Composition set, conductive substrate and method of producing the same, and conductive adhesive composition

Patent metadata

Field	Value
Publication number	US-9676969-B2
Application number	US-201214236343-A
Country	US
Kind code	B2
Filing date	Jul 30, 2012
Priority date	Aug 3, 2011
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.

First claim

The invention claimed is:

1. A kit comprising:
a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and
a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 500 nm.

2. The kit according to claim 1 , wherein the inorganic particles comprising the metallic oxide are at least one selected from the group consisting of copper oxide particles and core-shell particles having a core of metallic copper and a shell of copper oxide.

3. The kit according to claim 1 , wherein the conductive particles comprise at least one selected from the group consisting of copper, copper oxide, cuprous oxide, gold, gold oxide, platinum, platinum oxide, silver, silver oxide, palladium, palladium oxide, rhodium, rhodium oxide, nickel and nickel oxide.

4. The kit according to claim 1 , wherein the binder is an organic binder, an inorganic binder, or a combination thereof.

5. The kit according to claim 1 , wherein the binder is at least one organic binder selected from the group consisting of an epoxy resin, a polyimide resin, a polyamide resin, a polyamide-imide resin, a phenolic resin, an isocyanate resin, an acrylic resin, a resol resin, a siloxane resin and precursor compounds of these.

6. The kit according to claim 1 , wherein the binder is at least one inorganic binder selected from the group consisting of silicon oxide, titanium oxide, zircon oxide, tungsten oxide, zinc oxide, chromium oxide and precursor compounds of these.

7. The kit according to claim 1 , wherein the conductive particles having a number average particle size of from 1 nm to 100 nm.

8. The kit according to claim 1 , wherein the conductive particles having a number average particle size of from 10 nm to 500 nm.

9. The kit according to claim 1 , wherein the conductive particles having a number average particle size of from 50 nm to 500 nm.

10. The kit according to claim 1 , wherein the conductor layer-forming composition is a liquid.

11. The kit according to claim 1 , wherein the conductor layer-forming composition consists essentially of the dispersing medium and the inorganic particles comprising a metallic oxide.

12. The kit according to claim 1 , wherein the conductor layer-forming composition consists essentially of the dispersing medium, the inorganic particles comprising a metallic oxide and, optionally, a surface tension adjuster, a thixotropy imparting agent, a thickener, and a reducing agent.

13. A conductive substrate made using the kit according to claim 1 , comprising:
a substrate having a conductive film;
a conductive adhesive layer provided on the conductive film, the conductive adhesive layer being a cured product of the conductive adhesive composition; and
a conductor layer provided on the conductive adhesive layer, the conductor layer comprising a metal that is a reduced product of the conductor layer-forming composition.

14. The conductive substrate according to claim 13 , wherein the conductor layer comprises metallic copper.

15. The conductive substrate according to claim 13 , wherein the conductive film comprises at least one selected from the group consisting of aluminum, copper, silver, gold, platinum, nickel, tin, lead, palladium, indium tin oxide (ITO), indium zinc oxide (IZO), zinc tin oxide (ZTO), fluorine-doped tin oxide (FTO), InO 2 , SnO 2 and ZnO.

16. The conductive substrate according to claim 13 , wherein the conductor layer has a volume resistivity of from 1.5×10 −8 Ω·m to 1.0×10 −7 Ω·m, and wherein at least a part of the metal in the conductor layer is bonded by metal bonding with at least some of the conductive particles in the conductive adhesive layer.

17. The conductive substrate according to claim 13 , wherein the average thickness of the conductor layer is 100 nm or more, and the average thickness of the conductive adhesive layer is from 10 nm to 2000 nm.

18. A method of producing the conductive substrate according to claim 13 , the method comprising:
a process of forming a conductive adhesive composition layer by applying, onto a substrate having a conductive film, the conductive adhesive composition;
a process of forming a conductive adhesive layer by curing the binder in the conductive adhesive composition layer;
a process of forming a conductor layer-forming composition layer by applying, onto the conductive adhesive layer, the conductor layer-forming composition; and
a process of forming a conductor layer comprising a metal by reducing the metallic oxide in the conductor layer-forming composition layer.

Assignees

• Nakako Hideo
• Yamamoto Kazunori
• Kumashiro Yasushi
• Yokosawa Shunya
• Noudou Takaaki
• Inada Maki
• Kuroda Kyoko
• Hitachi Chemical Co Ltd

Inventors

• Nakako Hideo
• Yamamoto Kazunori
• Kumashiro Yasushi
• Yokosawa Shunya
• Noudou Takaaki
• Inada Maki
• Kuroda Kyoko

Classifications

• C09J7/0292

  Chemistry & Metallurgy · mapped topic

• C09J9/02 Primary

  Electrically-conducting adhesives · CPC title

• Y10T428/24967

  Absolute thicknesses specified · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title