Gas-blowing-hole array structure and soldering apparatus
US-2015382482-A1 · Dec 31, 2015 · US
US9681557B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9681557-B2 |
| Application number | US-201414292397-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 30, 2014 |
| Priority date | May 30, 2014 |
| Publication date | Jun 13, 2017 |
| Grant date | Jun 13, 2017 |
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A heating apparatus includes a gas supply for providing a base gas, a generator configured to excite the base gas to produce a metastable gas mixture that includes a metastable gas, and a housing. The housing includes a wall shaped to contain the metastable gas mixture and selectively enclose a reactive element of a target component. Interaction between the metastable gas and at least one of a coupling material and the reactive element transfers energy to selectively heat the at least one of the coupling material and the target component.
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What is claimed is: 1. A heating apparatus, comprising: a gas supply for providing a base gas; a generator configured to excite the base gas to produce a metastable gas mixture that includes a metastable gas; and a housing including a wall shaped to contain the metastable gas mixture and selectively enclose a reactive element of a target component, wherein interaction between the metastable gas and at least one of a coupling material and the reactive element transfers energy to selectively heat the at least one of the coupling material and the target component, wherein the reactive element is at least partially metallic. 2. The apparatus of claim 1 , wherein the housing comprises a nozzle. 3. The apparatus of claim 1 , further comprising an actuator configured to move the target component relative to the housing. 4. The apparatus of claim 1 , wherein the target component includes a substrate and an electronic component. 5. The apparatus of claim 4 , wherein the substrate includes a contact and the electronic component includes a lead. 6. The apparatus of claim 5 , wherein the reactive element includes a coupling material positioned along at least one of the contact and the lead. 7. The apparatus of claim 6 , further comprising a removal device configured to interface with the electronic component and apply a tensile force to the coupling material such that the electronic component is separated from the substrate as the coupling material reaches a threshold temperature. 8. An apparatus for heating reactive elements, comprising: a gas supply for providing a base gas; a generator configured to excite the base gas from the gas supply to produce a metastable gas mixture that includes a metastable gas; a housing shaped to contain the metastable gas and a target component; a flow device positioned within the housing, the flow device configured to vary a thermal-spatial delivery profile of the metastable gas mixture; and a nonreactive material disposed along the target component to define a covered portion and an exposed portion, wherein interaction between the metastable gas mixture and the exposed portion transfers energy to selectively heat the target component. 9. The apparatus of claim 8 , further comprising a processing circuit configured to disengage the generator upon receiving an event signal. 10. The apparatus of claim 9 , further comprising a timer module configured to produce the event signal after a predetermined period of time. 11. The apparatus of claim 9 , further comprising a sensor configured to provide sensor signals to the processing circuit. 12. The apparatus of claim 11 , further comprising a sensor module configured to produce the event signal as the sensor signals exceed a threshold value. 13. The apparatus of claim 12 , wherein the sensor is a temperature sensor. 14. The apparatus of claim 13 , wherein the threshold value is related to a temperature of the exposed portion. 15. The apparatus of claim 8 , further comprising a processing circuit configured to disengage the gas supply upon receiving an event signal. 16. The apparatus of claim 8 , further comprising a secondary gas supply selectively coupled to the housing with a valve. 17. The apparatus of claim 16 , further comprising a processing circuit configured to open the valve upon receiving an event signal thereby at least one of diluting and dispersing the metastable gas mixture. 18. The apparatus of claim 8 , wherein the flow device is a diffuser. 19. The apparatus of claim 18 , wherein the diffuser is shaped to uniformly distribute the metastable gas mixture across the target component. 20. An apparatus for heating reactive elements, comprising: a gas supply for providing a base gas; a generator configured to excite the base gas from the gas supply to produce a metastable gas mixture that includes a metastable gas; a conduit having a movable exit port, wherein the movable exit port is shaped to direct the metastable gas mixture toward a reactive element of a target component, interaction between the metastable gas mixture and the reactive element transferring energy to selectively heat the target component; and an actuator coupled to the conduit and configured to move the movable exit port relative to the target component. 21. The apparatus of claim 20 , wherein the conduit comprises a movable arm having a plurality of joints. 22. The apparatus of claim 20 , wherein the conduit comprises a flexible hose. 23. The apparatus of claim 20 , further comprising a cooling element configured to decrease the temperature of the target component. 24. The apparatus of claim 23 , wherein the cooling element is positioned along the target component. 25. The apparatus of claim 23 , wherein the cooling element comprises a nonreactive material configured to isolate the cooling element from the metastable gas. 26. The apparatus of claim 23 , further comprising a nonreactive coating disposed over at least a portion of the cooling element. 27. The apparatus of claim 20 , further comprising a nonreactive material disposed along at least a portion of the target component, the nonreactive material configured to reduce interaction between the metastable gas and a covered portion of the target component. 28. The apparatus of claim 27 , wherein the nonreactive material includes a ceramic material. 29. The apparatus of claim 27 , wherein the nonreactive material includes a polymeric material. 30. The apparatus of claim 20 , further comprising a sensor configured to provide a sensing signal that relates to a concentration of the metastable gas. 31. The apparatus of claim 30 , wherein the sensor comprises a thermocouple having an end disposed within a flow of the metastable gas mixture. 32. The apparatus of claim 30 , further comprising a controller configured to adjust the generator based on the sensing signal.
Soldering of electronic components · CPC title
Protecting a component during manufacturing · CPC title
Heating processes for reflow soldering · CPC title
Using a reactive gas · CPC title
Soldering with the use of hot gas · CPC title
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