Part design geometry for stenciling epoxies through orifices in film adhesive

Patent metadata

Field	Value
Publication number	US-9682589-B2
Application number	US-201514599920-A
Country	US
Kind code	B2
Filing date	Jan 19, 2015
Priority date	Jan 19, 2015
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.

First claim

What is claimed is:

1. A print head, comprising:
a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles;
an array of transducers in contact with the jet stack opposite the nozzle plate;
an adhesive layer adhered to the array of transducers, the adhesive layer having a first height, openings adjacent the transducers, and vent regions adjacent the openings, the vent regions formed from regions of the adhesive layer having a height less than the first height; and
a conductive paste in the openings of the adhesive layer in contact with the transducers.

2. The print head of claim 1 , further comprising a coverlay attached to the adhesive layer such that the regions having a height less than the first height form gaps between the adhesive layer and the coverlay, the coverlay having openings corresponding to the openings in the adhesive layer.

3. The print head of claim 1 , further comprising a flex circuit attached to the adhesive layer, wherein the conductive paste forms an electrical connection between the transducers and the flex circuit.

4. The print head of claim 3 , wherein the flex circuit attaches to the adhesive layer by a coverlay, the coverlay having openings corresponding to the openings in the adhesive layer.

5. The print head of claim 1 , wherein the conductive paste comprises silver epoxy.

6. The print head of claim 1 , wherein the height less than a first height is half the height of the first height.

Assignees

• Xerox Corp

Inventors

• Freitag Chad D
• Luy Chanthy
• Schultz Samuel V
• Jones Garry A

Classifications

• B41N1/24 Primary

  Stencils; Stencil materials; Carriers therefor (stencilling apparatus for office or other commercial use B41L13/00) · CPC title

• B41J2/14 Primary

  Structure thereof {only for on-demand ink jet heads} · CPC title

• B32B2255/00

  Coating on the layer surface · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B41J2/1623

  bonding and adhesion · CPC title