Microlithographic projection exposure apparatus and method of correcting optical wavefront deformations in such an apparatus

Patent metadata

Field	Value
Publication number	US-9684251-B2
Application number	US-201615056085-A
Country	US
Kind code	B2
Filing date	Feb 29, 2016
Priority date	Sep 9, 2013
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A microlithographic projection exposure apparatus includes a correction device configured to correct optical wavefront deformations. The correction device includes first and second optical elements and a drive mechanism configured to move the first and second optical elements between a first arrangement and a second arrangement. In the first arrangement the first optical element is an inner optical element having at least a portion that is arranged in a projection light path, and the second optical element is an outer optical element that is arranged completely outside the projection light path. In the second arrangement the second optical element is the inner optical element, and the first optical element is the outer optical element. The correction device further includes a temperature control device configured to modify a temperature distribution in the outer optical element.

First claim

What is claimed is:

1. An apparatus, comprising:
a mask stage configured to hold a mask;
an illumination system configured to illuminate the mask with projection light;
a substrate stage configured to hold a substrate supporting a light sensitive surface;
a projection objective configured to image at least a portion of the mask illuminated by the projection light onto the light sensitive surface; and
a correction device, comprising:
a first optical element;
a second optical element;
a drive mechanism configured to move the first and second optical elements between a first arrangement and a second arrangement; and
a temperature control device,

wherein:
in the first arrangement, the first optical element is an inner optical element having at least a portion in a projection light path, and the second optical element is an outer optical element completely outside the projection light path;
in the second arrangement, the second optical element is the inner optical element having at least a portion in the projection light path, and the first optical element is the outer optical element completely outside the projection light path; and
the temperature control device is configured to modify a temperature distribution in the outer optical element.

2. The apparatus of claim 1 , wherein the drive mechanism is configured such that the inner optical element is spaced apart by less than 50 mm from the mask along an optical axis of the projection objective.

3. The apparatus of claim 1 , wherein:
the mask stage is configured to displace the mask along a scan direction;
the substrate stage is configured to displace the substrate synchronously with the mask; and
the drive mechanism is configured to displace the inner optical element synchronously with the mask.

4. The apparatus of claim 3 , wherein the drive mechanism is configured to be mechanically coupled to the mask stage.

5. The apparatus of claim 1 , wherein the temperature control device comprises:
a cooling unit configured to cool the outer optical element; and
a heating unit configured to heat portions of the outer optical element to generate a variable temperature distribution in the outer optical element.

6. The apparatus of claim 5 , wherein the heating unit comprises a radiation source configured to direct heating radiation on the outer optical element.

7. The apparatus of claim 1 , wherein:
the first and second optical elements comprise plates;
the plates have plane and parallel refractive surface; and
the plates comprise material that is transparent to the projection light.

8. The apparatus of claim 1 , further comprising:
a sensor configured to output measurement signals; and
a control unit configured to produce control signals for the temperature control device depending on the measurement signals output by the sensor.

9. The apparatus of claim 8 , wherein the light-sensitive material comprises a resist material, and the sensor is configured to measure a thickness of the resist material at a plurality of points.

10. The apparatus of claim 8 , wherein the sensor is configured to measure a position of a plurality of points on the mask.

11. The apparatus of claim 1 , wherein the correction device is configured to correct optical wavefront deformations.

12. An apparatus, comprising:
a projection objective configured to image at least a portion of an object plane onto an image plane surface; and
a correction device upstream of the projection objective in a projection light path, the correction device comprising:
a first optical element;
a second optical element;
a drive mechanism configured to move the first and second optical elements between a first arrangement and a second arrangement; and
a temperature control device,

wherein:
in the first arrangement, at least a portion the first optical element is in the projection light path, and the second optical element is completely outside the light path;
in the second arrangement, at a portion of the second optical element is in the projection light path, and the first optical element is completely outside the projection light path;
the temperature control device is configured to modify a temperature distribution a first member that is at least partially in the projection light path; and
the first member is selected from the group consisting of the first optical element and the second optical element.

13. The apparatus of claim 12 , wherein the drive mechanism is configured such that the member is spaced apart by less than 50 mm from the object plane along an optical axis of the projection objective.

14. The apparatus of claim 12 , wherein:
a second member is selected from the group consisting of the first optical element and the second optical element;
the second member is different from the first member; and
the temperature control device comprises:
a cooling unit configured to cool the second member; and
a heating unit configured to heat portions of the second member to generate a variable temperature distribution in the second members.

15. The apparatus of claim 14 , wherein the heating unit comprises a radiation source configured to direct heating radiation on the second member.

16. The apparatus of claim 12 , wherein the correction device is configured to correct optical wavefront deformations.

17. A method, comprising:
a) modifying a temperature distribution in a first optical element while it is arranged outside a projection light path of the microlithographic projection exposure apparatus;
b) moving the first optical element into the projection light path;
c) illuminating a mask with projection light and imaging the mask onto a light sensitive surface;
d) during c), modifying a temperature distribution in a second optical element while it is arranged outside the projection light path; and
e) after c), removing the first optical element from the projection light path and moving the second optical element into the projection light path.

18. The method of claim 17 , wherein the method corrects optical wavefront deformations in the microlithographic projection exposure apparatus.

19. The method of claim 17 , wherein, the first and the second optical elements are, while they are arranged in the projection light path, spaced apart by less than 50 mm from the mask along an optical axis of a projection objective of the microlithographic projection exposure apparatus.

20. The method of claim 17 , further comprising, during c), synchronously moving the mask, a substrate supporting a light sensitive surface, and the first optical element.

21. The method of claim 17 , further comprising, during a) and d):
cooling the first and second optical elements, respectively, via a cooling unit; and
heating the first and second optical elements, respectively, via a heating unit,
thereby generating a variable temperature distribution in the first and second optical element, respectively.

22. The method of claim 17 , further comprising:
f) repeating c).

23. The method of claim 22 , further comprising:
g) during f), repeating a);
h) after f), removing the second optical element from the projection light path;
i) repeating b) and c); and
j) repeating d) to i) n times,
wherein n is a positive integer.

24. The method of claim 22 , further comprising:
g) during f), modifying a temperature distribution in a third optical element while it is arranged outside the projection l

Assignees

• Zeiss Carl Smt Gmbh

Inventors

• Holzmann Joerg
• Weiss Robert
• Gruner Toralf

Classifications

• G03F7/70891 Primary

  Temperature · CPC title

• G03F7/70308

  Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift · CPC title

• G03F7/70808

  Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus · CPC title