Device including interposer between semiconductor and substrate

Patent metadata

Field	Value
Publication number	US-9686864-B2
Application number	US-201214417821-A
Country	US
Kind code	B2
Filing date	Jul 31, 2012
Priority date	Jul 31, 2012
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.

First claim

What is claimed is:

1. A device comprising:
a semiconductor;
a substrate; and
an interposer attached between the semiconductor and the substrate, wherein the interposer has a lower Young's modulus than the semiconductor and the interposer has a lower Young's modulus than the substrate to absorb stresses between the semiconductor and the substrate, wherein the interposer has a Young's modulus of less than 10 mega-pascals.

2. The device of claim 1 , wherein the interposer adheres to the semiconductor via a first adhesive and the interposer adheres to the substrate via a second adhesive.

3. The device of claim 2 , wherein the interposer is thicker than the first adhesive and the interposer is thicker than the second adhesive.

4. The device of claim 1 , wherein the interposer has a smaller footprint than the semiconductor.

5. The device of claim 1 , wherein the interposer is a preformed sheet of at least one of a polymer with viscoelasticity, a rubber, a silicone film, and a urethane film.

6. The device of claim 1 , wherein the interposer is attached between the semiconductor and the substrate via at least one of a medium modulus adhesive and a film adhesive.

7. A system comprising:
a MEMS having a first surface;
a substrate having a second surface; and
an interposer attached to the first surface via a first adhesive and to the second surface via a second adhesive, wherein the interposer is thicker than the first adhesive and the second adhesive and the interposer has a lower Young's modulus than the semiconductor and the interposer has a lower Young's modulus than the substrate to absorb stresses between the semiconductor and the substrate, wherein the interposer has a Young's modulus of less than 10 mega-pascals.

8. The system of claim 7 , wherein the interposer is attached to at least one of the first surface and the second surface via at least one of a medium modulus adhesive and a film adhesive.

9. A method of assembling a device comprising:
providing a semiconductor;
providing a substrate;
attaching an interposer between the semiconductor and the substrate, the interposer having a lower Young's modulus than the semiconductor and the interposer having a lower Young's modulus than the substrate to absorb stresses between the semiconductor and the substrate, wherein the interposer has a Young's modulus of less than 10 mega-pascals.

10. The method of claim 9 , wherein attaching an interposer comprises:
adhering the interposer to the semiconductor via a first adhesive that is thinner than the interposer; and
adhering the interposer to the substrate via a second adhesive that is thinner than the interposer.

11. The method of claim 9 , wherein attaching an interposer comprises:
attaching the interposer between the semiconductor and the substrate via at least one of a medium modulus adhesive and a film adhesive.

12. The method of claim 9 , wherein attaching an interposer comprises: attaching an interposer having a smaller footprint to a semiconductor having a larger footprint.

Assignees

• Walmsley Robert G
• Zhang Zhuqing
• Wu Jennifer
• Bernard Sheldon A
• Choy Silam J
• Hewlett Packard Development Co Lp

Inventors

• Walmsley Robert G
• Zhang Zhuqing
• Wu Jennifer
• Bernard Sheldon A
• Choy Silam J

Classifications

• H10W72/07352

  changes in structures or sizes · CPC title

• H10W72/321

  Structures or relative sizes of die-attach connectors · CPC title

• H10W72/381

  Auxiliary members · CPC title

• H05K13/0469

  by applying a glue or viscous material · CPC title

• B81B7/0048 Primary

  between the MEMS die and the substrate · CPC title