Composite polishing pad and method for making the same

US9682457B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9682457-B2
Application numberUS-201414500227-A
CountryUS
Kind codeB2
Filing dateSep 29, 2014
Priority dateOct 1, 2013
Publication dateJun 20, 2017
Grant dateJun 20, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for making a composite polishing pad, comprising the following steps: (a) forming a first resin coating on a release paper; (b) pre-baking the first resin coating at a first temperature of 40° C. to 130° C. to a semi-ripening state; (c) forming a second resin coating on the semi-ripened first resin coating, so that the second resin coating directly contacts with the semi-ripened first resin coating; (d) drying the first resin coating and the second resin coating at a second temperature of 100° C. to 140° C., so that the first resin coating becomes a cushion layer and the second resin coating becomes a polishing layer, wherein the second temperature is higher than the first temperature, the cushion layer has a hardness of 10 to 70 shore D, and the polishing layer has a hardness of 30 to 90 Shore D; and (e) removing the release paper to form a composite polishing pad, wherein the composite polishing pad comprises the cushion layer and the polishing layer. 2. The method of claim 1 , wherein in the step (a), the first resin coating comprises a first polymeric elastomer and a first solvent, the first polymeric elastomer comprises a first ingredient and a second ingredient, the first ingredient has a hydroxyl group, an amino group, a mixture thereof or an oligomer thereof, and the second ingredient has a diisocyanate group; in the step (b), a part or all of the first solvent is volatilized, so that the first resin coating becomes a jellylike state; in the step (c), the second resin coating comprises a second polymeric elastomer and a second solvent, the second polymeric elastomer comprises a first ingredient and a second ingredient, the first ingredient has a hydroxyl group, an amino group, a mixture thereof or an oligomer thereof, and the second ingredient has a diisocyanate group; and in the step (d), the cushion layer and the polishing layer are combined through chemical bonding. 3. The method of claim 1 , wherein in the step (a), the release paper is a continuous release paper and is continuously provided; after the step (d) or the step (e), a cutting step is further performed to form a plurality of composite polishing pads.

Assignees

Inventors

Classifications

  • without embedded abrasive particles (B24D11/005 takes precedence) · CPC title

  • B24B37/22Primary

    characterised by a multi-layered structure · CPC title

  • characterised by the composition or properties of the pad materials · CPC title

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Frequently asked questions

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What does patent US9682457B2 cover?
The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 s…
Who is the assignee on this patent?
San Fang Chemical Ind Co Ltd
What technology area does this patent fall under?
Primary CPC classification B24B37/22. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 20 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).