Nonwoven abrasive articles and methods of making the same
US-2025041997-A1 · Feb 6, 2025 · US
without embedded abrasive particles (B24D11/005 takes precedence)
without embedded abrasive particles (B24D11/005 takes precedence) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24D11/003 |
| Official title | {without embedded abrasive particles (B24D11/005 takes precedence)} |
| Display label | without embedded abrasive particles (B24D11/005 takes precedence) |
| Total patents | 48 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 11 |
| 2017 | 3 |
| 2018 | 3 |
| 2020 | 1 |
| 2021 | 7 |
| 2022 | 4 |
| 2023 | 4 |
| 2024 | 5 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Conformable abrasive article
US-2025018536-A1 · Jan 16, 2025 · US
Pdc cutter with unique microstructure
US-2024425736-A1 · Dec 26, 2024 · US
Conformable abrasive article
US-12128526-B2 · Oct 29, 2024 · US
Unique PDC microstructure and the method of making it
US-12104111-B2 · Oct 1, 2024 · US
Composite polishing pad including highly abrasion-resistant thin film coating bound with carbon nanotubes, and method for producing same
US-2024217056-A1 · Jul 4, 2024 · US
Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
US-11931856-B2 · Mar 19, 2024 · US
Unique pdc microstructure and the method of making it
US-2023287251-A1 · Sep 14, 2023 · US
Multi dispense head alignment using image processing
US-11738517-B2 · Aug 29, 2023 · US
Porous polyurethane polishing pad and process for preparing the same
US-11642752-B2 · May 9, 2023 · US
Polishing pad for wafer polishing device, and apparatus and method for manufacturing same
US-2023040654-A1 · Feb 9, 2023 · US
Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
US-11400559-B2 · Aug 2, 2022 · US
Pitch layer pad for smoothing optical surfaces
US-2022212314-A1 · Jul 7, 2022 · US
Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
US-2022152776-A1 · May 19, 2022 · US
Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
US-11298795-B2 · Apr 12, 2022 · US
Multi dispense head alignment using image processing
US-2021394454-A1 · Dec 23, 2021 · US
Porous polyurethane polishing pad and process for preparing the same
US-2021229237-A1 · Jul 29, 2021 · US
Polishing pad with adjusted crosslinking degree and process for preparing the same
US-2021129284-A1 · May 6, 2021 · US
Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
US-2021129285-A1 · May 6, 2021 · US
Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
US-2021122006-A1 · Apr 29, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24D11/003?
- CPC B24D11/003 is the Cooperative Patent Classification code for “without embedded abrasive particles (B24D11/005 takes precedence).”
- How many patents are filed under CPC B24D11/003 (without embedded abrasive particles (B24D11/005 takes precedence))?
- Our database includes 48 publications tagged with this CPC code.
- Is patent activity under CPC B24D11/003 growing?
- Publication counts under this code: 5 in 2024 vs 2 in 2025 (latest complete years).