Apparatuses and methods utilizing etch stop layers

Patent metadata

Field	Value
Publication number	US-9683295-B2
Application number	US-201615163214-A
Country	US
Kind code	B2
Filing date	May 24, 2016
Priority date	Mar 20, 2014
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

Provided herein is an apparatus, including a substrate; an etch stop layer overlying the substrate, wherein the etch stop layer is substantially resistant to etching conditions; and a patterned layer overlying the etch stop layer, wherein the patterned layer is substantially labile to the etching conditions, and wherein the patterned layer comprises a number of features including substantially consistent feature profiles among regions of high feature density and regions of low feature density.

First claim

What is claimed is:

1. A method comprising:
overlaying a patterned mask on an etchable layer, wherein the etchable layer overlies an etch stop layer, and wherein the etch stop layer overlies a substrate, wherein each pattern of the patterned mask corresponds to a feature of a plurality of features, and wherein the etch stop layer is substantially resistant to etching conditions and the etchable layer is substantially labile to the etching conditions, and wherein the etch stop layer is porous and is configured to pass gas through; and
etching the plurality of features into the etchable layer down to the etch stop layer to form a template,
wherein the etch stop layer is selected from a group consisting of transparent material to radiation and a thermally conductive material to radiation.

2. The method of claim 1 further comprising:
bringing the template in contact with a device, wherein the device comprises a resist deposited thereon, and wherein the etch stop layer is configured to pass gas trapped between the template and a device; and
curing the resist.

3. The method of claim 2 , wherein the resist is a photoresist, and wherein curing the resist comprises:
applying ultraviolet (UV) light to cure the resist.

4. The method of claim 2 , wherein the resist is a heat curable thermal resist, and wherein curing the resist comprises:
applying thermal radiation to cure the resist.

5. The method of claim 1 further comprising:
removing the patterned mask.

6. The method of claim 1 , wherein the etchable layer is substantially labile to fluorine-based etching, and wherein the etching conditions are fluorine-based etching conditions.

7. The method of claim 1 , wherein the etchable layer is selected from a group consisting of SiO 2 , glass, chromium, and quartz.

8. The method of claim 1 , wherein the etch stop layer is selected from a group consisting of silicon, carbide-derived carbon, tunable nanoporous carbon, a covalent organic framework, and a metal nano-foam.

9. The method of claim 1 , wherein the substrate is selected from a group consisting of transparent material to radiation and thermally conductive material to radiation.

10. The method of claim 1 , wherein the plurality of features comprises substantially consistent feature depths among regions of high feature density and regions of low feature density.

11. The method of claim 1 , wherein the etch stop layer is less than or equal to 10 nm thick.

12. A method comprising:
overlaying a patterned mask on an etchable layer, wherein the etchable layer overlies an etch stop layer, and wherein the etch stop layer overlies a substrate, wherein each pattern of the patterned mask corresponds to a feature of a plurality of features, and wherein the etch stop layer is substantially resistant to etching conditions and the etchable layer is substantially labile to the etching conditions; and
etching the plurality of features into the etchable layer down to the etch stop layer to form a template, and wherein the etch stop layer reduces a separation force between the template and a resist deposited on a device when the template becomes in contact with the device by overcoming a partial vacuum created between the template and the device.

13. The method of claim 12 further comprising:
bringing the template in contact with the device; and
curing the resist.

14. The method of claim 13 , wherein the resist is a photoresist, and wherein curing the resist comprises:
applying ultraviolet (UV) light to cure the resist.

15. The method of claim 13 , wherein the resist is a heat curable thermal resist, and wherein curing the resist comprises:
applying thermal radiation to cure the resist.

16. The method of claim 12 further comprising:
removing the patterned mask.

17. The method of claim 12 , wherein the etchable layer is substantially labile to fluorine-based etching, and wherein the etching conditions are fluorine-based etching conditions.

18. The method of claim 12 , wherein the etchable layer is selected from a group consisting of SiO 2 , glass, chromium, and quartz.

19. The method of claim 12 , wherein the etch stop layer is selected from a group consisting of silicon, carbide-derived carbon, tunable nanoporous carbon, a covalent organic framework, and a metal nano-foam.

20. The method of claim 12 , wherein the etch stop layer is selected from a group consisting of transparent material to radiation and a thermally conductive material to radiation.

21. The method of claim 12 , wherein the substrate is selected from a group consisting of transparent material to radiation and thermally conductive material to radiation.

22. The method of claim 12 , wherein the plurality of features comprises substantially consistent feature depths among regions of high feature density and regions of low feature density.

23. The method of claim 12 , wherein the etch stop layer is less than or equal to 10 nm thick.

24. A method comprising:
overlaying a patterned mask on an etchable layer, wherein the etchable layer overlies an etch stop layer, and wherein the etch stop layer overlies a substrate, wherein each pattern of the patterned mask corresponds to a feature of a plurality of features, and wherein the etch stop layer is substantially resistant to etching conditions and the etchable layer is substantially labile to the etching conditions, and wherein the etch stop layer is porous and is configured to pass gas through, wherein the substrate is selected from a group consisting of transparent material to radiation and thermally conductive material to radiation; and
etching the plurality of features into the etchable layer down to the etch stop layer to form a template.

Assignees

• Seagate Technology Llc

Inventors

• Feldbaum Michael R
• Wago Koichi
• Gauzner Gennady
• Lee Kim Y
• Kuo David S

Classifications

• G03F7/2002

  with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image · CPC title

• B29D17/00

  Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records (recording sound or other information using formed grooves or the equivalent G11B); Producing record discs from master stencils · CPC title

• G03F7/09

  characterised by structural details, e.g. supports, auxiliary layers (supports for printing plates in general B41N) · CPC title

• C23F1/00 Primary

  Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) · CPC title

• B29K2909/00

  Use of inorganic materials not provided for in groups B29K2803/00 - B29K2807/00, as mould material · CPC title