalline diamond table and a supporting substrate, wherein the braze material comprises a first composition and a second composition, the first composition having a first melting point and the second composition having a second melting point higher than the first melting point, wherein the first composition comprises at least one element selected from the group consisting of indium, tin, zinc, and magnesium; heating the braze material to a temperature higher than the first melting point and lower than the second melting point and forming a transient liquid phase; and maintaining the braze material above the first melting point for a period of time, transforming the transient liquid phase to a solid phase, and forming a bond between the polycrystalline diamond table and the supporting substrate. 13. The method of claim 12 , wherein the second composition comprises an alloy comprising at least one element selected from the group consisting of silver, copper, manganese, nickel, titanium, cobalt, and aluminum. 14. The method of claim 12 , wherein disposing a braze material between polycrystalline diamond table and a supporting substrate comprises disposing a first volume of the second composition adjacent and in contact with the polycrystalline diamond table, disposing a second volume of the second composition adjacent and in contact with the supporting substrate, and disposing a volume of the first composition adjacent and in contact with the first volume and second volume of the second composition. 15. The method of claim 12 , wherein disposing a braze material between a polycrystalline diamond table and a supporting substrate comprises disposing a first volume of the first composition adjacent and in contact with the polycrystalline diamond table, disposing a second volume of the first composition adjacent and in contact with the supporting substrate, and disposing a volume of the second composition adjacent and in contact with the first volume and second volume of the first composition. 16. A method, comprising: disposing a barrier material over at least a portion of at least one of a cutting element pocket of a bit body and a cutting element to be disposed in the cutting element pocket; disposing a braze material between the cutting element pocket and the cutting element, wherein the braze material comprises a first composition and a second composition, the first composition having a first melting point and the second composition having a second melting point higher than the first melting point, wherein the first composition comprises at least one element selected from the group consisting of indium, tin, zinc, and magnesium; heating the braze material to a temperature higher than the first melting point and lower than the second melting point and forming a transient liquid phase; and maintaining the braze material above the first melting point for a period of time, transforming the transient liquid phase to a solid phase, and forming a bond between the bit body and the cutting element. 17. The method of claim 16 , wherein the second composition comprises an alloy comprising at least one element selected from the group consisting of silver, copper, manganese, nickel, titanium, cobalt, and aluminum.
characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element · CPC title
taking account of the properties of the materials to be soldered · CPC title
with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts · CPC title
Drill-bits · CPC title
Selection of soldering or welding materials proper (B23K35/34 takes precedence) · CPC title
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