Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-9687886-B2
Application number	US-201514687649-A
Country	US
Kind code	B2
Filing date	Apr 15, 2015
Priority date	Aug 29, 2006
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A method and apparatus capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning. A substrate is held in a horizontal posture by a spin chuck and rotated about a vertical axis by a rotation motor, and when an outlet of the nozzle is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle has started to move, only one dried core is produced in the vicinity of the center of the substrate, and thus production of not less than two dried cores in the vicinity of the center of the substrate is prevented. The dried region is spread all over the surface of the substrate.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a substrate holder for holding a substrate in a horizontal posture;
a substrate rotator connected to said substrate holder for rotating the substrate held by said substrate holder about a vertical axis;
a discharge nozzle arranged for discharging a cleaning solution from an outlet thereof to a surface of the substrate that is held by said substrate holder and rotated by said substrate rotator;
a cleaning solution supply source connected to said discharge nozzle for feeding the cleaning solution to said discharge nozzle; and
a nozzle rotating drive connected to said discharge nozzle for scanning the outlet of said discharge nozzle from a position opposed to a center of the substrate to a position opposed to a circumferential edge of the substrate while the cleaning solution is being discharged onto the surface of the substrate from said outlet;
the substrate processing apparatus further comprising:
a controller configured to control said nozzle rotating drive such that after the outlet of said discharge nozzle has started to move from a position opposed to a center of the substrate toward a circumferential edge of the substrate, before drying at the center portion of the substrate is started, wherein a center position of the substrate is a center and wherein a distance to a position on the substrate surface opposed to the outlet of said discharge nozzle is a radius, the outlet of said discharge nozzle is once stopped, and after drying has started in a small region the outlet of said discharge nozzle is moved again toward the circumferential edge of the substrate,
wherein said controller is further configured to control said nozzle rotating drive such that the movement of the outlet of said discharge nozzle is once stopped after the outlet of said discharge nozzle has started to move from the position opposed to the center of the substrate toward the circumferential edge of the substrate and before drying at the center of the substrate is started, and
the outlet of said discharge nozzle is moved again toward the circumferential edge of the substrate after drying has started, by a centrifugal force causing the cleaning solution, which the surface of the substrate is covered with, to flow in a region inside a circumference defined by the center of the substrate as the center and by a distance to a position on the substrate surface opposed to the outlet of said discharge nozzle as a radius.

2. The substrate processing apparatus according to claim 1 , further comprising:
a gas jet nozzle arranged for blowing out a drying gas from a jet hole thereof to the center surface of the substrate that is held by said substrate holder and rotated by said substrate rotator; and
a gas feeding supply source connected to said gas jet nozzle for feeding a drying gas to said gas jet nozzle.

3. A substrate processing apparatus comprising:
a substrate holder that holds a substrate in a horizontal posture;
a substrate rotator connected to the substrate holder that rotates the substrate held by said substrate holder about a vertical axis;
a discharge nozzle that has an outlet from which a cleaning solution is discharged; and
a nozzle rotating drive that moves the outlet of said discharge nozzle from a first position to a second position, the first position being opposed to a center of the substrate, the second position being opposed to a circumferential edge of the substrate, wherein
said nozzle rotating drive stops the movement of the outlet discharging the cleaning solution at a third position between the first position and the second position and then starts to move the outlet from the third position to the second position after forming a dried core at a center surface of the substrate and then spreading the dried core over a region inside a circumference, wherein a center position of the substrate is a center, and wherein a distance to a position on the substrate surface opposed to the third position is a radius; and further comprising:
a controller configured to control said nozzle rotating drive such that after the outlet of said discharge nozzle has started to move from a position opposed to a center of the substrate toward a circumferential edge of the substrate, before drying at the center portion of the substrate is started, wherein a center position of the substrate is a center and wherein a distance to a position on the substrate surface opposed to the outlet of said discharge nozzle is a radius, the outlet of said discharge nozzle is once stopped, and after drying has started in a small region the outlet of said discharge nozzle is moved again toward the circumferential edge of the substrate,
wherein said controller is further configured to control said nozzle rotating drive such that the movement of the outlet of said discharge nozzle is once stopped after the outlet of said discharge nozzle has started to move from the position opposed to the center of the substrate toward the circumferential edge of the substrate and before drying at the center of the substrate is started, and
the outlet of said discharge nozzle is moved again toward the circumferential edge of the substrate after drying has started, by a centrifugal force causing the cleaning solution, which the surface of the substrate is covered with, to flow in a region inside a circumference defined by the center of the substrate as the center and by a distance to a position on the substrate surface opposed to the outlet of said discharge nozzle as a radius.

4. The substrate processing apparatus according to claim 2 , wherein said gas jet nozzle is mounted on a gas jet rotating drive which is arranged separately from said nozzle rotating drive.

Assignees

• Screen Holdings Co Ltd

Inventors

• Goto Tomohiro
• Sanada Masakazu
• Shigemori Kazuhito
• Tamada Osamu
• Yasuda Shuichi

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0408

  for drying · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title