Part design geometry for stenciling epoxies through orifices in film adhesive

Patent metadata

Field	Value
Publication number	US-10377133-B2
Application number	US-201715605706-A
Country	US
Kind code	B2
Filing date	May 25, 2017
Priority date	Jan 19, 2015
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

A method of manufacturing a print head includes forming a jet stack, the jet stack including a nozzle plate having an array of nozzles, attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle, adhering an adhesive layer to the array of transducers, forming opening in the adhesive layer, each opening adjacent a transducer in the array of transducers, partially removing the adhesive layer in regions adjacent the openings, such that the adhesive layer is less thick in the regions adjacent the openings than in other regions, and filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the regions of the adhesive layer with less thickness adjacent the openings.

First claim

What is claimed is:

1. A method of manufacturing a print head, comprising:
forming a jet stack, the jet stack including a nozzle plate having an array of nozzles;
attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle;
adhering an adhesive layer to the array of transducers;
forming openings completely through the adhesive layer, each opening adjacent a transducer in the array of transducers;
forming vent regions connected to the openings, such that the vent regions have a lower height than other regions in the adhesive layer; and
filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the vent regions of the adhesive layer.

2. The method of claim 1 , further comprising attaching a coverlay to the adhesive layer prior to filling the openings with conductive material.

3. The method of claim 1 , wherein forming the openings in the adhesive layer comprises forming the openings before the adhesive layer is adhered to the array of transducers.

4. The method of claim 1 , wherein forming the openings in the adhesive layer comprises forming the openings after the adhesive layer is adhered to the array of transducers.

5. The method of claim 1 , wherein forming the openings in the adhesive layer comprises one of laser ablation, cutting, punching or etching.

6. The method of claim 1 , wherein forming the vent regions in the adhesive layer comprises one of etching or laser ablation.

7. The method of claim 1 , wherein filling the openings with conductive material comprises filling the openings with conductive paste.

8. The method of claim 1 , wherein filling the openings with conductive material comprises:
applying a stencil to the adhesive layer;
using the stencil to apply conductive material to the openings; and
removing the stencil.

9. The method of claim 8 , wherein applying the stencil to the adhesive layer comprises applying the stencil to the adhesive layer through a coverlay.

10. The method of claim 8 , wherein using the stencil to apply conductive material to the openings comprises using a doctor blade to distribute the conductive material.

11. The method of claim 1 , further comprising attaching a flex circuit to the adhesive layer such that the conductive material forms electrical connections between the array of transducers and the flex circuit.

Assignees

• Xerox Corp

Inventors

• Freitag Chad D
• Luy Chanthy
• Schultz Samuel V
• Jones Garry A

Classifications

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B41J2/16

  Production of nozzles · CPC title

• B32B3/18

  characterised by an internal layer formed of separate pieces of material {which are juxtaposed side-by-side (B32B5/02 takes precedence)} · CPC title

• B32B2307/202

  Conductive · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title