Method for producing layered polishing pads
US-2015336234-A1 · Nov 26, 2015 · US
US9682457B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9682457-B2 |
| Application number | US-201414500227-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2014 |
| Priority date | Oct 1, 2013 |
| Publication date | Jun 20, 2017 |
| Grant date | Jun 20, 2017 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.
Opening claim text (preview).
What is claimed is: 1. A method for making a composite polishing pad, comprising the following steps: (a) forming a first resin coating on a release paper; (b) pre-baking the first resin coating at a first temperature of 40° C. to 130° C. to a semi-ripening state; (c) forming a second resin coating on the semi-ripened first resin coating, so that the second resin coating directly contacts with the semi-ripened first resin coating; (d) drying the first resin coating and the second resin coating at a second temperature of 100° C. to 140° C., so that the first resin coating becomes a cushion layer and the second resin coating becomes a polishing layer, wherein the second temperature is higher than the first temperature, the cushion layer has a hardness of 10 to 70 shore D, and the polishing layer has a hardness of 30 to 90 Shore D; and (e) removing the release paper to form a composite polishing pad, wherein the composite polishing pad comprises the cushion layer and the polishing layer. 2. The method of claim 1 , wherein in the step (a), the first resin coating comprises a first polymeric elastomer and a first solvent, the first polymeric elastomer comprises a first ingredient and a second ingredient, the first ingredient has a hydroxyl group, an amino group, a mixture thereof or an oligomer thereof, and the second ingredient has a diisocyanate group; in the step (b), a part or all of the first solvent is volatilized, so that the first resin coating becomes a jellylike state; in the step (c), the second resin coating comprises a second polymeric elastomer and a second solvent, the second polymeric elastomer comprises a first ingredient and a second ingredient, the first ingredient has a hydroxyl group, an amino group, a mixture thereof or an oligomer thereof, and the second ingredient has a diisocyanate group; and in the step (d), the cushion layer and the polishing layer are combined through chemical bonding. 3. The method of claim 1 , wherein in the step (a), the release paper is a continuous release paper and is continuously provided; after the step (d) or the step (e), a cutting step is further performed to form a plurality of composite polishing pads.
without embedded abrasive particles (B24D11/005 takes precedence) · CPC title
characterised by a multi-layered structure · CPC title
characterised by the composition or properties of the pad materials · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.